BCM43465C0IMMLW1G Wi-Fi Combo Module with Bluetooth, MLF Package

BCM43465C0IMMLW1G Overview

The BCM43465C0IMMLW1G is a highly integrated wireless connectivity module designed for industrial and consumer electronics. It combines dual-band 2.4 GHz and 5 GHz Wi-Fi capabilities with Bluetooth 5.0 support, enabling versatile, high-performance communication. This compact, low-power device supports multiple wireless standards including 802.11ac Wave 2, facilitating robust data throughput and reliable connections in complex environments. Optimized for seamless integration, it reduces system complexity while delivering enhanced security and power efficiency. Engineers and sourcing specialists will find this module ideal for embedded wireless applications requiring stable performance and flexible connectivity options. More details are available from IC-Hersteller.

BCM43465C0IMMLW1G Technical Specifications

BCM43465C0IMMLW1G Key Features

• Dual-band Wi-Fi support: Enables simultaneous 2.4 GHz and 5 GHz operation, providing greater network flexibility and reduced interference, critical for enhanced wireless performance in congested environments.
• Bluetooth 5.0 integration: Supports low-energy communication alongside classic Bluetooth, facilitating IoT device connectivity with improved range and data rates.
• High data throughput: Compliant with 802.11ac Wave 2 standard, it delivers multi-user MIMO capability, optimizing bandwidth allocation for faster and more efficient data transfer.
• Compact MLP packaging: The small 12 mm x 12 mm footprint simplifies integration into space-constrained designs while maintaining robust RF performance.
• Geringer Stromverbrauch: Designed for energy-efficient operation, the module supports power-saving modes critical for battery-powered applications.
• Flexible interface options: SDIO 3.0 and UART interfaces enable easy connectivity with a wide range of host processors and microcontrollers.
• Enhanced security features: Supports WPA3 and other advanced security protocols to ensure secure wireless communication in industrial and consumer environments.

BCM43465C0IMMLW1G Advantages vs Typical Alternatives

Compared to typical wireless modules, this device offers superior integration of dual-band Wi-Fi and Bluetooth 5.0 within a compact footprint, reducing BOM costs and design complexity. Its support for 802.11ac Wave 2 with MU-MIMO enhances throughput and reliability, critical in dense wireless environments. The low power consumption and comprehensive security features provide a balance of efficiency and protection, giving it an edge over less versatile or single-band solutions.

Typische Anwendungen

• Embedded wireless connectivity for IoT devices, enabling seamless integration of Wi-Fi and Bluetooth protocols in smart home, industrial automation, and healthcare equipment with stringent space and power constraints.
• Smart appliances requiring robust dual-band wireless communication for reliable remote control and monitoring.
• Wearable electronics benefiting from low power Bluetooth 5.0 connectivity alongside Wi-Fi capabilities for enhanced user experience.
• Industrial control systems leveraging secure and high-speed wireless links to support real-time monitoring and data exchange.

BCM43465C0IMMLW1G Brand Info

This wireless connectivity module is a product of a leading semiconductor company specializing in mixed-signal and digital communications ICs. The module reflects the brand??s commitment to delivering high-performance, integrated wireless solutions that meet stringent industrial and consumer requirements. With decades of experience in RF design and embedded systems, the brand ensures rigorous quality standards, comprehensive documentation, and support for seamless integration into diverse applications.

FAQ

What wireless standards does this module support?

The module supports dual-band Wi-Fi standards including IEEE 802.11a/b/g/n/ac Wave 2, providing compatibility with legacy and modern networks. It also integrates Bluetooth 5.0, which includes both classic Bluetooth and Bluetooth Low Energy (BLE) functionalities for versatile wireless connectivity.

What interfaces are available for connecting this module to a host system?

It provides SDIO 3.0, UART, and PCM interfaces to facilitate communication with host microcontrollers or processors. The SDIO interface is typically used for high-speed Wi-Fi data transfer, while UART and PCM support Bluetooth and audio functions, respectively.

How does this module handle power consumption for battery-operated devices?

The device incorporates multiple power-saving modes and efficient RF design to minimize current draw during idle and active states. This makes it suitable for battery-operated applications where extended operation time is critical without compromising wireless performance.

What security protocols are supported to protect wireless communication?

It supports advanced security standards such as WPA3, WPA2, and WEP for Wi-Fi connections, ensuring data integrity and protection from unauthorized access. Bluetooth communications benefit from standard link-layer encryption and authentication mechanisms inherent to Bluetooth 5.0 specifications.

What is the physical size and form factor of this module?

The module is housed in a compact multi-layer package measuring 12 mm by 12 mm. This small footprint facilitates integration into space-constrained designs while maintaining strong RF performance and ease of manufacturing.