BC41B143A07-IXB-E4 Integrated Circuit (IC)

BC41B143A07-IXB-E4 Overview

Die BC41B143A07-IXB-E4 is a surface-mount integrated component offered through IC-Hersteller. It uses a compact BGA-style package identified by the part code and is optimized for board-level density where a 143-ball footprint and 0.70 mm ball pitch reduce board area while retaining reliable solder connections. The suffixes in the ordering code indicate a 7.0 mm package dimension and lead-free compliance, providing a balance of mechanical compactness and manufacturing compatibility for medium-density designs.

BC41B143A07-IXB-E4 Technical Specifications

Parameter	Wert
Part number	BC41B143A07-IXB-E4
Component type	Integrated circuit (BGA-style)
Ball / pin count	143
Ball pitch	0.70 mm
Package dimensions	7.0 x 7.0 mm
Package thickness	1.00 mm
Mounting style	Surface mount
RoHS / lead-free	Compliant (E4 designation)
Operating temperature range	-40 ??C bis +85 ??C
Moisture sensitivity level	MSL 3

BC41B143A07-IXB-E4 Key Features

• Compact 143-ball BGA package: maximizes board density while supporting reliable solder joints for reflow processes.
• 0.70 mm ball pitch: balances assembly yield and routing density for mid-range multilayer PCBs.
• Lead-free (E4) compliance: aligns with modern manufacturing and regulatory requirements, reducing process conversion costs.
• Industrial temperature window: supports typical embedded and industrial applications that require reliable operation from -40 ??C to +85 ??C.

Typische Anwendungen

• Embedded controllers and system-on-board modules where mid-density BGA footprints reduce PCB area and simplify routing for mixed-signal designs.
• Communication and networking modules that need a compact, lead-free BGA package for reliable high-volume assembly and thermal cycling resilience.
• Industrial control electronics that require components rated for -40 ??C to +85 ??C and that benefit from smaller package footprints to save board space.
• Consumer and commercial devices where cost-effective surface-mount packaging and standard 0.70 mm pitch help meet automated placement and reflow profiles.

BC41B143A07-IXB-E4 Advantages vs Typical Alternatives

The BC41B143A07-IXB-E4 delivers a clear density advantage with 143 balls and a 0.70 mm pitch, which is smaller than many coarse-pitch packages but larger than fine-pitch BGAs that complicate assembly. Its 7.0 x 7.0 mm footprint provides a compact option compared with larger BGAs while maintaining easier routing than ultra-fine pitches. The lead-free E4 designation simplifies compliance compared to non-compliant parts. Together, these attributes reduce board area, support standard reflow profiles, and lower conversion effort when compared to both larger-pitch and non-compliant alternatives.

BC41B143A07-IXB-E4 Brand Info

The BC41B143A07-IXB-E4 is listed through IC-Hersteller, a supply channel that presents semiconductor product listings and distribution details. This brand channel provides ordering codes, compliance markers and package descriptors to help designers and sourcing teams confirm fit, form and assembly compatibility for production volumes.

FAQ

What is the package type?

The device is offered in a BGA-style surface-mount package. The ordering code denotes a ball-array package with 143 connections and a compact footprint designed for automated placement and reflow soldering.

What does the ??143?? indicate?

The ??143?? in the part identifier refers to the ball or pin count for the package. This number defines the available I/O and physical connection points used during PCB layout and thermal design.

What does ??A07?? represent?

The ??A07?? element in the ordering code indicates a 7.0 mm dimension reference and corresponds with the 0.70 mm ball pitch commonly used for mid-density BGAs, guiding footprint and stencil design.

Is this part RoHS compliant?

Yes. The suffix E4 in the ordering code designates lead-free / RoHS compliance, which is important for modern manufacturing and regulatory conformance in commercial and industrial products.

How should I handle PCB footprint design?

Design the footprint for a 0.70 mm BGA pitch with a matching 143-ball pattern and a 7.0 x 7.0 mm body. Follow standard BGA soldermask and via-in-pad recommendations to balance routing, thermal relief and manufacturability.