BCM43436LHKUBG Wi-Fi & Bluetooth Combo IC Module – Surface Mount Package

  • Enables wireless connectivity, allowing devices to communicate efficiently within local networks.
  • Supports multiple Wi-Fi standards to ensure compatibility with a wide range of network equipment.
  • Features a compact LFCSP package that reduces board space and supports compact device designs.
  • Ideal for integration in smart home devices, enhancing seamless communication and control.
  • Manufactured with stringent quality controls to provide consistent performance and reliability.
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BCM43436LHKUBG Overview

The BCM43436LHKUBG is a highly integrated wireless connectivity solution designed for embedded applications requiring robust Wi-Fi and Bluetooth functionality. This module combines IEEE 802.11b/g/n Wi-Fi with Bluetooth 4.1 Classic and Low Energy (BLE) in a compact form factor, enabling seamless wireless communication in space-constrained designs. Its low power consumption, efficient RF performance, and integrated baseband and MAC processors make it ideal for IoT devices, consumer electronics, and industrial applications. Engineers and sourcing specialists can rely on this component to streamline design cycles and enhance product connectivity. For more information, visit the Fabricant de circuits intégrés.

BCM43436LHKUBG Technical Specifications

ParamètresSpécifications
Wi-Fi StandardIEEE 802.11b/g/n (2.4 GHz)
Version BluetoothBluetooth 4.1 Classic and Low Energy (BLE)
Fréquence de fonctionnementBande ISM 2,4 GHz
Puissance d'émissionUp to +20 dBm (typical)
Sensibilité du récepteur-92 dBm (802.11n, MCS7, 20 MHz)
InterfaceSDIO 3.0 / UART / PCM
Tension d'alimentation3.3 V ?? 0.3 V
Dimensions de l'emballage11.5 mm ?? 13.5 mm ?? 2.2 mm
Plage de température de fonctionnementDe -40 ??C à +85 ??C

BCM43436LHKUBG Key Features

  • Dual-mode wireless integration: Combines Wi-Fi 802.11b/g/n and Bluetooth 4.1 Classic/BLE, enabling versatile connectivity options in one compact module, which simplifies design and reduces BOM costs.
  • High transmit power and receiver sensitivity: Ensures strong signal quality and reliable communication in challenging RF environments, improving overall system performance and coverage.
  • Faible consommation d'énergie : Optimized for battery-powered and portable devices, this module supports efficient power management to extend operational life without sacrificing connectivity.
  • Multiple interfaces support: Provides SDIO 3.0, UART, and PCM interfaces for flexible integration with various host processors and applications, facilitating easy development and deployment.

BCM43436LHKUBG Advantages vs Typical Alternatives

This wireless module offers superior integration of Wi-Fi and Bluetooth technologies in a single compact package, reducing the need for multiple discrete components. Its high transmit power and enhanced receiver sensitivity translate into improved range and reliability compared to typical alternatives. Additionally, its multiple interface options and low power consumption support diverse application requirements, making it a preferred choice for engineers focused on efficient, scalable wireless solutions.

Applications typiques

  • Internet of Things (IoT) devices requiring reliable dual-mode wireless communication, such as smart home controllers and connected sensors, benefiting from compact design and low power operation.
  • Consumer electronics including wearable devices and portable media players that need seamless Wi-Fi and Bluetooth connectivity with minimal footprint.
  • Industrial automation systems where robust wireless links ensure data integrity and system responsiveness in harsh environments.
  • Embedded modules in healthcare equipment demanding secure and stable wireless interfaces for real-time monitoring and data transfer.

BCM43436LHKUBG Brand Info

The BCM43436LHKUBG is a product developed by a leading semiconductor company renowned for advanced wireless solutions. This module embodies the brand??s commitment to delivering reliable, high-performance connectivity components optimized for embedded applications. It integrates proven Broadcom wireless technology with a focus on seamless integration, power efficiency, and broad application support. The product benefits from extensive industry experience, rigorous quality standards, and comprehensive technical documentation to support rapid adoption and deployment.

FAQ

What wireless standards does this module support?

This device supports IEEE 802.11b/g/n Wi-Fi standards operating at 2.4 GHz and Bluetooth 4.1 Classic along with Bluetooth Low Energy (BLE). This dual-mode functionality allows simultaneous Wi-Fi and Bluetooth communication for versatile connectivity scenarios.

What interfaces are available for host communication?

The module provides SDIO 3.0, UART, and PCM interfaces to connect with host processors. These interfaces enable flexible data exchange and audio communication, facilitating integration into various embedded systems and platforms.

What is the typical operating temperature range?

The device is rated for an operating temperature range from -40 ??C to +85 ??C, making it suitable for industrial and outdoor applications where environmental conditions may vary widely.

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How does the module manage power consumption?

Power management is optimized through integrated low-power modes and efficient hardware design, supporting battery-powered applications by reducing current draw during idle or low activity states without compromising wireless performance.

What is the physical size and form factor of this wireless solution?

The compact package measures 11.5 mm by 13.5 mm with a height of 2.2 mm, enabling use in space-constrained designs such as wearables, embedded systems, and portable electronics, while simplifying PCB layout and assembly.

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