BCM43602A3KMLG Overview
The BCM43602A3KMLG is a highly integrated wireless communication IC designed to deliver robust Wi-Fi connectivity with enhanced power efficiency and performance. This device supports dual-band 2.4 GHz and 5 GHz operation, enabling reliable data transmission in various networking environments. With integrated components that reduce external parts count, it simplifies system design and accelerates time-to-market for IoT and mobile applications. The compact packaging and comprehensive feature set make it an ideal solution for engineers focusing on high-performance wireless modules. Further details are available at Fabricante de CI.
BCM43602A3KMLG Technical Specifications
| Parámetro | Especificación |
|---|---|
| Wireless Standards | IEEE 802.11ac/a/b/g/n |
| Frequency Bands | 2.4 GHz and 5 GHz dual-band support |
| Modulation Schemes | BPSK, QPSK, 16-QAM, 64-QAM |
| Maximum Data Rate | Up to 867 Mbps (802.11ac) |
| Transmit Power | Up to +20 dBm (typical, configurable) |
| Receiver Sensitivity | -92 dBm @ 6 Mbps (802.11a) |
| Power Supply | 3.3 V ??5% |
| Tipo de envase | QFN, 48-pin |
| Temperatura de funcionamiento | De -40 °C a +85 °C |
BCM43602A3KMLG Key Features
- Dual-band support enables seamless operation across both 2.4 GHz and 5 GHz frequencies, providing enhanced connectivity and reduced interference in crowded wireless environments.
- Integrated MAC, baseband, and RF components minimize external parts, simplifying board layout and improving overall system reliability.
- High data throughput up to 867 Mbps supports bandwidth-intensive applications, ensuring smooth video streaming and fast data transfers.
- Advanced power management reduces power consumption, extending battery life in portable and IoT devices without sacrificing performance.
BCM43602A3KMLG Advantages vs Typical Alternatives
This device offers superior integration by combining MAC, baseband, and RF functions in a single compact package, reducing design complexity. Its dual-band operation and high data rates provide better wireless performance compared to many conventional single-band modules. Enhanced power efficiency and wide operating temperature range ensure reliable operation in industrial and consumer applications, making it a versatile and dependable choice for engineers.
Productos más vendidos
Texas Instruments BQ24075 Cargador de batería lineal IC - Paquete QFN de 5mm x 4mm
Texas Instruments INA219 Módulo sensor de corriente - encapsulado SOIC, monitorización de precisión
Texas Instruments LM4041 Referencia de tensión de precisión - Encapsulado SOT-23
Texas Instruments OPA2134 Audio Op Amp - Dual, alto rendimiento, encapsulado SOIC-8
Aplicaciones típicas
- Embedded wireless modules for IoT devices requiring stable dual-band Wi-Fi connectivity with low power consumption in compact form factors.
- Mobile computing devices such as tablets and laptops that benefit from high-speed 802.11ac wireless standards for fast internet access.
- Smart home automation products needing reliable Wi-Fi links to support real-time data exchange and control.
- Industrial wireless communication systems that demand robust performance under varying temperature and interference conditions.
BCM43602A3KMLG Brand Info
The BCM43602A3KMLG is a product from a leading semiconductor manufacturer specializing in advanced wireless communication solutions. This integrated IC exemplifies the brand??s commitment to delivering high-performance, energy-efficient wireless technologies that enable smarter connectivity in diverse applications. Its design reflects years of expertise in RF, baseband, and MAC integration, providing engineers with a reliable and scalable platform for next-generation networking devices.
PREGUNTAS FRECUENTES
What wireless standards does this IC support?
It supports IEEE 802.11ac, as well as legacy 802.11a/b/g/n standards, enabling backward compatibility and high-speed data transfer on both 2.4 GHz and 5 GHz bands.
Productos destacados
"Compre el comparador de tensión de precisión MAX9312ECJ+ en encapsulado DIP para un rendimiento fiable"
QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
Modelo 0339-671-TLM-E - Paquete TLM-E de alto rendimiento para una funcionalidad mejorada
1-1415898-4 Carcasa del conector, cable eléctrico a placa, receptáculo, empaquetado
How does the dual-band capability benefit my application?
Dual-band operation allows devices to switch between 2.4 GHz and 5 GHz frequencies, reducing interference and congestion, which results in improved connectivity reliability and higher throughput.
What is the typical operating voltage for this device?
The device operates at a nominal voltage of 3.3 V with a tolerance of ??5%, ensuring compatibility with standard power supply rails in embedded systems.
Contacto
Can this IC operate in industrial temperature ranges?
Yes, it supports an extended operating temperature range from -40??C up to +85??C, making it suitable for industrial and harsh environment applications.
What packaging options are available for this module?
The product is available in a 48-pin QFN package, which offers a compact footprint and good thermal performance for efficient integration into various system designs.
