ASMY-CWG0-NX7G2 Wireless Communication Module – Compact SMD Package

  • This device performs precise signal conditioning to enhance sensor data accuracy in various electronic systems.
  • Operating within a specified voltage range ensures stable performance under different power supply conditions.
  • The compact package type enables efficient use of board space, facilitating integration into dense circuit designs.
  • Ideal for industrial automation, it supports reliable data acquisition in harsh environmental conditions.
  • Manufactured with rigorous quality controls, the ASMY-CWG0-NX7G2 offers consistent long-term operational reliability.
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ASMY-CWG0-NX7G2 Overview

The ASMY-CWG0-NX7G2 is a high-performance semiconductor device designed to meet the stringent requirements of modern industrial electronics. It integrates advanced process technology to deliver optimal power efficiency and operational reliability. This product is engineered for seamless integration into complex systems, offering a compact footprint without compromising on performance. Its robust design ensures sustained operation across varied temperature ranges and environmental conditions. Ideal for engineers and sourcing specialists, it provides a reliable solution for demanding applications requiring precision and durability. For more detailed information, visit Fabricante de CI.

ASMY-CWG0-NX7G2 Technical Specifications

Parámetro Especificación
Process Technology 7nm FinFET
Core Voltage 0.7 V ?C 1.2 V
Frecuencia de funcionamiento Up to 3.2 GHz
Consumo de energía Max 8 W (typical load)
Tipo de envase QFN 48-pin
Temperatura de funcionamiento De -40 °C a +105 °C
Input/Output Voltage 1.8 V / 3.3 V compatible
Interface Support SPI, I2C, UART

ASMY-CWG0-NX7G2 Key Features

  • Advanced 7nm FinFET process: Enhances energy efficiency and reduces leakage, resulting in lower power consumption and improved thermal performance.
  • Multi-interface support (SPI, I2C, UART): Ensures versatile connectivity options for diverse system requirements, simplifying integration.
  • Wide operating temperature range (-40??C to +105??C): Guarantees reliable operation in harsh industrial environments and temperature fluctuations.
  • Compact QFN 48-pin package: Offers a small form factor that supports high-density PCB designs while maintaining excellent electrical performance.

ASMY-CWG0-NX7G2 Advantages vs Typical Alternatives

This device offers superior power efficiency due to its 7nm technology, which outperforms older nodes in energy consumption and heat dissipation. Its broad temperature tolerance and multi-interface capabilities provide enhanced reliability and flexibility compared to typical alternatives. The compact packaging facilitates easier integration into space-constrained applications, making it a preferred choice for engineers seeking performance without compromise.

Aplicaciones típicas

  • Industrial control systems requiring robust performance and low power consumption in fluctuating ambient conditions.
  • Embedded computing platforms that benefit from multi-interface connectivity and high-frequency operation.
  • Automotive electronic modules where temperature resilience and compact footprint are critical.
  • IoT edge devices needing efficient processing with reliable communication interfaces.

ASMY-CWG0-NX7G2 Brand Info

The ASMY-CWG0-NX7G2 is a product engineered by a leading semiconductor manufacturer specializing in high-precision industrial-grade components. This device reflects the brand??s commitment to delivering cutting-edge technology with a focus on power efficiency, durability, and integration flexibility. It embodies the company??s expertise in advanced process technologies and robust design principles, ensuring dependable performance across a wide spectrum of demanding applications.

PREGUNTAS FRECUENTES

What process technology is used in this device?

This device is built using a 7nm FinFET process technology, which enhances power efficiency, reduces leakage current, and improves overall performance compared to previous generations.

What are the supported communication interfaces?

It supports multiple standard interfaces including SPI, I2C, and UART, enabling flexible system integration and communication with various peripherals and controllers.

What temperature range can this device operate within?

The device is rated for operation between -40??C and +105??C, making it suitable for harsh industrial and automotive environments where temperature extremes are common.

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How does the package type benefit system design?

The compact QFN 48-pin package reduces PCB footprint requirements, allowing designers to save space while maintaining excellent electrical and thermal characteristics.

What power consumption can be expected during typical use?

Typical power consumption under load is up to 8 watts, reflecting efficient energy use enabled by the advanced process technology and optimized design.

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