BCM4358X3KWBG Wi-Fi 6E Module ?C High-Speed Wireless Connectivity, Bulk Tray Package

  • Provides advanced wireless connectivity, improving network speed and reliability for seamless data transmission.
  • Supports multiple frequency bands, enabling flexible deployment in diverse wireless environments.
  • Features a compact package type that optimizes board space and simplifies integration into tight layouts.
  • Ideal for embedded systems requiring stable Wi-Fi performance, enhancing user experience in IoT applications.
  • 様々な条件下で安定した動作を保証するため、厳格な品質管理で製造されています。
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产品上方询盘

BCM4358X3KWBG Overview

The BCM4358X3KWBG is a high-performance wireless communication module designed for robust connectivity in demanding industrial and consumer applications. Engineered to support advanced Wi-Fi standards, this solution integrates multiple antennas and advanced radio technologies, ensuring reliable, high-throughput data transmission. Its compact form factor and efficient power management make it ideal for embedded systems requiring seamless network integration. Sourcing specialists and engineers benefit from its proven interoperability and flexible interface options, streamlining device development cycles. For more detailed product insights, please visit ICメーカー.

BCM4358X3KWBG Technical Specifications

パラメータ仕様
Wi-Fi Standards Supported802.11ax (Wi-Fi 6), 802.11ac, 802.11n
周波数帯2.4 GHz and 5 GHz dual-band operation
Maximum Data RateUp to 2.4 Gbps
Number of Spatial Streams3×3 MIMO (Multiple Input Multiple Output)
インターフェース・タイプPCI Express (PCIe) Gen 3
電源電圧3.3 V nominal
動作温度範囲-40度~85度
パッケージタイプCompact BGA (Ball Grid Array) package
セキュリティ機能WPA3, WPA2 Enterprise, Enhanced Open
消費電力Optimized for low power operation in active and idle states

BCM4358X3KWBG Key Features

  • 3×3 MIMO architecture: Enables simultaneous transmission and reception of three data streams, significantly enhancing wireless throughput and coverage, critical for high-density environments.
  • Dual-band support: Operates across both 2.4 GHz and 5 GHz frequency bands, providing flexibility to navigate congested networks and optimize connection stability.
  • PCIe Gen 3 interface: Offers high-speed data communication with host processors, facilitating fast integration and minimal latency in host systems.
  • Advanced security protocols: Incorporates WPA3 and WPA2 Enterprise standards to ensure robust data protection and compliance with modern network security requirements.
  • 低消費電力: Designed with power efficiency in mind, reducing thermal impact and extending operational life in battery-powered devices.
  • 広い動作温度範囲: Suitable for industrial-grade applications, maintaining performance integrity from -40??C to +85??C.
  • Compact BGA packaging: Enables high-density PCB layouts and reduces overall module footprint, supporting miniaturized device designs.

BCM4358X3KWBG Advantages vs Typical Alternatives

This wireless module delivers enhanced sensitivity and throughput thanks to its 3×3 MIMO and dual-band capabilities, outperforming many typical single or dual-stream devices. Its PCIe Gen 3 interface ensures faster host communication, while integrated security features provide superior protection. Compared to conventional modules, it balances high performance with low power consumption and industrial-grade reliability, making it a preferred choice for demanding connectivity solutions.

代表的なアプリケーション

  • Embedded wireless networking in industrial automation systems requiring robust, high-speed Wi-Fi connectivity with enhanced security and extended temperature tolerance.
  • High-performance routers and access points that benefit from multi-antenna MIMO technology to deliver superior data throughput and network coverage.
  • IoT gateways and smart devices needing compact, power-efficient wireless modules supporting the latest Wi-Fi standards for seamless cloud connectivity.
  • Consumer electronics such as smart TVs and set-top boxes that demand stable, high-bandwidth wireless connections for streaming and online services.

BCM4358X3KWBG Brand Info

This product is part of a well-established line of wireless communication modules renowned for combining cutting-edge Wi-Fi technology with industrial-grade robustness. The brand behind this device is recognized globally for delivering reliable semiconductor solutions with a strong focus on wireless connectivity performance, integration flexibility, and security compliance. Designed to meet evolving industry standards, the module supports developers in accelerating time-to-market for next-generation networking products.

よくあるご質問

What Wi-Fi standards are supported by this wireless module?

The module supports multiple Wi-Fi standards including 802.11ax (Wi-Fi 6), 802.11ac, and 802.11n, ensuring compatibility with a wide range of existing and future wireless networks for higher throughput and efficiency.

What makes the 3×3 MIMO configuration important for this device?

3×3 MIMO technology allows the module to send and receive three data streams simultaneously, significantly improving data rates and signal reliability, which is especially beneficial in crowded or complex radio environments.

Is this module suitable for industrial applications with extreme temperatures?

Yes, the operating temperature range from -40??C to +85??C makes it well-suited for industrial environments where temperature conditions can vary widely without compromising performance.

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产品中间询盘

How does the PCIe Gen 3 interface enhance the module’s performance?

The PCIe Gen 3 interface provides a high-speed connection to the host processor, reducing latency and increasing the effective bandwidth between the module and the system, which is critical for data-intensive applications.

What security features does this wireless module include?

It incorporates advanced security protocols such as WPA3, WPA2 Enterprise, and Enhanced Open, delivering robust protection against unauthorized access and ensuring secure wireless communications in sensitive environments.

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