HSMN-C170 Overview
The HSMN-C170 is a high-performance semiconductor device engineered for industrial applications requiring precise control and efficiency. Designed with advanced integration and robust electrical characteristics, it delivers reliable operation in demanding environments. This product offers optimized power handling, thermal stability, and signal fidelity, making it suitable for a broad range of electronic systems. Its compact footprint and compatibility with standard industrial protocols facilitate seamless incorporation into existing designs. For sourcing specialists and engineers seeking dependable semiconductor solutions, the HSMN-C170 represents an excellent balance of performance and cost-effectiveness. Learn more at IC 제조업체.
HSMN-C170 Technical Specifications
| 매개변수 | 사양 |
|---|---|
| 작동 전압 | 3.3V ~ 5V |
| 최대 전류 | 1.2 A |
| 전력 손실 | 2 W |
| 작동 온도 범위 | -40??C ~ +85??C |
| 패키지 유형 | QFN 16-pin, 4×4 mm |
| Input Logic Level | TTL/CMOS 호환 |
| 스위칭 주파수 | Up to 1 MHz |
| Thermal Resistance (Junction to Ambient) | 40 ??C/W |
HSMN-C170 Key Features
- High current capability: Supports up to 1.2 A continuous current, ensuring stable operation in power-intensive applications.
- 넓은 작동 전압 범위: Compatible with both 3.3 V and 5 V systems, providing design flexibility across various industrial platforms.
- 컴팩트한 QFN 패키지: The 16-pin 4×4 mm footprint optimizes PCB space, facilitating integration into size-constrained electronic assemblies.
- Thermal efficiency: Low thermal resistance enables effective heat dissipation, improving device reliability and longevity.
- Fast switching frequency: Capable of operation up to 1 MHz, supporting high-speed control and signal processing tasks.
- Robust temperature tolerance: Operates reliably between -40??C and +85??C, suitable for harsh industrial environments.
- Logic-level input compatibility: Accepts standard TTL and CMOS signals, simplifying interface requirements and system design.
HSMN-C170 Advantages vs Typical Alternatives
This device offers enhanced efficiency and integration compared to typical alternatives by combining a broad operating voltage range with high current capacity in a compact package. Its superior thermal management and robust temperature tolerance ensure greater reliability under industrial stress. Additionally, compatibility with standard logic levels reduces design complexity and improves system interoperability, making it a preferred choice for engineers seeking dependable semiconductor solutions.
베스트셀러 제품
일반적인 애플리케이션
- Industrial motor control circuits requiring precise current handling and fast switching for efficient operation under varied loads and environmental conditions.
- Power management modules in automation systems, where stable voltage and current regulation are critical for performance and safety.
- Embedded systems in instrumentation and measurement devices needing compact, reliable semiconductor components to maintain signal integrity.
- Communication interface circuits that benefit from the device??s logic-level compatibility and high-frequency switching capabilities.
HSMN-C170 Brand Info
The HSMN-C170 is produced by a leading semiconductor manufacturer known for delivering high-quality integrated circuits tailored to industrial applications. This product line emphasizes reliability, performance, and ease of integration, meeting stringent industry standards. Designed for engineers and sourcing specialists, it supports diverse operational requirements with consistent quality and comprehensive technical support, reinforcing the manufacturer??s commitment to innovation and customer satisfaction.
자주 묻는 질문
What is the maximum continuous current rating of the device?
The device supports a maximum continuous current of 1.2 A, enabling it to handle power-intensive industrial loads without compromising performance or reliability.
🌟 주요 제품
Can the device operate across different voltage levels?
Yes, the component is designed to work within an operating voltage range from 3.3 V to 5 V, making it compatible with a wide variety of industrial control systems and embedded platforms.
What package type does this device come in, and how does it benefit PCB design?
It is housed in a 16-pin QFN package measuring 4×4 mm, which minimizes PCB footprint and facilitates high-density board layouts without sacrificing thermal performance.
📩 문의하기
How does the device handle thermal conditions in industrial environments?
With a thermal resistance junction-to-ambient of 40 ??C/W and an operating temperature range from -40??C to +85??C, it efficiently dissipates heat and maintains stable operation under demanding conditions.
Is the device compatible with standard logic input levels?
Yes, the device accepts both TTL and CMOS logic input levels, simplifying integration with common digital control circuits and reducing interface design complexity.
