CY23S02SC-1 Overview
The CY23S02SC-1 is a high-performance 2Mbit serial CMOS SRAM designed for industrial and embedded system applications requiring reliable, low-power, and fast-access memory solutions. Featuring a 2-megabit density organized as 256K x 8 bits, it operates on a single 2.7V to 3.6V power supply, making it ideal for portable and power-sensitive designs. Its synchronous SRAM architecture ensures seamless integration with microcontrollers and FPGAs, offering consistent and predictable timing. This memory device is supplied in a compact 8-pin SOIC package, supporting standard SPI interface signals for easy board-level implementation. For detailed technical resources, visit IC-Hersteller.
CY23S02SC-1 Technical Specifications
Parameter | Spezifikation |
---|---|
Speicherdichte | 2 Mbit (256K x 8 bits) |
Schnittstelle | SPI (Serielle Peripherie-Schnittstelle) |
Betriebsspannung | 2,7 V bis 3,6 V |
Zugriffszeit | 70 ns (max) |
Paket Typ | 8-pin SOIC |
Datenspeicherung Spannung | 1.5 V (minimum) |
Betriebstemperaturbereich | -40??C bis +85??C |
Stromverbrauch | 5 mA (typical operating) |
Standby Current | 1 ??A (max) |
Schreib-Zykluszeit | 100 ns (max) |
CY23S02SC-1 Key Features
- High-speed SPI interface: Enables fast serial data communication, reducing latency and improving system throughput in embedded designs.
- Low voltage operation: Supports a wide supply voltage range from 2.7 V to 3.6 V, which is critical for battery-powered and low-power industrial applications.
- Compact 8-pin SOIC package: Facilitates space-saving PCB layouts and easy integration into existing designs with standard footprints.
- Breiter Betriebstemperaturbereich: Ensures stable performance in harsh environments, from -40??C up to +85??C, suitable for industrial-grade reliability.
CY23S02SC-1 Advantages vs Typical Alternatives
This memory device offers a distinct advantage with its low power consumption and high-speed SPI interface, optimizing both energy efficiency and performance. Compared to parallel SRAM alternatives, it simplifies board design through reduced pin count and smaller package size, while maintaining robust data retention and fast access times. Its industrial temperature rating further enhances reliability under demanding conditions, making it a preferred choice for embedded and industrial memory needs.
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Typische Anwendungen
- Embedded systems requiring non-volatile, high-speed serial SRAM for data buffering and fast storage access, such as network routers and industrial controllers.
- Battery-operated devices that demand low voltage and minimal power consumption to extend battery life without compromising speed.
- FPGA and microcontroller systems that require compact and reliable external memory with SPI communication for efficient data exchange.
- Industrial automation equipment operating under wide temperature ranges, ensuring consistent memory performance in harsh environments.
CY23S02SC-1 Brand Info
The CY23S02SC-1 is manufactured by a leading semiconductor producer specializing in high-reliability memory solutions for industrial and embedded applications. The product reflects the company’s commitment to delivering durable, energy-efficient, and high-performance serial SRAM devices. Known for stringent quality control and comprehensive technical support, this brand ensures integration ease and dependable operation across diverse industrial sectors.
FAQ
What is the typical power consumption of this serial SRAM during operation?
The device typically consumes around 5 mA of current during active operation, making it suitable for applications where low power usage is a priority. In standby mode, the current drops significantly to a maximum of 1 ??A, which helps extend battery life in portable systems.
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What are the operating voltage requirements for this memory chip?
This SRAM operates within a supply voltage range of 2.7 V to 3.6 V. This flexibility allows it to be used in systems powered by standard 3.3 V rails as well as lower voltage battery-powered devices without additional voltage regulation.
How does the SPI interface benefit system integration?
The SPI