BCM43455XKUBG Wi-Fi 5 Combo Chipset Module ?C Integrated Wireless SoC Package

  • This device enables wireless connectivity, allowing seamless data exchange in embedded systems and IoT applications.
  • It supports dual-band operation, enhancing network flexibility and reducing interference in crowded environments.
  • The compact LFCSP package ensures efficient board space usage, ideal for size-constrained hardware designs.
  • BCM43455XKUBG is suitable for smart home devices, providing stable connections for real-time monitoring and control.
  • Manufactured with rigorous quality controls, it delivers consistent performance and long-term operational reliability.
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产品上方询盘

BCM43455XKUBG Overview

The BCM43455XKUBG is a high-performance, integrated wireless connectivity solution designed to support Wi-Fi and Bluetooth communication in compact and power-sensitive applications. Combining advanced 2.4 GHz and 5 GHz dual-band Wi-Fi capabilities with Bluetooth 5.0 functionality, it enables reliable, high-speed data transfer and robust short-range wireless connectivity. Its small footprint and system-level integration make it ideal for embedded systems requiring efficient, seamless networking. Engineers and sourcing specialists value this module for its optimized power consumption and ease of integration, making it a preferred choice for modern IoT and consumer electronics devices. For detailed technical guidance and procurement, visit the Fabricante de CI.

BCM43455XKUBG Technical Specifications

ParámetroEspecificación
Wi-Fi Standards SupportedIEEE 802.11a/b/g/n/ac (2.4 GHz & 5 GHz bands)
Bluetooth VersionBluetooth 5.0 (BR/EDR and LE)
Frecuencia de funcionamiento2.4 GHz and 5 GHz dual-band
Maximum Data RateUp to 433 Mbps (802.11ac)
Host InterfaceSDIO 3.0 / UART / PCM
Transmit PowerUp to +18 dBm (typical)
Tipo de envaseSurface-mount module, compact form factor
Tensión de alimentación3.3 V nominal
SeguridadWPA3, WPA2, WEP, TKIP, AES encryption
Temperatura de funcionamientoDe -40 °C a +85 °C

BCM43455XKUBG Key Features

  • Dual-band Wi-Fi support (2.4 GHz and 5 GHz) enhances network flexibility, allowing devices to avoid congestion and improve data throughput.
  • Bluetooth 5.0 integration ensures low-energy wireless communication with extended range and improved coexistence with Wi-Fi, benefiting IoT and wearable devices.
  • Compact system-in-package design simplifies PCB layout and reduces overall device size, critical for space-constrained embedded applications.
  • Advanced security protocols including WPA3 provide enhanced protection for wireless communications, safeguarding sensitive data transmissions.
  • High transmit power and sensitivity improve connectivity reliability and range, enabling stable performance even in challenging wireless environments.
  • Multiple host interfaces (SDIO, UART, PCM) offer flexible integration options with various microcontrollers and processors.
  • Bajo consumo de energía optimizes battery life in portable devices without compromising wireless performance.

BCM43455XKUBG Advantages vs Typical Alternatives

This wireless connectivity module stands out due to its integrated dual-band Wi-Fi and Bluetooth 5.0 capabilities, delivering superior data rates and extended range compared to many single-band or legacy Bluetooth solutions. Its compact package reduces system complexity and assembly costs, while enhanced security features ensure robust protection. The combination of high transmit power with low power consumption makes it more efficient and reliable for embedded applications than typical alternatives in the same class.

Aplicaciones típicas

  • Smart home devices requiring seamless Wi-Fi and Bluetooth connectivity for remote control and automation, benefiting from dual-band performance and low power consumption.
  • Wearable electronics where compact size and Bluetooth 5.0 low-energy support enable long battery life and reliable wireless data exchange.
  • Industrial IoT applications demanding robust wireless communication in harsh environments with extended operating temperature range.
  • Consumer electronics such as smart TVs, set-top boxes, and media players needing high-throughput Wi-Fi and secure Bluetooth connections for content streaming and peripheral pairing.

BCM43455XKUBG Brand Info

This module is part of a well-established line of wireless connectivity solutions known for their integration, performance, and reliability. Designed and manufactured by a leading semiconductor company specializing in wireless communication technology, it reflects the brand??s commitment to innovation and quality. The product benefits from extensive technical support and comprehensive documentation, making it a trusted choice among engineers for embedding advanced wireless functionality into a wide range of electronic systems.

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What wireless standards does this module support?

The device supports IEEE 802.11a/b/g/n/ac standards for Wi-Fi, operating on both 2.4 GHz and 5 GHz frequency bands. It also includes Bluetooth 5.0 support, covering both classic BR/EDR and low energy (LE) modes for versatile wireless communication.

How does the module handle power consumption in portable devices?

It incorporates power-saving modes and efficient hardware design to minimize energy use during both active and idle states. This optimization extends battery life in portable and wearable applications without compromising wireless performance.

What security protocols are supported to protect wireless communication?

Security features include WPA3, WPA2, WEP, TKIP, and AES encryption standards. These protocols ensure strong data protection and secure network access, critical for sensitive or commercial applications.

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产品中间询盘

What types of host interfaces are available for integration?

The module supports multiple host interfaces such as SDIO 3.0, UART, and PCM, providing flexible options for connecting with a wide variety of microcontrollers and processors in embedded systems.

Can this module operate in industrial temperature environments?

Yes, it is designed to operate reliably within a temperature range of -40??C to +85??C, making it suitable for industrial and harsh environment applications requiring stable wireless connectivity.

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