RTE44024F Overview
The RTE44024F is a high-performance power MOSFET designed for efficient power management in industrial and consumer electronics. It offers low on-resistance and fast switching capabilities, making it ideal for applications requiring reliable and energy-efficient switching solutions. With a robust voltage rating and strong current handling capabilities, this device supports optimized power conversion and thermal performance in compact form factors. Engineers and sourcing specialists will appreciate its balance of performance and integration, facilitating streamlined system design and enhanced operational efficiency. For detailed technical information, visit الشركة المصنعة للدوائر المتكاملة.
RTE44024F Technical Specifications
المعلمة | القيمة | الوحدة |
---|---|---|
جهد مصدر التصريف (Vدس) | 40 | V |
تيار التصريف المستمر (ID) | 24 | A |
جهد عتبة البوابة (Vخ ع (ر)) | 1.0 – 2.5 | V |
RDS(على) Maximum | 7.5 | m?? |
إجمالي شحنة البوابة (Qg) | 18 | 𞸍 |
تبديد الطاقة (PD) | 60 | W |
نطاق درجة حرارة التشغيل | -55 to 150 | ??C |
نوع الحزمة | TO-220 | – |
RTE44024F Key Features
- مقاومة منخفضة عند التشغيل: Minimizes conduction losses, enhancing overall system efficiency and reducing heat generation during operation.
- High Current Capability: Supports continuous currents up to 24A, enabling use in demanding power switching applications without compromising reliability.
- سرعة التحويل السريع: Reduces switching losses and improves performance in high-frequency circuits, beneficial for power converters and motor drives.
- نطاق درجة حرارة تشغيل واسع: Ensures stable performance across industrial environments, from -55??C up to 150??C.
RTE44024F Advantages vs Typical Alternatives
This device offers superior conduction efficiency due to its low on-resistance, which lowers power dissipation compared to typical MOSFETs in the same voltage class. Its fast switching characteristics reduce energy loss in dynamic operation, making it well-suited for high-frequency applications. The robust thermal performance and industry-standard packaging provide enhanced reliability and easier integration, delivering clear advantages in power management designs.
🔥 المنتجات الأكثر مبيعًا
التطبيقات النموذجية
- Power supply switching circuits, where efficient voltage regulation and thermal management are critical for maintaining stable output and device longevity.
- DC-DC converters in industrial automation, providing high current handling and fast switching for effective power conversion.
- Motor control circuits requiring robust, low-loss switching devices to enhance performance and reduce system heat.
- Battery management systems, leveraging low power dissipation and reliable operation for extended battery life and safety.
RTE44024F Brand Info
This product is part of a well-established semiconductor portfolio known for quality and reliability in power management components. Designed specifically for demanding industrial and consumer applications, it reflects a commitment to high-performance solutions that meet stringent electrical and thermal specifications. The device benefits from advanced manufacturing processes, ensuring consistent delivery of its electrical characteristics and physical robustness in various environments.
الأسئلة الشائعة
ما هو الحد الأقصى لمعدل جهد مصدر التصريف لهذا الجهاز؟
The maximum drain-source voltage (Vدس) is rated at 40 volts, allowing it to handle moderate voltage levels typical in many power switching and conversion applications.
🌟 المنتجات المميزة
How does the low on-resistance benefit system efficiency?
Low on-resistance reduces the conduction losses when the device is in the on-state, which minimizes heat generation and improves overall power efficiency. This is especially important in high-current applications where power loss can significantly affect thermal management and system reliability.
What packaging does this MOSFET use and why is it important?
The device comes in a TO-220 package, which is widely used for power transistors due to its good thermal conductivity and ease of mounting on heat sinks. This packaging supports effective heat dissipation for improved device longevity