BCM43570KFFBG Wi-Fi 6 Combo Chipset Module – Surface Mount Package

BCM43570KFFBG Overview

The BCM43570KFFBG is a highly integrated wireless communication module designed for advanced connectivity solutions. It supports dual-band Wi-Fi 5 (802.11ac) and Bluetooth 5.0, enabling robust and efficient wireless performance in compact form factors. This device is optimized for low power consumption while delivering high throughput, making it ideal for a wide range of embedded and consumer applications. Its integration of multiple interfaces simplifies system design and accelerates time-to-market. Engineers and sourcing specialists will find the BCM43570KFFBG a reliable choice for industrial and commercial wireless applications. For additional product details and support, visit the Fabricant de circuits intégrés.

BCM43570KFFBG Technical Specifications

BCM43570KFFBG Key Features

• Dual-band Wi-Fi 5 support: Provides simultaneous 2.4 GHz and 5 GHz connectivity, enhancing network reliability and reducing interference in congested environments.
• Bluetooth 5.0 Low Energy integration: Enables efficient short-range wireless communication with extended range and reduced power consumption, ideal for IoT devices.
• High throughput performance: Supports data rates up to 433 Mbps, ensuring fast data transfer for demanding applications like video streaming and real-time communication.
• Faible consommation d'énergie : Designed to operate efficiently in battery-powered devices, extending operational life without sacrificing performance.
• Compact FCBGA package: Small footprint simplifies integration into space-constrained designs without compromising connectivity features.
• Multiple interface options: Supports SDIO 3.0 for high-speed data transfer and UART/PCM for flexible audio and control signal integration.
• Robust operating temperature range: Suitable for industrial and outdoor applications requiring reliable performance across wide temperature variations.

BCM43570KFFBG Advantages vs Typical Alternatives

This device offers superior integration of dual-band Wi-Fi and Bluetooth 5.0, delivering enhanced wireless performance with lower power consumption compared to typical discrete modules. Its compact FCBGA package and multiple interface support streamline system design, reducing board space and BOM complexity. Additionally, robust receiver sensitivity and extended temperature range improve reliability in challenging industrial environments, making it a preferred solution for demanding connectivity applications.

Applications typiques

• Embedded wireless modules in industrial automation equipment, providing reliable dual-band Wi-Fi and Bluetooth connectivity for remote monitoring and control.
• Smart home devices requiring seamless Wi-Fi and Bluetooth integration for communication with cloud services and local controllers.
• Wearable electronics that benefit from low power Bluetooth 5.0 connectivity alongside Wi-Fi for data synchronization and firmware updates.
• Consumer electronics such as streaming media players and smart TVs that demand high throughput Wi-Fi for smooth content delivery.

BCM43570KFFBG Brand Info

The BCM43570KFFBG is part of a family of wireless connectivity solutions designed by a leading semiconductor manufacturer specializing in high-performance communications ICs. This product embodies the brand??s commitment to delivering cutting-edge technology with a focus on integration, power efficiency, and reliability. Engineered for diverse applications, it reflects the manufacturer??s expertise in advanced wireless protocols and compact packaging technologies, ensuring compatibility with a wide range of industrial and consumer electronics designs.

FAQ

What wireless standards does the BCM43570KFFBG support?

This device supports IEEE 802.11ac Wi-Fi (dual-band at 2.4 GHz and 5 GHz) and Bluetooth 5.0 Low Energy standards. These enable high-speed wireless networking alongside efficient short-range communication for diverse applications.

What interfaces are available for integration with host systems?

The module provides SDIO 3.0 for high-speed data transfer, UART for serial communication, and PCM interfaces for audio functions. These options offer flexibility for integrating the device into various system architectures.

What is the operating temperature range of this wireless solution?

The device supports operation from -40??C to +85??C, making it suitable for industrial environments and applications that require reliable performance across wide temperature extremes.

How does the power consumption of this module impact battery-powered designs?

Designed with power efficiency in mind, it minimizes energy usage during both active and idle states. This helps extend battery life in portable and wearable devices without compromising connectivity performance.

What packaging does the device use, and how does it affect integration?

The BCM43570KFFBG uses a Fine-pitch Chip-Scale Ball Grid Array (FCBGA) package measuring 7.0 mm ?? 7.0 mm. This compact form factor enables easy integration into space-constrained applications while supporting reliable electrical connections and thermal performance.