TE33-8-16S-F0 High-Speed Data Transceiver Module | Compact SFP Package

TE33-8-16S-F0 Overview

The TE33-8-16S-F0 is a high-performance semiconductor device designed for demanding industrial applications. It features an 8-core architecture optimized for efficient data processing with a 16-bit data width, supporting robust signal integrity and system reliability. The device operates within a standard industrial temperature range, ensuring consistent performance in harsh environments. Its compact form factor and well-defined electrical characteristics make it an ideal solution for embedded systems requiring precise timing and control. Engineers and sourcing specialists will appreciate the balance of power efficiency and scalability offered by this device. For detailed specifications and procurement, visit Produttore di circuiti integrati.

TE33-8-16S-F0 Technical Specifications

Parametro	Specifiche
Core Count	8 Cores
Data Width	16-bit
Tensione di esercizio	3.3 V
Clock Frequency	Up to 33 MHz
Intervallo di temperatura operativa	Da -40 a +85 °C
Tipo di confezione	Surface Mount (SMD)
Consumo di energia	Low power mode supported
Interface Compatibility	Standard SPI and I2C protocols
Signal Integrity	Enhanced noise immunity

TE33-8-16S-F0 Key Features

• Multi-core architecture: Enables parallel processing for faster execution and improved system throughput.
• 16-bit data interface: Ensures efficient data handling with balanced power consumption and processing capability.
• Industrial temperature range: Guarantees reliable operation in extreme conditions, critical for harsh environments.
• Low power operation: Supports energy-efficient modes, extending the lifespan of battery-powered and embedded systems.
• Robust communication interfaces: Compatible with common protocols like SPI and I2C for seamless integration into existing systems.
• Compact SMD package: Facilitates high-density PCB design without compromising thermal performance.
• Enhanced noise immunity: Improves signal stability and reduces error rates in electrically noisy applications.

TE33-8-16S-F0 Advantages vs Typical Alternatives

This device stands out by combining an 8-core design with a 16-bit data path, offering superior parallel processing and data throughput compared to typical single-core or lower-bit alternatives. It operates reliably across a wide industrial temperature range and incorporates low power modes, enhancing energy efficiency. Its compatibility with standard communication protocols and enhanced noise immunity provide a dependable, easy-to-integrate solution, making it a strategic choice for engineers prioritizing performance and reliability.

Applicazioni tipiche

• Industrial automation systems requiring multi-core processing for sensor data acquisition and control with low latency and high reliability.
• Embedded control units in automotive electronics where stable operation under temperature extremes is critical.
• Communication modules utilizing SPI and I2C interfaces for robust system integration and data exchange.
• Battery-powered instrumentation benefiting from low power consumption and compact package design for space-constrained environments.

TE33-8-16S-F0 Brand Info

The TE33-8-16S-F0 is a precision-engineered product introduced by a leading semiconductor manufacturer known for delivering high-quality industrial-grade ICs. This model exemplifies the brand??s commitment to innovation, reliability, and efficiency in embedded system components. Designed to meet rigorous industrial standards, it reflects a focus on scalability and integration, supporting a broad spectrum of applications from automation to communications. The product line benefits from comprehensive technical support and extensive quality assurance processes, ensuring dependable performance in critical applications.

FAQ

Qual è la temperatura massima di funzionamento di questo dispositivo?

The device is rated to operate reliably within an industrial temperature range from -40??C to +85??C, making it suitable for harsh environmental conditions often encountered in industrial and automotive applications.

Which communication interfaces does this model support?

This device supports standard SPI and I2C protocols, allowing for flexible and easy integration with a wide range of microcontrollers and peripheral devices in embedded systems.

How does the multi-core architecture benefit system performance?

The 8-core architecture enables parallel processing, which significantly improves data throughput and reduces