BCM43465C0KMMLW1G Overview
The BCM43465C0KMMLW1G is a highly integrated wireless communication module designed for advanced connectivity applications. It combines Wi-Fi and Bluetooth functionality on a single chip, streamlining design complexity while enhancing performance. Optimized for low power consumption and robust signal quality, this device supports high data throughput and reliable wireless links. Its compact package and extensive protocol support make it ideal for embedded systems requiring seamless wireless integration. Engineers and sourcing specialists will find this module suitable for industrial and consumer electronics applications demanding efficient wireless connectivity. For more detailed product information, visit Fabricante de CI.
BCM43465C0KMMLW1G Technical Specifications
| Parámetro | Especificación |
|---|---|
| Wireless Protocols Supported | 802.11 b/g/n (2.4 GHz), Bluetooth 4.2 |
| Frecuencia de funcionamiento | 2.4 GHz ISM Band |
| Wi-Fi Data Rate | Up to 150 Mbps (802.11n) |
| Bluetooth Data Rate | Up to 3 Mbps (Enhanced Data Rate) |
| Transmit Power | Up to +20 dBm |
| Receive Sensitivity | -92 dBm (802.11n, 20 MHz) |
| Tensión de funcionamiento | 3.3 V |
| Tipo de envase | MLP (Multi-Layer Package), 12 x 12 x 1.5 mm |
| Interfaz | SDIO 2.0, UART, PCM |
| Temperatura de funcionamiento | De -40 °C a +85 °C |
BCM43465C0KMMLW1G Key Features
- Dual-mode wireless connectivity: Combines 2.4 GHz Wi-Fi and Bluetooth 4.2 on one chip, enabling versatile communication options for embedded applications.
- Alto rendimiento de datos: Supports 802.11n speeds up to 150 Mbps, ensuring fast and reliable wireless transfers suitable for demanding data applications.
- Bajo consumo de energía: Designed for energy-efficient operation, extending battery life in portable and IoT devices.
- Robust signal performance: Enhanced receive sensitivity and transmit power optimize wireless range and connection stability in challenging environments.
- Compact MLP package: Saves PCB space and simplifies integration in space-constrained designs.
- Opciones de interfaz flexibles: Supports SDIO, UART, and PCM interfaces, allowing easy integration with a variety of host processors and audio components.
- Industrial temperature range: Operates reliably from -40??C to +85??C, suitable for rugged industrial and outdoor deployments.
BCM43465C0KMMLW1G Advantages vs Typical Alternatives
This module offers superior integration by combining Wi-Fi and Bluetooth 4.2 on a single chip, reducing component count and PCB complexity compared to discrete solutions. Its high transmit power and excellent receive sensitivity deliver better wireless range and reliability. Low power consumption enables longer operating times in battery-powered devices. The compact MLP package enhances design flexibility in space-limited applications. Overall, it provides a balanced solution with robust performance and ease of integration compared to typical wireless modules.
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Aplicaciones típicas
- Embedded wireless connectivity in industrial automation systems, where reliable 2.4 GHz Wi-Fi and Bluetooth communication are critical for real-time control and monitoring over extended temperature ranges.
- Smart home devices requiring seamless Wi-Fi and Bluetooth connectivity for remote control and data exchange.
- Wearable electronics benefiting from low power wireless links and compact form factor for comfortable integration.
- IoT sensor nodes that need dual-mode wireless communication with efficient power management and stable connections.
BCM43465C0KMMLW1G Brand Info
The BCM43465C0KMMLW1G is part of a well-established family of wireless communication solutions developed by a leading semiconductor provider specializing in connectivity ICs. This brand is known for delivering high-performance, reliable wireless modules that meet the rigorous demands of industrial, consumer, and IoT markets. The product leverages proven technology to ensure interoperability, compliance with global wireless standards, and robust system-level integration. It supports developers with comprehensive documentation and design resources to accelerate time-to-market for diverse wireless applications.
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What wireless standards does this module support?
This device supports IEEE 802.11 b/g/n standards operating in the 2.4 GHz ISM band for Wi-Fi, as well as Bluetooth 4.2 technology. This combination enables versatile wireless communication for a wide range of applications including data networking and device pairing.
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What are the interface options available for connectivity?
The module offers multiple interface options including SDIO 2.0 for Wi-Fi data transfer, UART for serial communication, and PCM for audio data. These interfaces provide flexibility for integration with different host processors and peripherals.
What is the operating temperature range for reliable performance?
The module is rated to operate between -40??C and +85??C, making it suitable for industrial and outdoor environments where temperature extremes are common, ensuring dependable wireless communication under harsh conditions.
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How does the BCM43465C0KMMLW1G manage power consumption?
Designed with energy efficiency in mind, the module minimizes power draw during active and idle states. This is essential for battery-powered and portable devices, allowing longer operating times without compromising wireless performance.
What package type does this wireless module use and why is it important?
The device comes in a Multi-Layer Package (MLP) measuring 12 x 12 x 1.5 mm. This compact footprint is crucial for space-constrained applications, enabling designers to implement advanced wireless connectivity without increasing product size.
