CY74FCT162244ETPAC 16Mb SRAM Memory IC – High-Speed CMOS, TSSOP-44 Package

  • This device functions as a bus transceiver, enabling efficient data transfer between two buses in digital systems.
  • Featuring a 16-bit width, it supports wide data paths for faster and more efficient communication.
  • Its compact TSSOP-44 package reduces board space, aiding in high-density circuit designs.
  • Ideal for memory interfacing in embedded systems, it simplifies data routing and signal management.
  • Manufactured with strict quality controls, it ensures consistent performance in demanding applications.
产品上方询盘

CY74FCT162244ETPAC Overview

The CY74FCT162244ETPAC is a high-performance 16-bit by 24-bit FIFO memory device designed for demanding industrial and digital system applications. Featuring fast access times and low power consumption, this FIFO buffer supports efficient data storage and retrieval, making it ideal for high-speed data communication and processing tasks. Its robust architecture ensures reliable operation under various environmental conditions, meeting the stringent standards of modern electronics. This device is sourced from a trusted IC-Hersteller, delivering consistent quality and performance for complex system designs.

CY74FCT162244ETPAC Technical Specifications

Parameter Spezifikation
Data Width 16 Bits
Depth 24 words
Betriebsspannung 5 V ??10%
Maximale Taktfrequenz 100 MHz
Ausbreitungsverzögerung 5 ns (typical)
Paket Typ 64-Pin TQFP
Betriebstemperaturbereich 0??C to 70??C
Stromverbrauch Low power CMOS technology
Signal I/O TTL compatible inputs and outputs

CY74FCT162244ETPAC Key Features

  • High-Speed FIFO Architecture: Enables fast data buffering and transfer, reducing system bottlenecks and improving throughput in timing-critical applications.
  • Wide Data Bus: With a 16-bit width, it allows parallel data processing, enhancing communication efficiency in complex digital systems.
  • Low Power CMOS Technology: Minimizes power dissipation, which is essential for energy-conscious industrial environments and portable electronics.
  • Robuste Verpackung: The 64-pin TQFP package supports efficient PCB layout and thermal dissipation, improving overall system reliability.

CY74FCT162244ETPAC Advantages vs Typical Alternatives

This device offers superior speed and data width compared to typical FIFO memories, providing enhanced throughput and reduced latency. Its low power CMOS design ensures energy-efficient operation without compromising reliability. The wide operating voltage range and robust packaging make it suitable for harsh industrial environments, giving it an edge over standard solutions that may lack these integrated benefits.

Typische Anwendungen

  • High-speed data buffering in communication systems, where rapid and reliable data storage and retrieval are critical for maintaining signal integrity and system performance.
  • Digital signal processing pipelines requiring fast, parallel data access for real-time computing tasks.
  • Interface bridging between asynchronous data streams in embedded systems, enhancing synchronization and data flow management.
  • Industrial automation controllers that demand robust and consistent memory performance under varying operational conditions.

CY74FCT162244ETPAC Brand Info

The CY74FCT162244ETPAC is part of a product lineup from a well-established semiconductor manufacturer known for delivering high-quality, reliable integrated circuits tailored for industrial and commercial applications. This FIFO memory device embodies the brand??s commitment to innovation, precision engineering, and stringent quality control, ensuring dependable performance in complex electronic designs.

FAQ

What are the key timing characteristics of this FIFO memory device?

The FIFO offers a typical propagation delay of approximately 5 nanoseconds, supporting clock frequencies up to 100 MHz. This fast timing performance enables efficient data handling in high-speed digital circuits, reducing latency and improving overall system throughput.

What packaging options are available for this product?

This device is supplied in a 64-pin Thin Quad Flat Package (TQFP), which facilitates compact PCB layout and improved thermal management. The TQFP package is well-suited for surface-mount assembly in industrial and commercial electronic designs.

How does the operating voltage range affect device compatibility?

Operating at a standard 5V ??10% voltage range, the FIFO is compatible with most TTL logic levels, ensuring ease of integration into existing systems. This voltage specification supports stable operation within typical industrial power supply tolerances.

📩 Kontakt

产品中间询盘

Can this FIFO be used in harsh environmental conditions?

Yes, the device is rated for operation between 0??C and 70??C, suitable for most commercial and industrial environments. Its robust CMOS design and packaging contribute to reliable performance under these temperature ranges.

What are the advantages of the 16

Anmeldung

, ,

Kosten und Zeit sparen

Schnelle weltweite Lieferung

Originalteile garantiert

Kompetente Unterstützung nach dem Kauf

Suchen Sie einen besseren Preis?