BCM43460KMLG Wi-Fi/Bluetooth Combo Chip Module | Surface Mount Package

  • Provides Wi-Fi and Bluetooth connectivity to enable seamless wireless communication for embedded systems.
  • Operates in the 2.4 GHz frequency band, ensuring compatibility with most common wireless networks.
  • Features a compact LGA package, reducing board space and facilitating integration into small devices.
  • Ideal for IoT applications requiring reliable wireless links, enhancing device interoperability and user experience.
  • Manufactured under stringent quality controls to maintain consistent performance and long-term reliability.
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BCM43460KMLG Overview

The BCM43460KMLG is a high-performance wireless connectivity solution designed for embedded applications requiring robust Wi-Fi and Bluetooth integration. Supporting dual-band 2.4 GHz and 5 GHz Wi-Fi 802.11ac standards alongside Bluetooth 5.0, this module enables seamless data transmission and reliable short-range communication. Its compact form factor and comprehensive protocol support make it ideal for IoT devices, smart home products, and industrial automation systems. With integrated power management features and advanced coexistence capabilities, the module delivers efficient wireless performance while minimizing interference. For detailed product sourcing and technical support, visit IC-Hersteller.

BCM43460KMLG Technical Specifications

ParameterSpezifikation
Wi-Fi StandardsIEEE 802.11a/b/g/n/ac
Frequency Bands2.4 GHz and 5 GHz dual-band
Bluetooth-VersionBluetooth 5.0 (BR/EDR and BLE)
SendeleistungUp to 18 dBm (typical)
Empfindlichkeit des Empfängers-92 dBm (802.11ac HT20)
SchnittstellenSDIO 3.0, UART, PCM
Versorgungsspannung3.3 V nominal
PaketSurface-mount, 12 x 12 mm LGA
Betriebstemperaturbereich-40??C bis +85??C
Security SupportWPA, WPA2, WPA3, WEP

BCM43460KMLG Key Features

  • Dual-Band Wi-Fi 802.11ac Support: Enables high-throughput wireless connectivity on both 2.4 GHz and 5 GHz bands, ensuring reduced interference and improved network performance in congested environments.
  • Bluetooth 5.0 Integration: Supports enhanced data rates and extended range for short-range wireless communication, critical for IoT and wearable applications requiring reliable device pairing and data exchange.
  • Integrierte Energieverwaltung: Optimizes energy consumption, enabling longer battery life in portable devices by dynamically adjusting power usage during active and idle states.
  • Advanced Coexistence Mechanisms: Minimizes interference between Wi-Fi and Bluetooth signals within the module, enhancing overall communication reliability in multi-radio designs.

BCM43460KMLG Advantages vs Typical Alternatives

This wireless module offers significant advantages in terms of integration and efficiency compared to typical standalone Wi-Fi or Bluetooth chips. Its dual-band support and advanced coexistence reduce interference risks, while the integrated power management enhances energy efficiency. The compact LGA package simplifies PCB design and assembly, resulting in a reliable and space-saving solution suitable for demanding industrial and embedded applications.

Typische Anwendungen

  • Embedded IoT Devices: Ideal for smart sensors and controllers requiring reliable wireless connectivity with low power consumption and flexible interface options.
  • Smart Home Automation: Enables seamless integration of Wi-Fi and Bluetooth for connected appliances, lighting systems, and security devices.
  • Industrial Automation: Provides robust wireless communication for factory equipment monitoring and control systems operating in harsh environments.
  • Wearable Electronics: Supports compact design and low power usage critical for fitness trackers, health monitors, and other portable devices.

BCM43460KMLG Brand Info

The BCM43460KMLG is a product from a leading semiconductor manufacturer known for delivering advanced wireless communication solutions. This module exemplifies the brand??s commitment to integrating cutting-edge Wi-Fi and Bluetooth technologies into compact, energy-efficient packages. The product is designed to meet rigorous industrial and consumer standards, supporting a wide range of applications with reliable performance and broad protocol compatibility.

FAQ

What wireless standards does this module support?

The module supports IEEE 802.11a/b/g/n/ac Wi-Fi standards, providing dual-band connectivity on both 2.4 GHz and 5 GHz frequencies. It also supports Bluetooth 5.0, including both classic Bluetooth and low energy modes, ensuring versatile wireless communication options.

What interfaces are available for host connectivity?

Host communication is supported via SDIO 3.0 for Wi-Fi data transfer, UART for control and debugging, and PCM for audio interfaces. These standardized interfaces allow flexible integration with various microcontrollers and processors in embedded systems.

How does the module manage power consumption?

Integrated power management features dynamically adjust the module??s power usage based on operational states. This optimization reduces energy consumption during idle or low-activity periods, extending battery life in portable or remote applications.

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What is the operating temperature range for this wireless solution?

The device is rated to operate reliably within a temperature range of -40??C to +85??C, making it suitable for a wide variety of industrial and outdoor environments where temperature extremes are common.

How does the module handle coexistence between Wi-Fi and Bluetooth?

Advanced coexistence mechanisms are built into the module to minimize interference between Wi-Fi and Bluetooth radios. This ensures simultaneous operation of both wireless protocols without degradation in communication reliability or data throughput.

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