CYW4356XKUBG Wi-Fi/Bluetooth Combo Chip, Wireless Module, BGA Package

  • Enables wireless connectivity, allowing devices to communicate seamlessly in networked environments.
  • Supports advanced Wi-Fi standards, which increases compatibility with a wide range of modern devices.
  • Offered in a compact package, making it suitable for designs where board space is limited.
  • Well-suited for smart home applications, helping ensure stable connections for IoT devices.
  • Manufactured with robust quality controls to support consistent, long-term operation in demanding conditions.
SKU: CYW4356XKUBG Categoría: Marca:
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CYW4356XKUBG Overview

The CYW4356XKUBG is a highly-integrated wireless communication IC designed for robust connectivity in demanding environments. Engineered to deliver advanced wireless networking capabilities, this device supports rapid data transfer and reliable signal performance. Its compact form factor and integration-friendly design make it well-suited for a variety of industrial and commercial applications. With a focus on efficiency and reliability, this solution enables manufacturers to streamline development, optimize product performance, and ensure compatibility with modern wireless standards. Discover more at Fabricante de CI.

CYW4356XKUBG Technical Specifications

Parámetro Valor
Product Category RF Transceiver ICs
Estilo de montaje Montaje en superficie
Package / Case WFBGA-104
Brand Tecnologías Infineon
Subcategory RF Integrated Circuits
Packaging Tray
Part Status Active
Unit Weight 0.027760 g

CYW4356XKUBG Key Features

  • Highly integrated RF transceiver, which simplifies system design and reduces component count for streamlined manufacturing and compact product layouts.
  • Surface mount package enables efficient automated assembly and reliable PCB mounting, ensuring consistent quality and high production throughput.
  • WFBGA-104 package provides a low-profile solution ideal for space-constrained applications, supporting sleek device designs and flexible placement.
  • Active lifecycle status ensures ongoing availability and logistics support for long-term projects and stable supply chains.

CYW4356XKUBG Advantages vs Typical Alternatives

This RF transceiver IC stands out from typical alternatives due to its compact WFBGA-104 package and surface mount design, which facilitate easier integration into modern electronics. Its active product status and robust brand backing ensure reliability, supply continuity, and suitability for scalable industrial or consumer applications. The streamlined architecture reduces BOM complexity, enhancing efficiency and overall product quality.

Aplicaciones típicas

  • Wireless communication modules ÿ Ideal for integration into embedded systems requiring reliable RF connectivity, such as industrial automation, sensor networks, and remote monitoring platforms.
  • Consumer electronics ÿ Suitable for devices needing compact, efficient wireless transceivers, including smart home products and portable electronics with space limitations.
  • IoT gateways and edge computing ÿ Enables seamless wireless data transmission in gateway devices that aggregate sensor or device data for industrial or smart city solutions.
  • Medical devices ÿ Appropriate for healthcare applications where compact, high-reliability wireless communication is essential for patient monitoring and diagnostics equipment.

CYW4356XKUBG Brand Info

Manufactured by Infineon Technologies, the CYW4356XKUBG reflects a commitment to advanced wireless integration and consistent quality. As part of Infineon??s broad portfolio of RF integrated circuits, this device is engineered to meet the rigorous demands of modern connectivity applications. Its design supports manufacturers and engineers in delivering products that require dependable wireless performance, backed by a trusted industry leader.

PREGUNTAS FRECUENTES

What package type does the CYW4356XKUBG use, and what are its benefits?

This device utilizes a WFBGA-104 package, which is a wafer-level fine-pitch ball grid array. The benefits include a compact footprint, reduced profile for space-constrained designs, and suitability for high-density PCB layouts in advanced electronics.

Is the CYW4356XKUBG suitable for automated assembly processes?

Yes, it features a surface mount design, making it compatible with automated pick-and-place equipment. This streamlines production, enhances assembly efficiency, and supports consistent product quality at scale.

What type of applications can benefit from the CYW4356XKUBG?

Applications such as wireless modules, IoT gateways, consumer electronics, and medical devices can benefit from its integration, reliability, and compact packaging. Its versatility makes it suitable for a wide range of wireless communication needs.

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How does the active status of the CYW4356XKUBG impact sourcing decisions?

Being listed as ??Active?? ensures that the component is currently in production and available for new designs. This reduces risks related to obsolescence and supply chain interruptions for ongoing and future projects.

Which brand manufactures the CYW4356XKUBG, and why is that significant?

This device is manufactured by Infineon Technologies, a globally recognized semiconductor company. Their expertise and scale provide confidence in long-term support, product reliability, and consistent quality for design engineers and sourcing professionals.

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