QCN-6432-0-DRQFN132-TR-01-0 Overview
The QCN-6432-0-DRQFN132-TR-01-0 is a high-pin-count, surface-mount semiconductor package variant designed for automated assembly and compact board integration. The part number encodes a DRQFN132 package style with a 132-pin footprint and a tape-and-reel shipment option for volume pick-and-place. Its format favors dense routing and a low profile, enabling tighter system layouts with more than 100 connection points while supporting factory-friendly tape-and-reel handling. For sourcing and datasheet access see IC 제조업체.
QCN-6432-0-DRQFN132-TR-01-0 Technical Specifications
| Part number | QCN-6432-0-DRQFN132-TR-01-0 |
| Series code | 6432 |
| Package type | DRQFN132 |
| Pin count | 132 |
| Mounting | Surface mount |
| Packaging | Tape & reel (TR) |
| Revision / variant | 01-0 |
| Trailing code | 0 |
| Part-number length | 27 characters |
| Typical assembly format | Reel-ready for SMT lines |
QCN-6432-0-DRQFN132-TR-01-0 Key Features
- High pin density: 132 pins provide greater I/O count for complex systems and denser PCB routing compared with lower-pin packages.
- Low-profile DRQFN package: flat, compact footprint reduces z-height and helps thermal conduction for downstream components.
- Tape-and-reel packaging: supports automated pick-and-place and high-volume assembly, lowering per-unit assembly time and handling cost.
- Clear revision marking: the 01-0 suffix enables traceability through manufacturing and supply-chain processes for version control.
일반적인 애플리케이션
- High-density control boards where a 132-pin surface-mount IC must connect to multiple peripherals while minimizing PCB area and vertical profile.
- Automated SMT production lines requiring tape-and-reel packaging for rapid pick-and-place and consistent feed rates during mass assembly.
- Commercial and industrial modules that need a compact DRQFN footprint to reduce enclosure size while providing more than 100 signal and power pins.
- Prototyping and production runs where revision tracking (01-0) and reel-ready packaging streamline logistics and change management between runs.
QCN-6432-0-DRQFN132-TR-01-0 Advantages vs Typical Alternatives
The DRQFN132 format provides a lower profile and typically smaller board area than comparable QFP or single-row connector solutions while delivering higher pin counts than many QFN variants. With 132 pins and tape-and-reel supply, this configuration trades bulk for integration density and factory readiness. Compared to through-hole or larger-outline packages, it offers faster automated placement and tighter routing for modern compact assemblies.
베스트셀러 제품
QCN-6432-0-DRQFN132-TR-01-0 Brand Info
This listing and its associated ordering code appear in the IC Manufacturer catalog. IC Manufacturer supplies component-level data, packaging formats, and part-number traceability for sourcing teams. The catalog entry presents the part as a reel-ready DRQFN132 option with explicit revision marking for supply-chain control and automated assembly support.
자주 묻는 질문
What does DRQFN132 mean?
DRQFN132 indicates a dual-row or defined QFN-style package with 132 external connections. It denotes a low-profile, surface-mount outline intended for dense PCB integration and automated placement.
🌟 주요 제품
Is this part shipped in reels?
Yes. The TR segment in the part number denotes tape-and-reel packaging, which is standard for high-volume automated pick-and-place operations and reduces handling time on SMT lines.
How many pins are available?
The package provides 132 pins. That pin count supports extensive I/O and power/ground distributions for designs requiring more than one hundred connections in a compact footprint.
📩 문의하기
What does the 01-0 suffix indicate?
그리고 01-0 suffix is a revision or variant code used for traceability and version control. It helps differentiate specific fabrication or assembly variants within the same base part family.
Is this package surface-mount compatible?
Yes. The DRQFN format is designed for surface-mount technology. It is compatible with standard SMT processes and is intended for use with paste printing, pick-and-place, and reflow soldering workflows.
