BCM43566PKFFBG Overview
The BCM43566PKFFBG is a highly integrated wireless communication module designed for modern industrial and consumer applications. Featuring dual-band Wi-Fi and Bluetooth capabilities, it optimizes connectivity performance while maintaining low power consumption. This device supports advanced wireless protocols, enabling robust, high-speed data transfer in compact form factors. Its integration simplifies system design by consolidating multiple wireless functions into a single package. Engineers and sourcing specialists will appreciate the module??s reliability, comprehensive feature set, and compatibility with diverse application environments. For further technical details and sourcing options, visit Fabricant de circuits intégrés.
BCM43566PKFFBG Technical Specifications
| Paramètres | Spécifications |
|---|---|
| Wireless Standards | 802.11a/b/g/n/ac (Wi-Fi 5), Bluetooth 5.0 |
| Frequency Bands | 2.4 GHz and 5 GHz dual-band support |
| Taux de données | Up to 867 Mbps (Wi-Fi), Bluetooth up to 3 Mbps |
| Interface | SDIO 3.0, UART, PCM for audio support |
| Tension d'alimentation | 3.3 V nominal |
| Plage de température de fonctionnement | De -40°C à +85°C |
| Type d'emballage | Surface-mount, 38-pin LGA |
| Security | WPA3, WPA2, AES encryption support |
BCM43566PKFFBG Key Features
- Dual-band Wi-Fi Support: Enables simultaneous 2.4 GHz and 5 GHz operation, providing flexibility and reducing interference for higher throughput in congested environments.
- Bluetooth 5.0 Integration: Offers enhanced wireless peripheral connectivity with improved range and data rates, critical for IoT and device communication.
- Faible consommation d'énergie : Optimized power management extends battery life in portable and embedded applications, supporting energy-efficient system designs.
- High-Speed Data Interface: SDIO 3.0 interface supports rapid data exchange between host processors and the module, facilitating seamless integration.
- Robust Security Features: Comprehensive encryption and authentication mechanisms ensure data protection and secure wireless communication.
- Large gamme de températures de fonctionnement : Suitable for demanding industrial environments, ensuring reliable performance under temperature extremes.
- Compact LGA Package: Saves board space and enhances mechanical reliability, simplifying automated assembly processes.
BCM43566PKFFBG Advantages vs Typical Alternatives
This wireless module offers superior integration of dual-band Wi-Fi and Bluetooth 5.0 in a compact package, outperforming typical single-function alternatives. Its low power consumption and advanced security features provide reliable, efficient connectivity suited for industrial and consumer applications. The device??s wide operating temperature range and high data throughput make it a preferred choice for engineers seeking dependable performance with simplified system design.
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Applications typiques
- Embedded wireless communication in IoT devices requiring robust dual-band Wi-Fi and Bluetooth connectivity for smart home and industrial automation.
- Portable electronics that demand low power consumption combined with high-speed data transfer.
- Wireless audio devices leveraging Bluetooth 5.0 for improved range and quality.
- Networking equipment and gateways where secure, reliable wireless communication is critical.
BCM43566PKFFBG Brand Info
The BCM43566PKFFBG is part of a renowned product line designed by a leading semiconductor manufacturer specializing in wireless connectivity solutions. This module embodies the brand??s commitment to delivering high-performance, reliable, and energy-efficient wireless components tailored for complex industrial and consumer applications. Its advanced features and integration simplify development cycles, enabling faster time-to-market for OEMs and system integrators.
FAQ
What wireless standards does this module support?
The device supports IEEE 802.11a/b/g/n/ac standards for Wi-Fi, covering both 2.4 GHz and 5 GHz bands, as well as Bluetooth 5.0. This ensures compatibility with a wide range of wireless networks and devices.
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How does the module handle power consumption?
It includes optimized power management features designed to minimize energy usage during both active communication and idle states. This makes it suitable for battery-powered devices and applications where energy efficiency is critical.
What security features are integrated into this wireless module?
Security is addressed through support for WPA3 and WPA2 wireless security protocols, alongside AES encryption. These features protect data and ensure secure connections in sensitive or mission-critical environments.
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What interfaces are available for host communication?
The module supports SDIO 3.0 for high-speed data transfer, as well as UART and PCM interfaces, allowing integration with a variety of host processors and supporting audio applications.
Is the module suitable for industrial temperature ranges?
Yes, it operates reliably across a temperature range from -40??C to +85??C, making it suitable for industrial environments that experience temperature extremes.
