BCM43525C0KMMLW1G Wi-Fi 6 Dual-Band Module in M.2 Package

BCM43525C0KMMLW1G Overview

The BCM43525C0KMMLW1G is a highly integrated Wi-Fi and Bluetooth combo solution designed for advanced wireless connectivity in compact embedded systems. This device supports dual-band 2.4 GHz and 5 GHz Wi-Fi operations alongside Bluetooth 5.0 capabilities, providing versatile communication standards for IoT, mobile, and industrial applications. Its low power consumption and small form factor enable seamless integration into space-constrained environments while maintaining robust performance. The device’s advanced coexistence mechanisms and support for multiple wireless protocols make it an optimal choice for engineers and sourcing specialists aiming to enhance connectivity without compromising system efficiency. For detailed sourcing and technical support, visit IC-Hersteller.

BCM43525C0KMMLW1G Technical Specifications

BCM43525C0KMMLW1G Key Features

• Dual-Band Wi-Fi (2.4 GHz and 5 GHz): Enables higher data throughput and reduced interference, providing reliable wireless connectivity in crowded environments.
• Unterstützung von Bluetooth 5.0: Offers extended range and improved data transfer rates, essential for modern IoT and mobile applications.
• Advanced Coexistence Mechanisms: Ensures simultaneous operation of Wi-Fi and Bluetooth without performance degradation, enhancing system reliability.
• Niedriger Stromverbrauch: Optimizes battery life in portable and embedded devices, critical for energy-efficient designs.
• SDIO 3.0 Interface: Facilitates high-speed data communication with host processors, simplifying integration into existing systems.
• Kompaktes QFN-Gehäuse: Supports space-constrained applications while maintaining thermal efficiency and signal integrity.
• Breiter Betriebstemperaturbereich: Suitable for industrial and automotive environments, providing stable operation under harsh conditions.

BCM43525C0KMMLW1G Advantages vs Typical Alternatives

This device combines dual-band Wi-Fi and Bluetooth 5.0 in a single compact module, offering superior integration compared to separate solutions. Its advanced coexistence technology minimizes signal interference, delivering higher accuracy and consistent throughput. The low power profile supports longer operational life in battery-powered devices, making it more efficient than typical alternatives. Additionally, its wide temperature tolerance and robust interface options provide reliability and flexibility for diverse industrial and embedded applications.

Typische Anwendungen

• Embedded wireless modules for IoT devices requiring simultaneous Wi-Fi and Bluetooth connectivity with low power consumption and compact size.
• Smart home appliances that demand reliable dual-band wireless communication and seamless Bluetooth integration.
• Wearable electronics benefiting from Bluetooth 5.0 range improvements and energy-efficient wireless operation.
• Industrial automation systems needing robust wireless interfaces with high data throughput and environmental resilience.

BCM43525C0KMMLW1G Brand Info

This wireless combo chip is developed by a leading semiconductor manufacturer specializing in highly integrated connectivity solutions. The product line is well-known for delivering industry-standard Wi-Fi and Bluetooth performance with a focus on low power consumption and ease of integration. Designed to meet the evolving needs of embedded and IoT markets, the solution emphasizes reliability and compact design. Engineers and sourcing professionals trust this brand for consistent quality, extensive technical support, and compatibility with a broad range of platforms.

FAQ

What wireless standards does this device support?

The device supports IEEE 802.11a/b/g/n/ac for Wi-Fi, including dual-band operation at 2.4 GHz and 5 GHz. It also supports Bluetooth 5.0, offering BR/EDR and Low Energy modes to cover a wide range of wireless communication needs.

How does the coexistence mechanism improve performance?

Advanced coexistence techniques ensure that Wi-Fi and Bluetooth modules operate simultaneously without interfering with each other. This reduces packet loss and latency, maintaining high data throughput and stable connections even in congested wireless environments.

What interfaces are available for integrating the device into a system?

The chip provides multiple interface options including SDIO 3.0 for high-speed data transfer, UART for serial communication, PCM and I2S for audio data. These flexible interfaces simplify integration with various host processors and platforms.

Is this device suitable for industrial applications?

Yes, it supports an extended operating temperature range from -40??C to +85??C, making it suitable for industrial and automotive environments where temperature extremes are common. Its robust packaging also contributes to long-term reliability.

What are the power consumption characteristics?

The device is optimized for low power consumption during both active and standby modes, which is critical for battery-powered and portable applications. This helps extend device operational life without compromising wireless performance.