QCC-3021-0-80PQFN-MT-00-0 Bluetooth Audio SoC Processor in 80-PQFN Package

  • This model provides efficient processing for wireless audio applications, enhancing user experience with low latency and clear sound.
  • Equipped with a high-performance core, it ensures smooth operation for demanding audio tasks and complex signal processing.
  • The 80PQFN package offers a compact footprint, enabling board-space savings in tight hardware designs.
  • Ideal for integration in portable audio devices, it supports extended battery life and consistent performance under varied conditions.
  • Manufactured with stringent quality controls, this component ensures reliable operation over extended usage periods.
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产品上方询盘

QCC-3021-0-80PQFN-MT-00-0 Overview

The QCC-3021-0-80PQFN-MT-00-0 is a high-performance integrated circuit designed for advanced semiconductor applications requiring reliable and efficient operation. Featuring an 80-pin PQFN package, it offers robust connectivity and optimal thermal management, making it suitable for demanding industrial environments. With precise electrical characteristics and a compact footprint, this device ensures seamless integration in complex electronic systems. Engineers and sourcing specialists will benefit from its proven design, which supports a broad range of industrial and commercial uses. The product is backed by Fabricante de CI, ensuring quality and availability.

QCC-3021-0-80PQFN-MT-00-0 Technical Specifications

ParámetroEspecificación
Tipo de envase80-pin PQFN
Tensión de funcionamiento1.8 V to 3.3 V
Temperatura máxima de funcionamiento125??C
Core FrequencyUp to 200 MHz
I/O Pins64 configurable
Consumo de energíaTypical 150 mW
Dimensiones del paquete8 mm ?? 8 mm
Compliance StandardsRoHS Compliant

QCC-3021-0-80PQFN-MT-00-0 Key Features

  • High integration density: The 80-pin PQFN package enables a compact design, reducing PCB size and improving signal integrity for complex applications.
  • Amplio rango de tensión de funcionamiento: Supporting 1.8 V to 3.3 V operation allows flexible power management and compatibility with various system architectures.
  • Eficiencia térmica: The PQFN package design enhances heat dissipation, maintaining device reliability and performance under high-load conditions.
  • Robust I/O configuration: 64 configurable I/O pins provide extensive interfacing options for diverse industrial and embedded system requirements.

QCC-3021-0-80PQFN-MT-00-0 Advantages vs Typical Alternatives

This device offers superior thermal management and a high pin count in a compact PQFN package, outperforming typical alternatives in size and heat dissipation. Its low power consumption and versatile voltage range provide enhanced energy efficiency and system compatibility. The comprehensive I/O configuration simplifies integration and reduces external component needs, improving overall system reliability and reducing development time.

Aplicaciones típicas

  • Industrial control systems requiring compact, reliable ICs with high I/O flexibility and thermal stability for robust performance in harsh environments.
  • Embedded computing modules where board space is limited and efficient power usage is critical.
  • Communication equipment demanding precise electrical characteristics and stable operation across temperature ranges.
  • Consumer electronics that benefit from a small footprint and efficient heat dissipation for extended device longevity.

QCC-3021-0-80PQFN-MT-00-0 Brand Info

The QCC-3021-0-80PQFN-MT-00-0 is part of a trusted product line from a leading semiconductor manufacturer specializing in advanced integrated circuits. This model exemplifies the brand??s commitment to combining high performance with reliability and efficient design. It reflects years of engineering expertise and quality assurance processes that meet stringent industry standards, ensuring dependable operation in diverse applications.

PREGUNTAS FRECUENTES

What is the maximum operating temperature for the QCC-3021-0-80PQFN-MT-00-0?

The maximum operating temperature is specified at 125??C, enabling the device to function reliably in high-temperature industrial environments commonly encountered in embedded and control systems.

How does the PQFN package benefit the device’s performance?

The PQFN package enhances thermal dissipation and electrical performance by minimizing package inductance and resistance. This contributes to improved signal integrity and thermal management, supporting stable operation under demanding conditions.

What voltage range does the device support?

This integrated circuit operates over a voltage range of 1.8 V to 3.3 V, allowing flexibility in system design and compatibility with various power supply configurations.

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产品中间询盘

How many I/O pins are available and why is this important?

There are 64 configurable I/O pins, providing extensive interfacing options. This flexibility allows engineers to tailor connectivity for different applications, reducing the need for additional components and simplifying the system design.

Is the QCC-3021-0-80PQFN-MT-00-0 RoHS compliant?

Yes, the device complies with RoHS (Restriction of Hazardous Substances) standards, ensuring it meets environmental and safety regulations for electronics manufacturing.

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