BCR158WE6327HTSA1 Panasonic Rechargeable NiMH Battery Pack – OEM Bulk Package

  • This device processes data efficiently, enabling smoother performance in embedded systems requiring reliable control.
  • Featuring a compact CBZ package, it minimizes board space, facilitating integration into tight hardware designs.
  • Its power consumption is optimized to extend battery life in portable and low-power applications.
  • Ideal for industrial automation, this model supports stable operation under varying environmental conditions.
  • Manufactured under stringent quality controls, it ensures consistent functionality and long-term reliability.
SKU: BCR158WE6327HTSA1 Categoria:
产品上方询盘

BCR158WE6327HTSA1 Overview

The BCR158WE6327HTSA1 is a high-performance semiconductor device designed for precise industrial applications requiring robust operation under varying environmental conditions. It integrates advanced technology to deliver consistent electrical characteristics, ensuring reliability in demanding circuits. With a compact footprint and optimized power handling capabilities, this component supports efficient system design and integration. Its proven stability and quality make it ideal for engineers and sourcing specialists focused on industrial automation, control systems, and power management solutions. For more details, visit Produttore di circuiti integrati.

BCR158WE6327HTSA1 Technical Specifications

Parametro Specifiche
Tipo di dispositivo Discrete Semiconductor
Pacchetto SMD (dispositivo a montaggio superficiale)
Tensione di esercizio Specified voltage range per datasheet
Valutazione attuale Maximum continuous current as defined
Dissipazione di potenza Defined thermal dissipation limit
Junction Temperature Operating temperature range up to maximum junction temp
Thermal Resistance Typical R??JA and R??JC values
Storage Temperature Specified non-operating temperature limits

BCR158WE6327HTSA1 Key Features

  • High power handling capability: Enables operation in demanding industrial environments without performance degradation.
  • Pacchetto compatto a montaggio superficiale: Facilitates easy integration in space-constrained PCB layouts while maintaining thermal efficiency.
  • Ampio intervallo di temperatura operativa: Ensures reliable performance across harsh temperature variations typical in industrial settings.
  • Robust electrical characteristics: Offers consistent voltage and current behavior to improve system stability and reduce maintenance.

Applicazioni tipiche

  • Industrial automation control circuits requiring reliable semiconductor switching and power management under varying load conditions.
  • Power supply modules in industrial equipment, providing stable current flow and voltage regulation.
  • Motor control units where precise semiconductor response improves efficiency and operational safety.
  • Embedded systems in factory automation that demand compact, durable components with predictable electrical performance.

BCR158WE6327HTSA1 Advantages vs Typical Alternatives

This device offers superior integration in compact designs compared to typical through-hole alternatives, reducing PCB space and assembly costs. Its wide operating temperature range and high power handling improve reliability in demanding applications. Consistent electrical parameters enhance circuit stability, making it a preferred choice over generic components lacking precise control and durability.

BCR158WE6327HTSA1 Brand Info

The BCR158WE6327HTSA1 is manufactured by NXP Semiconductors, a global leader in high-performance mixed-signal and standard product solutions. NXP focuses on providing robust semiconductor devices optimized for industrial, automotive, and consumer applications. This product line embodies NXP??s commitment to innovation, quality, and long-term availability, making it a trusted choice for engineers designing reliable industrial systems worldwide.

FAQ

What type of package does this semiconductor use?

The component is available in a surface-mount device (SMD) package, which supports automated PCB assembly and reduces board space compared to traditional through-hole packages.

Can the device operate in harsh industrial environments?

Yes, it is designed to operate reliably across a wide temperature range and withstand typical industrial stresses, ensuring stable performance under harsh environmental conditions.

What are the key electrical parameters engineers should consider?

Engineers should focus on maximum operating voltage, current rating, power dissipation, and thermal resistance to ensure the device meets the requirements of their specific application and maintains reliability.

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产品中间询盘

Is this device suitable for motor control applications?

Absolutely, its reliable switching characteristics and power handling features make it well-suited for motor control circuits, enhancing efficiency and system safety.

How does this product support efficient PCB design?

The compact SMD package and consistent electrical characteristics help reduce PCB footprint and simplify thermal management, enabling more efficient and cost-effective board layouts.

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