BCM4356XKUBG Wi-Fi 6 802.11ax Wireless Module – Surface Mount Package

  • Provides wireless connectivity enabling fast and stable network access for diverse device integration.
  • Supports advanced data transfer rates, improving communication efficiency in high-demand environments.
  • Compact CBZ package reduces board space, facilitating integration into space-constrained designs.
  • Ideal for embedded systems requiring reliable Wi-Fi performance in smart home or industrial applications.
  • Built with quality manufacturing standards to ensure consistent operation and long-term reliability.
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产品上方询盘

BCM4356XKUBG Overview

The BCM4356XKUBG is a highly integrated wireless communication module designed to support advanced Wi-Fi and Bluetooth connectivity in compact devices. It features dual-band 2.4 GHz and 5 GHz operation, enabling robust and reliable wireless performance suitable for a wide range of industrial and consumer applications. This module combines high data throughput with low power consumption, making it ideal for embedded systems requiring efficient wireless integration. With its compact form factor and comprehensive protocol support, the product delivers seamless connectivity solutions tailored to demanding industrial environments. For detailed technical data, visit Fabricant de circuits intégrés.

BCM4356XKUBG Technical Specifications

ParamètresSpécifications
Wireless Standards802.11ac Wave 2, 802.11a/b/g/n, Bluetooth 4.2
Frequency Bands2.4 GHz and 5 GHz dual-band
Taux de donnéesUp to 867 Mbps (802.11ac)
Puissance d'émissionUp to +20 dBm
Sensibilité du récepteur-92 dBm (typical for 802.11ac)
InterfaceSDIO 3.0, PCM, UART
Power Supply3.3 V ?? 5%
Température de fonctionnementDe -40°C à +85°C
PaquetSurface Mount, Compact Module

BCM4356XKUBG Key Features

  • Dual-band Wi-Fi support: Enables simultaneous 2.4 GHz and 5 GHz operation, providing versatile connectivity options and improved network performance in congested environments.
  • Bluetooth 4.2 integration: Facilitates seamless short-range wireless communication, expanding device compatibility with a wide range of peripherals and IoT devices.
  • Faible consommation d'énergie : Optimized for energy efficiency, extending battery life in portable and embedded applications without compromising wireless performance.
  • High data throughput: Supports 802.11ac Wave 2 speeds up to 867 Mbps, ensuring fast data transfer for bandwidth-intensive applications.
  • Robust interface options: Includes SDIO 3.0, PCM, and UART interfaces, enabling flexible integration with various host processors and system architectures.
  • Large gamme de températures de fonctionnement : Suitable for industrial and outdoor applications due to reliable performance across -40??C to +85??C.
  • Compact surface mount design: Facilitates space-saving integration in size-constrained devices without sacrificing functionality.

BCM4356XKUBG Advantages vs Typical Alternatives

This module offers superior sensitivity and dual-band wireless capability compared to many alternatives, providing enhanced connectivity stability and higher throughput. Its low power consumption and broad temperature tolerance ensure reliable operation in industrial environments while supporting diverse interface options for seamless integration. These advantages make it a preferred choice for embedded wireless communication solutions requiring both performance and energy efficiency.

Applications typiques

  • Embedded wireless modules in industrial automation systems, enabling real-time data exchange and remote control in harsh environments where reliability is critical.
  • Smart home devices requiring compact, dual-band Wi-Fi and Bluetooth connectivity for seamless integration with local networks and mobile control.
  • Portable medical equipment benefiting from low-power wireless communication to maintain long operating times without frequent battery replacements.
  • IoT gateways and routers that demand high data rates and robust connectivity across multiple wireless standards for diverse device ecosystems.

BCM4356XKUBG Brand Info

The BCM4356XKUBG is part of a renowned product line from a leading semiconductor manufacturer specializing in wireless communication ICs. This product exemplifies the brand??s commitment to delivering high-performance, reliable wireless solutions that meet stringent industrial and consumer requirements. Designed with advanced semiconductor technology, it supports next-generation connectivity standards while maintaining compatibility with legacy protocols. The module??s compact design and integration flexibility highlight the brand??s focus on enabling efficient, scalable wireless systems for a variety of applications.

FAQ

What wireless standards does this module support?

The device supports multiple wireless standards, including 802.11ac Wave 2 for high-speed Wi-Fi connectivity and Bluetooth 4.2 for short-range communication. It also maintains backward compatibility with 802.11a/b/g/n standards, ensuring broad network interoperability.

Which interfaces are available for system integration?

This module provides several interface options such as SDIO 3.0 for high-speed data transfer, PCM for audio interfaces, and UART for serial communication. These interfaces allow flexible connection to various host processors and microcontrollers.

What is the operating temperature range of the BCM4356XKUBG?

The module is designed to operate reliably across a wide temperature range from -40??C up to +85??C, making it suitable for both industrial and outdoor applications where environmental conditions can be challenging.

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产品中间询盘

How does the module support low power consumption?

Power efficiency is achieved through optimized hardware design and firmware support that reduce energy usage during wireless communication. This helps extend battery life in portable devices while maintaining strong connectivity performance.

Can this module be used in compact devices?

Yes, the module??s compact surface mount package allows integration into space-constrained devices without compromising wireless functionality. This makes it ideal for embedded systems and portable electronics requiring small form factors.

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