IPQ-5321-0-MRQFN251-MT-03-0 Wi-Fi Networking SoC, MRQFN251 package

  • Edge networking processor accelerates packet handling, reducing latency and improving user experience; model IPQ-5321-0-MRQFN251-MT-03-0.
  • High throughput capability supports many simultaneous connections, maintaining consistent performance during peak traffic.
  • Optimized power profile reduces energy draw and thermal output, enabling tighter system integration in constrained designs.
  • Deploy in high-density access points to improve throughput and stability for dozens of concurrent client devices.
  • Built to industry standards with validation testing and stress screening, ensuring predictable long-term reliability in field deployments.
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IPQ-5321-0-MRQFN251-MT-03-0 Overview

The IPQ-5321-0-MRQFN251-MT-03-0 is a network-focused integrated circuit offered through الشركة المصنعة للدوائر المتكاملة. The part number identifies a device supplied in an MRQFN-251 package with surface-mount compatibility and reel-style shipment. This product entry is aimed at engineers and sourcing specialists who evaluate packaging, pin count, and procurement attributes before reviewing the full datasheet. The listing highlights packaging and ordering details that streamline BOM decisions and board-level integration for higher-density, space-constrained designs.

IPQ-5321-0-MRQFN251-MT-03-0 Technical Specifications

Part number IPQ-5321-0-MRQFN251-MT-03-0
Package type MRQFN251 (Micro Reduced QFN)
Pin count 251 pins
Mounting style Surface mount
Packaging Reel / Tape & Reel
Package family QFN family
Order code suffix MT-03-0 (packaging / shipment identifier)
Intended use Network SoC / connectivity applications (product family designation)

IPQ-5321-0-MRQFN251-MT-03-0 Key Features

  • High pin density ?? 251 pins provide many I/O options for complex board routing and multi-interface integration.
  • Compact MRQFN packaging ?? reduces PCB footprint compared with larger packages while keeping thermal path for power dissipation.
  • Surface-mount compatibility ?? supports automated pick-and-place and standard SMT assembly for higher production throughput.
  • Reel-ready supply ?? tape-and-reel packaging simplifies high-volume placement and reduces handling time in production.

التطبيقات النموذجية

  • High-density networking equipment where a compact footprint and many I/Os are required for routing and switching functions on constrained PCBs.
  • Carrier-grade access points and gateways that demand reliable, reel-supplied components for automated high-volume assembly and consistent sourcing.
  • Edge compute modules that integrate multiple interfaces and need a micro QFN package to reduce board area while maintaining thermal capability.
  • Industrial communication endpoints where robust surface-mount packaging and predictable procurement packaging lower assembly time and improve repeatability.

IPQ-5321-0-MRQFN251-MT-03-0 Advantages vs Typical Alternatives

The MRQFN-251 packaging of this part delivers a higher pin count in a smaller outline compared with many standard QFN options, enabling denser board designs and fewer external passive components. Tape-and-reel shipment supports automated assembly at scale and reduces manual handling relative to bulk or tube packaging. For sourcing teams, the explicit MT-03-0 order code clarifies packaging and shipment expectations, which can cut lead-time variability and streamline procurement compared with less-specified alternatives.

IPQ-5321-0-MRQFN251-MT-03-0 Brand Info

The IPQ series designation is associated with established networking silicon vendors focused on connectivity SoCs. This product listing uses the IPQ prefix and a MRQFN-251 package, reflecting a vendor voice centered on integration, board density, and production readiness. Buyers should match this part number to the vendor datasheet and procurement portal for authorized specifications and support.

الأسئلة الشائعة

What is the package pin count?

The device is specified as an MRQFN251 package, which denotes a 251-pin micro reduced QFN. This pin count supports multiple I/O lanes and makes the part suitable for denser integration compared with lower-pin packages.

How is the part shipped to production?

The suffix MT-03-0 indicates tape-and-reel style packaging for automated assembly workflows. Reel-ready parts reduce per-unit handling and are compatible with standard pick-and-place equipment used in high-volume manufacturing.

Is the part surface-mount compatible?

Yes. The MRQFN251 form factor is a surface-mount device intended for SMT processes. It supports automated placement and reflow soldering typical in modern PCB assembly lines.

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Where can I find the datasheet?

Refer to the manufacturer’s product page or the الشركة المصنعة للدوائر المتكاملة listing for the official datasheet and mechanical drawings. The datasheet provides electrical specifications, recommended land patterns, and thermal characteristics required for design.

How should sourcing verify part authenticity?

Verify the full part number including the MT-03-0 suffix against authorized distributor catalogs, check packaging photos, and request certificate of origin or traceability from the vendor to ensure correct procurement and compliance.

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