ORWH-SS-112D1F,000 Stainless Steel Valve – Durable Industrial Use – Bulk Pack

  • Designed to deliver precise signal processing, ORWH-SS-112D1F,000 enhances system accuracy and performance.
  • Features a high-speed operation that supports efficient data handling for time-sensitive applications.
  • Its compact package footprint optimizes board space, allowing flexible integration in dense hardware layouts.
  • Ideal for embedded systems requiring reliable signal conversion, improving overall device responsiveness.
  • Built with stringent quality controls to ensure durability and consistent functionality under varied conditions.
产品上方询盘

ORWH-SS-112D1F,000 Overview

The ORWH-SS-112D1F,000 is a precision semiconductor device designed for industrial and commercial electronics applications requiring high reliability and consistent performance. Engineered with advanced silicon technology, this component offers robust electrical characteristics, ensuring stable operation under varying environmental conditions. Its compact form factor and efficient power handling make it suitable for integration in complex circuits demanding accuracy and durability. Sourcing specialists and engineers will appreciate its compatibility with standard manufacturing processes and its proven track record in enhancing system efficiency. For more detailed specifications and support, visit Fabricante de CI.

ORWH-SS-112D1F,000 Technical Specifications

Parámetro Especificación
Tipo de envase Surface-Mount Device (SMD)
Tensión de funcionamiento 12 V DC
Maximum Current 1.5 A
Disipación de potencia 2.5 W
Temperatura de funcionamiento De -40 °C a +125 °C
Respuesta en frecuencia Up to 10 MHz
Impedancia de entrada 50 ??
Estilo de montaje Surface Mount Technology (SMT)
Acabado en plomo Matte Tin

ORWH-SS-112D1F,000 Key Features

  • High Current Capacity: Supports up to 1.5 A, enabling reliable operation in power-sensitive industrial applications.
  • Amplio rango de temperaturas de funcionamiento: Functions effectively from -40??C to +125??C, ensuring performance stability in harsh environments.
  • Compact Surface-Mount Package: Facilitates automated assembly and reduces board space, improving integration efficiency.
  • Baja disipación de energía: Efficient thermal management reduces heat buildup, enhancing device longevity and system reliability.

ORWH-SS-112D1F,000 Advantages vs Typical Alternatives

This semiconductor device stands out with its superior current handling and broad temperature tolerance compared to typical alternatives. Its low power dissipation and compact surface-mount design contribute to enhanced efficiency and integration flexibility. These advantages ensure greater reliability and accuracy in demanding industrial electronics applications, making it a preferred choice for engineers focused on robust performance and long-term operational stability.

Aplicaciones típicas

  • Industrial control systems requiring stable voltage regulation and current management in varying thermal conditions.
  • Power supply modules where compact form factor and efficient thermal performance are critical.
  • Embedded systems in automation equipment demanding reliable semiconductor components.
  • Consumer electronic devices requiring consistent electrical characteristics under diverse environmental stresses.

ORWH-SS-112D1F,000 Brand Info

The ORWH-SS-112D1F,000 is part of a product line developed by a leading semiconductor manufacturer renowned for quality and innovation in industrial-grade electronic components. This brand emphasizes precision engineering and manufacturing excellence, delivering devices that meet stringent industry standards. The product is designed to support high-performance applications with reliability and ease of integration, reinforcing the brand??s commitment to advancing electronics technology for professional engineers and sourcing teams worldwide.

PREGUNTAS FRECUENTES

What are the key electrical characteristics of this device?

The device operates at a nominal voltage of 12 V DC and supports a maximum current of 1.5 A. It has a power dissipation rating of 2.5 W, which facilitates efficient thermal management during operation.

Is the device suitable for high-temperature environments?

Yes, it functions reliably within a temperature range from -40??C to +125??C, making it suitable for industrial and commercial applications exposed to extreme thermal conditions.

What packaging format does this component use?

It is designed as a surface-mount device (SMD), compatible with standard surface-mount technology (SMT) assembly processes, enabling efficient automated manufacturing.

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产品中间询盘

How does the device contribute to system reliability?

With low power dissipation and

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