AR35-L25E-PB11 Relé industrial de alto rendimiento, paquete de 10

AR35-L25E-PB11 Overview

The AR35-L25E-PB11 is a high-performance electronic component designed for industrial applications requiring precise operation and robust reliability. Engineered to deliver consistent performance under demanding conditions, it incorporates advanced semiconductor technology to optimize power efficiency and signal integrity. This product is ideal for engineers and sourcing specialists seeking reliable solutions with proven durability and integration flexibility. Its compact form factor and well-defined electrical characteristics enable seamless incorporation into a variety of systems. For detailed product insights and specifications, visit Fabricante de CI.

AR35-L25E-PB11 Technical Specifications

Parámetro	Especificación
Tensión de alimentación (VCC)	2,7 V a 3,6 V
Temperatura de funcionamiento	De -40 °C a +85 °C
Corriente de salida	Max 25 mA
Tipo de envase	Small Outline Package (SOP-8)
Input Signal Frequency Range	Up to 35 MHz
Disipación de potencia	150 mW max
Logic Compatibility	TTL / CMOS
Número de agujas	8 clavijas

AR35-L25E-PB11 Key Features

• Amplio rango de tensión de funcionamiento: Supports 2.7 V to 3.6 V, enabling compatibility with standard industrial power supplies and enhancing system flexibility.
• High-Frequency Operation: Capable of handling input signals up to 35 MHz, allowing for fast signal processing in complex electronic circuits.
• Compact SOP-8 Package: Facilitates space-saving PCB layouts while maintaining robust mechanical stability for industrial environments.
• Baja disipación de energía: Consumes a maximum of 150 mW, promoting energy efficiency and reducing thermal management requirements.
• TTL and CMOS Logic Compatibility: Ensures seamless integration with a broad range of digital logic levels, simplifying design considerations.
• Reliable Temperature Range: Operates reliably from -40 ??C to +85 ??C, suitable for harsh industrial settings and extended temperature applications.
• Consistent Output Current Capability: Provides up to 25 mA output current, supporting driving of downstream components without additional amplification.

AR35-L25E-PB11 Advantages vs Typical Alternatives

This device offers superior integration capabilities with a wide operating voltage range and high-frequency handling, outperforming typical alternatives that may lack such flexibility. Its low power consumption and broad temperature range enhance reliability and efficiency in industrial applications. The compact SOP-8 package also streamlines PCB design, making it a preferred choice for engineers prioritizing space and performance.

Aplicaciones típicas

• Industrial signal conditioning systems requiring high-frequency input processing and stable output current delivery for precise control.
• Embedded control units in manufacturing equipment, benefiting from low power dissipation and wide voltage compatibility.
• Communication interface modules where TTL/CMOS logic compatibility ensures smooth data transmission and reception.
• Power management circuits in automation systems, leveraging the device??s robust temperature range for reliable operation.

AR35-L25E-PB11 Brand Info

The AR35-L25E-PB11 is part of an established product line from a leading semiconductor manufacturer, recognized for delivering industry-grade components optimized for challenging industrial environments. The brand emphasizes quality, precision engineering, and comprehensive support, ensuring that this product meets stringent performance and reliability standards. This model exemplifies the company??s commitment to innovation and practical design, serving the needs of engineers and sourcing specialists worldwide.

PREGUNTAS FRECUENTES

What is the maximum operating frequency supported by this product?

The device supports input signal frequencies up to 35 MHz, making it suitable for applications that require rapid signal processing and high-speed data handling in industrial and embedded systems.

Can this component operate under extreme temperature conditions?

Yes, it is designed to function reliably within a temperature range of -40 ??C to +85 ??C, ensuring stable performance in harsh industrial environments and varying operational conditions.

What package type does the device use, and how does it benefit PCB design?

The component comes in a Small Outline Package (SOP-8), which is compact and facilitates efficient use of PCB space while providing mechanical stability and ease of soldering in automated assembly processes.

Is the device compatible with both TTL and CMOS logic levels?

Yes, it supports both TTL and CMOS logic levels, allowing for versatile integration into different digital systems without the need for additional level shifting or interface components.

What is the typical power consumption of the device during operation?

The device has a maximum power dissipation of 150 mW, promoting energy efficiency and reducing the need for extensive thermal management in system designs.