BGS13S4N9E6327XTSA1 RF Switch Module, Surface Mount, SMD Package

BGS13S4N9E6327XTSA1 Overview

The BGS13S4N9E6327XTSA1 is a highly integrated RF switch designed for demanding wireless applications. Engineered for versatility, it features a robust design that ensures reliable signal routing in compact electronic systems. With its advanced technology, this device supports efficient and precise switching functions essential for modern RF front-end applications. The switch is optimized for low insertion loss and high isolation, making it suitable for applications where signal integrity and performance are priorities. For sourcing and detailed technical information, visit Produttore di circuiti integrati.

BGS13S4N9E6327XTSA1 Technical Specifications

Parametro	Valore
Tipo	RF Switch, SP3T (Single Pole Triple Throw)
Operating Frequency Range	Up to 6.0 GHz
Interfaccia di controllo	Digitale
Pacchetto	TSLP10-9
Tensione di esercizio	1.65 V to 2.75 V
Insertion Loss	Low (typical for high-performance RF switches)
Isolation	High (suitable for signal integrity)
RoHS Compliance	Sì

BGS13S4N9E6327XTSA1 Key Features

• SP3T (Single Pole Triple Throw) configuration enables flexible signal routing, allowing efficient use of limited RF paths in compact designs.
• Operates up to 6.0 GHz, supporting a broad range of wireless standards and communication protocols for multi-band and multi-mode systems.
• Low insertion loss ensures minimal signal degradation, which is critical for maintaining high-performance RF transmission and reception.
• High isolation between ports minimizes cross-talk and interference, delivering cleaner signal pathways even in dense electronic environments.
• Digital control simplifies integration into advanced system architectures, offering straightforward interface options for designers.
• Compact TSLP10-9 package enables space-saving PCB layouts, supporting the miniaturization of portable and embedded devices.
• RoHS compliance ensures environmental compatibility for global manufacturing requirements.

BGS13S4N9E6327XTSA1 Advantages vs Typical Alternatives

This RF switch provides superior signal routing with low insertion loss and high port-to-port isolation, enhancing overall system performance compared to standard alternatives. Its digital control interface and compact package streamline integration into modern, space-constrained designs. The device??s broad frequency coverage and environmental compliance further distinguish it, making it an optimal choice for next-generation wireless devices requiring alta affidabilità e efficient signal management.

Applicazioni tipiche

• Cellular handsets and wireless modules: The device is frequently used in mobile phones and wireless communication modules to switch between multiple antenna paths, optimizing RF performance while conserving board space and power.
• WLAN and Bluetooth systems: Suitable for integrating into wireless LAN and Bluetooth hardware to enable seamless switching between different frequency bands or antennas.
• RF front-end circuits: Ideal for use in the front-end of RF systems in both consumer and industrial electronics, supporting signal routing and band selection.
• Test and measurement equipment: Useful in automated test setups where reliable RF signal routing and isolation are essential for accurate measurement and diagnostics.

BGS13S4N9E6327XTSA1 Brand Info

This SP3T RF switch is manufactured by a leading global provider of semiconductor solutions renowned for its expertise in RF and wireless technologies. The product exemplifies a commitment to performance, integration, and reliability, addressing the needs of high-frequency circuit designers. With its advanced packaging and compliance standards, the device is tailored for volume manufacturing and global applications, offering trusted quality and consistent availability for industrial and consumer markets.

FAQ

What type of applications is this RF switch most suitable for?

This device is ideal for RF signal routing in wireless communication systems, including mobile handsets, WLAN modules, Bluetooth devices, and test equipment. Its high-frequency operation and low-loss design make it particularly effective for multi-band and multi-mode applications where compactness and performance are essential.

How does the device support system miniaturization?

The compact TSLP10-9 package allows designers to implement advanced RF switching functions without requiring significant PCB space. This supports the ongoing trend toward smaller, lighter electronic devices without sacrificing performance or reliability.

What are the key signal integrity benefits offered by this switch?

Its low insertion loss and high isolation characteristics ensure that signals pass through with minimal degradation or interference. This level of performance is crucial in applications where maintaining the quality of RF signals directly impacts device functionality and end-user experience.

Is the product compliant with global environmental standards?

Yes, the device is fully RoHS compliant. This ensures it meets environmental regulations for hazardous substances, supporting sustainable manufacturing processes and global product deployment.

Can this switch be easily integrated into digital control systems?

Absolutely. The digital control interface allows straightforward integration with digital logic systems, enabling flexible and reliable operation within sophisticated RF front-end designs. This reduces development complexity and accelerates time to market for new electronic products.