BCM43602KMLG Wi-Fi 802.11ac Wireless Network Chipset – QFN Package

  • This chip provides advanced wireless connectivity, enabling stable and efficient network communication for devices.
  • It supports high data throughput, ensuring smooth performance in bandwidth-intensive applications.
  • The compact LFCSP package reduces board space, allowing for smaller device designs and easier integration.
  • Ideal for mobile and embedded systems where reliable Wi-Fi connectivity enhances user experience and device functionality.
  • Engineered to meet rigorous quality standards, ensuring consistent operation under various environmental conditions.
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BCM43602KMLG Overview

The BCM43602KMLG is a high-performance wireless communication module designed for seamless integration in industrial and consumer electronics. It delivers robust Wi-Fi connectivity with advanced IEEE 802.11ac support, enabling reliable data transfer at high throughput rates. Featuring dual-band operation and multiple input multiple output (MIMO) technology, this device ensures enhanced signal quality and extended range. Compact and power-efficient, the BCM43602KMLG is ideal for embedded applications requiring stable wireless networking. For sourcing and technical insights, visit IC-Hersteller.

BCM43602KMLG Technical Specifications

ParameterSpezifikation
Wireless StandardIEEE 802.11ac Wave 2
Frequency Bands2.4 GHz and 5 GHz dual-band
Maximum Data RateUp to 867 Mbps
ModulationOFDM with 256-QAM
SendeleistungUp to 20 dBm
Empfindlichkeit des Empfängers-92 dBm @ 6 Mbps
SchnittstellenSDIO 3.0, PCM, UART
Stromversorgung3.3 V DC
Betriebstemperaturbereich-40??C bis +85??C
Paket TypSurface-mount module

BCM43602KMLG Key Features

  • Dual-Band Wi-Fi Support: Enables simultaneous operation on 2.4 GHz and 5 GHz bands, improving network flexibility and reducing interference for reliable connectivity.
  • High Data Throughput: Supports data rates up to 867 Mbps with 256-QAM modulation, facilitating fast and efficient wireless communication suitable for bandwidth-intensive applications.
  • Advanced MIMO Technology: Utilizes multiple antennas to enhance signal quality and range, ensuring stable connections in challenging RF environments.
  • Niedriger Stromverbrauch: Designed for power-efficient operation, this module extends device battery life and minimizes thermal output in embedded systems.
  • Rich Interface Support: Offers SDIO 3.0, UART, and PCM interfaces for easy integration with a wide range of host processors and audio devices.
  • Wide Operating Temperature: Suitable for industrial applications, it operates reliably across a broad temperature range from -40??C to +85??C.
  • Compact Surface-Mount Design: Enables space-saving PCB layouts and simplifies assembly in compact devices.

BCM43602KMLG Advantages vs Typical Alternatives

This wireless module offers superior dual-band performance with high data rates and advanced MIMO capabilities, providing better signal reliability and throughput than typical single-band or legacy Wi-Fi devices. Its low power consumption and extended operating temperature range make it ideal for industrial and embedded applications where efficiency and robustness are critical. The integration flexibility and multiple interfaces further differentiate it from standard alternatives, ensuring seamless system integration.

Typische Anwendungen

  • Embedded wireless connectivity in IoT devices, enabling fast and reliable data exchange in smart home and industrial automation systems.
  • Wireless networking modules for consumer electronics requiring dual-band Wi-Fi support and high throughput.
  • Integration in handheld terminals and portable devices where compact footprint and power efficiency are essential.
  • Industrial control systems demanding robust wireless communication under wide temperature conditions.

BCM43602KMLG Brand Info

The BCM43602KMLG is part of a well-established product line known for delivering advanced wireless communication solutions tailored for demanding industrial and commercial environments. Manufactured to meet stringent quality and performance standards, this module exemplifies reliability and integration ease. It supports modern Wi-Fi standards and offers comprehensive interface options, reflecting the brand??s commitment to enabling next-generation connectivity in embedded and IoT applications.

FAQ

What wireless standards does the BCM43602KMLG support?

This module supports IEEE 802.11ac Wave 2, providing dual-band operation in both 2.4 GHz and 5 GHz frequencies. This ensures compatibility with modern Wi-Fi networks and delivers high data throughput for efficient wireless communication.

What interfaces are available for system integration?

The device includes SDIO 3.0 for high-speed data transfer, UART for serial communication, and PCM for audio data. These interfaces enable flexible connectivity options with various host processors and peripherals.

Can this module operate in harsh industrial environments?

Yes, the BCM43602KMLG is rated for operation across a wide temperature range from -40??C to +85??C, making it suitable for industrial and outdoor applications where temperature extremes are common.

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How does the module enhance wireless signal quality?

It employs advanced MIMO technology, which uses multiple antennas to improve signal strength, reduce interference, and extend communication range. This results in more reliable and stable wireless connections.

What power requirements does this device have?

The module operates with a 3.3 V DC power supply and is designed for low power consumption, optimizing battery life and thermal management in embedded and portable applications.

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