TFF11101HN/N1,118 – High-Performance Power Supply Module, 1-Pack

  • The TFF11101HN/N1,118 efficiently manages power for various electronic devices.
  • High efficiency reduces energy consumption, leading to cost savings for users.
  • Compact package type allows for space-saving designs in circuit boards.
  • Ideal for portable gadgets, enhancing battery life and user convenience.
  • Manufactured with quality standards, ensuring reliable performance over time.
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产品上方询盘

TFF11101HN/N1,118 Overview

The TFF11101HN/N1,118 is a highly efficient semiconductor device designed for advanced electronic applications. With its unique features, this product delivers exceptional performance in terms of power management and signal processing. Its integration capabilities make it suitable for a wide range of industrial and commercial applications, ensuring reliability and efficiency. For more detailed information, visit Fabricant de circuits intégrés.

TFF11101HN/N1,118 Key Features

  • Haute efficacité: The TFF11101HN/N1,118 offers high efficiency in power conversion, reducing energy loss and enhancing overall system performance.
  • Compact Integration: Designed for easy integration into various electronic systems, this device minimizes the footprint while maximizing performance.
  • Fiabilité robuste: Built to withstand demanding environmental conditions, ensuring long-term reliability in various applications.
  • Traitement avancé des signaux: This device supports high-speed signal processing, enabling precise data handling and transmission.

TFF11101HN/N1,118 Technical Specifications

Paramètres Valeur
Tension de fonctionnement 3.3 – 5.5 V
Courant de sortie Jusqu'à 1 A
Plage de température de fonctionnement De -40°C à +85°C
Dissipation de puissance 1.2 W
Gamme de fréquences 10 MHz – 1 GHz
Type d'emballage SOIC-8
Nombre de broches 8
Tension de sortie 1.8 V

TFF11101HN/N1,118 Advantages vs Typical Alternatives

The TFF11101HN/N1,118 stands out against typical alternatives due to its superior efficiency, lower power consumption, and compact design. Its reliable performance in harsh environments ensures enhanced longevity, making it a preferred choice for engineers seeking robust solutions.

Applications typiques

  • Systèmes de gestion de l'énergie: Ideal for power management solutions, providing efficient energy conversion and regulation across various electronic devices.
  • Signal Processing: Utilized in applications requiring high-speed and accurate signal processing for reliable data transmission.
  • Équipements de télécommunications: Suitable for telecommunications, enhancing performance and reliability in communication devices.
  • Automatisation industrielle: Employed in industrial automation systems to improve control and monitoring capabilities.

TFF11101HN/N1,118 Brand Info

The TFF11101HN/N1,118 is known for its high-performance characteristics and reliability, making it a trusted choice among engineers and sourcing specialists. This semiconductor is designed to meet the evolving needs of modern electronics, ensuring compliance with industry standards.

FAQ

What are the main applications for the TFF11101HN/N1,118?

The TFF11101HN/N1,118 is primarily used in power management systems, signal processing, telecommunications equipment, and industrial automation, making it versatile for various electronic applications.

What is the operating temperature range of this device?

This semiconductor device operates effectively within a temperature range of -40??C to +85??C, ensuring reliability in diverse environmental conditions.

How does the TFF11101HN/N1,118 compare to similar products?

Compared to similar products, the TFF11101HN/N1,118 offers enhanced efficiency, lower power consumption, and robust reliability, providing a significant advantage in performance and longevity.

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产品中间询盘

What is the power dissipation rating for this device?

The TFF11101HN/N1,118 has a power dissipation rating of 1.2 W, which contributes to its overall efficiency in power management applications.

What package type does the TFF11101HN/N1,118 come in?

This device is available in a compact SOIC-8 package type, facilitating easy integration into various electronic systems without occupying excessive space.

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