BCM4363KMMLW1G Wi-Fi 5 Combo Chipset Module | Wireless Network SoC | BGA Package

  • Provides advanced wireless connectivity enabling efficient data transmission and network access for various devices.
  • Supports high-speed data rates to ensure smooth communication and reduced latency in demanding environments.
  • Features a compact LFCSP package that optimizes board space and facilitates integration into tight hardware designs.
  • Ideal for embedded systems requiring reliable Wi-Fi performance in IoT or mobile computing applications.
  • Manufactured with rigorous quality controls to maintain consistent operation and long-term device stability.
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产品上方询盘

BCM4363KMMLW1G Overview

The BCM4363KMMLW1G is a high-performance wireless communication module designed for advanced connectivity solutions. It integrates dual-band 2.4 GHz and 5 GHz Wi-Fi capabilities with Bluetooth functionality, supporting IEEE 802.11ac standards for robust data throughput and reliable network performance. This compact, low-power device is optimized for embedded applications requiring seamless wireless integration, high sensitivity, and efficient power management. Engineered for industrial and consumer electronics, it provides enhanced link quality and secure communication, making it ideal for IoT devices, smart home products, and networking equipment. For detailed product sourcing and technical support, visit Fabricante de CI.

BCM4363KMMLW1G Technical Specifications

ParámetroEspecificación
Wi-Fi Standards SupportedIEEE 802.11ac, 802.11a/b/g/n
Frequency Bands2.4 GHz and 5 GHz dual-band
Bluetooth VersionBluetooth 4.1 (Dual Mode)
Transmit PowerUp to +20 dBm (typical)
Receiver Sensitivity-90 dBm (802.11ac)
Modulation SchemesBPSK, QPSK, 16-QAM, 64-QAM
Data RatesUp to 433 Mbps (5 GHz 802.11ac)
Tensión de funcionamiento3.3 V DC
Tipo de envaseSurface-mount module

BCM4363KMMLW1G Key Features

  • Dual-band 2.4 GHz and 5 GHz Wi-Fi: Enables flexible wireless connectivity with reduced interference, supporting high-speed data transfer and stable network performance.
  • Integrated Bluetooth 4.1: Supports dual-mode Bluetooth for seamless device pairing and low power consumption, enhancing compatibility with a wide range of peripherals.
  • High receiver sensitivity: Improves signal reception in challenging environments, resulting in better link reliability and extended wireless range.
  • Advanced modulation support: Employs BPSK, QPSK, 16-QAM, and 64-QAM schemes to optimize throughput and maintain connection quality under varying signal conditions.
  • Compact surface-mount module: Facilitates easy integration into embedded systems, saving board space while maintaining robust wireless performance.
  • Low power operation: Designed for energy-efficient applications, extending battery life in portable and IoT devices without compromising wireless capability.
  • Compliance with IEEE 802.11ac: Ensures compatibility with modern high-speed Wi-Fi networks, supporting bandwidth-intensive applications such as video streaming and data transfer.

BCM4363KMMLW1G Advantages vs Typical Alternatives

This module stands out with its combined dual-band Wi-Fi and integrated Bluetooth 4.1, offering superior connectivity flexibility compared to single-band or standalone wireless chips. Its high receiver sensitivity and support for advanced modulation methods provide enhanced signal robustness and throughput. The low power consumption and compact form factor make it ideal for embedded industrial and consumer applications, delivering reliable performance where space and energy efficiency are critical.

Aplicaciones típicas

  • Embedded wireless connectivity in IoT devices, enabling seamless integration of Wi-Fi and Bluetooth for smart sensor networks and remote monitoring systems.
  • Smart home automation products requiring reliable dual-band Wi-Fi and Bluetooth communication to control lighting, security, and HVAC systems.
  • Networking equipment such as routers and gateways benefiting from high throughput and robust signal reception in demanding environments.
  • Portable multimedia devices that demand energy-efficient, high-speed wireless connectivity for streaming and data synchronization.

BCM4363KMMLW1G Brand Info

The BCM4363KMMLW1G is part of a family of advanced wireless communication modules engineered for high reliability and performance in industrial and consumer electronics. Designed by a leading semiconductor innovator, this module leverages cutting-edge RF technology and integration to deliver strong Wi-Fi and Bluetooth connectivity within a compact footprint. The brand emphasizes ease of integration, energy efficiency, and compliance with current wireless standards, ensuring seamless interoperability with diverse systems and networking environments.

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What wireless standards does this module support?

The module supports IEEE 802.11ac, along with legacy 802.11a/b/g/n Wi-Fi standards, providing compatibility with a wide range of wireless networks. It also integrates Bluetooth 4.1 with dual-mode capability for versatile device communication.

How does the dual-band functionality benefit device design?

Dual-band support allows devices to operate on both 2.4 GHz and 5 GHz frequencies. This flexibility reduces interference, improves network speed, and enhances overall wireless reliability, especially in congested environments.

What is the typical power consumption profile of the module?

Designed for low power operation, the module minimizes energy usage during transmission and reception, making it suitable for battery-powered and portable devices where power efficiency is crucial.

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产品中间询盘

Can this module be integrated into compact embedded systems?

Yes, the surface-mount package and small form factor enable easy integration into space-constrained designs, supporting a wide range of embedded applications without requiring extensive board real estate.

What modulation schemes are supported, and why are they important?

It supports BPSK, QPSK, 16-QAM, and 64-QAM modulation schemes. These allow the module to adjust data rates and maintain signal quality under varying conditions, optimizing performance and reliability in dynamic wireless environments.

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