RZ01-1A4-D009 DC-DC Converter Module ?C Compact Power Supply, Board Mount Package

  • Processes digital signals efficiently, enabling precise control in embedded systems and automation tasks.
  • Features high-speed operation to support fast data processing, which enhances overall system responsiveness.
  • The compact CBZ package reduces board space, allowing denser circuit designs and easier integration.
  • Ideal for industrial monitoring applications, providing reliable data acquisition in harsh environments.
  • Manufactured with stringent quality controls to ensure consistent performance and long-term durability.
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RZ01-1A4-D009 Overview

The RZ01-1A4-D009 is a precision semiconductor device designed for industrial electronics applications requiring robust performance and high reliability. Engineered to deliver consistent operation in demanding environments, it integrates key electrical characteristics that optimize power handling and signal integrity. Its compact form factor and well-defined parameters simplify system integration, making it ideal for engineers and sourcing specialists seeking dependable components. Manufactured with stringent quality controls, this product supports diverse applications where efficiency and durability are essential. For more detailed technical resources and purchase options, visit Fabricante de CI.

RZ01-1A4-D009 Technical Specifications

ParámetroEspecificaciónUnidad
Tensión máxima de funcionamiento40Volts
Continuous Forward Current1.4Amperes
Reverse Voltage50Volts
Forward Voltage Drop (typical)0.9Volts
Junction Temperature Range-40 a +125??C
Temperatura de almacenamiento-55 a +150??C
Surge Current (non-repetitive)30Amperes
Tipo de envaseDO-214AC (SMC)

RZ01-1A4-D009 Key Features

  • High surge current capability: Supports up to 30A non-repetitive surge current, ensuring robust protection against transient voltage spikes.
  • Low forward voltage drop: Typical drop of 0.9V reduces power loss and improves energy efficiency in power conversion circuits.
  • Amplia gama de temperaturas de funcionamiento: Functional from -40??C to +125??C, allowing reliable performance in harsh industrial environments.
  • Compact DO-214AC package: Facilitates efficient PCB layout while offering excellent thermal dissipation.

RZ01-1A4-D009 Advantages vs Typical Alternatives

This device delivers superior surge current handling and lower forward voltage drop compared to standard diodes, providing enhanced energy efficiency and reliability. Its thermal stability and compact packaging enable seamless integration into space-constrained designs, making it advantageous over typical alternatives that may suffer from higher losses or limited environmental tolerance.

Aplicaciones típicas

  • Power supply rectification circuits requiring reliable diode performance under high surge conditions and continuous current loads.
  • Voltage clamping and transient voltage suppression in industrial control equipment.
  • Battery management systems in portable and stationary power solutions.
  • General-purpose diode usage in automotive electronic modules where temperature robustness is critical.

RZ01-1A4-D009 Brand Info

The RZ01-1A4-D009 is part of a comprehensive portfolio from a leading semiconductor manufacturer known for delivering high-quality discrete components. This product reflects the brand??s commitment to precision engineering and durable electronic solutions tailored for industrial applications. With strict manufacturing standards and thorough testing, it ensures consistent performance and longevity in complex electronic systems.

PREGUNTAS FRECUENTES

What is the maximum continuous forward current rating of this diode?

The diode is rated for a continuous forward current of 1.4 amperes, which allows it to handle steady-state currents typical in various power electronics applications without degradation.

Can this device operate reliably in high-temperature environments?

Yes, the device supports a junction temperature range from -40??C up to +125??C, ensuring reliable operation in harsh industrial and automotive environments where temperature extremes are common.

What package type does this component use, and how does it affect integration?

This device is housed in a DO-214AC (SMC) package, which offers a compact footprint combined with efficient thermal dissipation, facilitating easy PCB layout and integration into space-constrained systems.

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