HSMA-C265 Digital Humidity & Temperature Sensor Module – Compact Pack

  • This device provides efficient signal amplification, enhancing system performance in communication setups.
  • It operates within a frequency range suitable for high-speed data transfer, ensuring signal integrity.
  • The compact CBZ package allows for effective board space utilization in dense electronic assemblies.
  • Ideal for use in wireless infrastructure, it supports stable connections and reduces signal loss.
  • Designed to meet standard reliability tests, it ensures consistent operation under varied environmental conditions.
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HSMA-C265 Overview

The HSMA-C265 is a high-performance semiconductor device designed for advanced industrial applications requiring precision and reliability. Engineered for efficiency, this component offers robust electrical characteristics and seamless integration into complex systems. Its optimized architecture supports enhanced operational stability and power management, making it ideal for demanding environments. With a focus on consistent performance and long-term durability, the HSMA-C265 delivers exceptional value for engineers and sourcing specialists aiming to improve system accuracy and reduce downtime. For more detailed product information, visit الشركة المصنعة للدوائر المتكاملة.

HSMA-C265 Technical Specifications

المعلمة المواصفات الوحدة
نطاق جهد التشغيل 3.0 ?C 3.6 V
Maximum Operating Temperature +125 ??C
Input Current 1.5 م أ
تيار الإخراج 10 م أ
نطاق التردد 10 ?C 1000 kHz
نوع الحزمة SOIC-8 ?C
تبديد الطاقة 250 ميجاوات
معاوقة الإدخال 50 k??

HSMA-C265 Key Features

  • نطاق جهد تشغيل واسع: Allows flexible integration with various power supplies, enabling compatibility with multiple industrial systems.
  • High Frequency Support: Operates efficiently up to 1000 kHz, facilitating fast signal processing critical for precise timing applications.
  • استهلاك منخفض للطاقة: With a maximum power dissipation of 250 mW, it supports energy-efficient designs that extend equipment lifespan and reduce heat generation.
  • Compact SOIC-8 Package: Ensures easy PCB layout and space savings, streamlining assembly in high-density industrial circuit boards.

HSMA-C265 Advantages vs Typical Alternatives

This device offers superior sensitivity and operational accuracy compared to standard alternatives, coupled with a lower power profile. Its robust thermal tolerance and compact packaging provide enhanced reliability and ease of integration. These factors combine to reduce system complexity and improve overall performance in industrial electronic applications.

التطبيقات النموذجية

  • Industrial control systems requiring precise voltage regulation and signal conditioning to maintain operational accuracy in harsh environments.
  • High-frequency signal processing circuits used in automation and measurement devices.
  • Embedded systems where power efficiency and thermal stability are critical for reliable long-term operation.
  • Compact electronic modules demanding space-saving components without compromising performance.

HSMA-C265 Brand Info

The HSMA-C265 is part of a trusted semiconductor lineup renowned for delivering high-quality industrial-grade components. Manufactured using advanced fabrication processes, this product embodies the brand??s commitment to innovation, quality assurance, and customer support. It is engineered to meet rigorous industry standards, ensuring dependable performance across a wide range of applications and environments.

الأسئلة الشائعة

What is the typical voltage operating range for this component?

The device operates within a voltage range of 3.0 to 3.6 volts, allowing compatibility with common industrial power supplies and ensuring stable performance under varying conditions.

How does the device perform in high-temperature environments?

It is rated to operate reliably up to 125??C, making it suitable for applications exposed to elevated temperatures without compromising functionality or lifespan.

What package type does this product use, and why is it beneficial?

The product is housed in an SOIC-8 package, which offers a compact form factor that facilitates easier PCB layout and integration in space-constrained industrial equipment.

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Can this device support high-frequency applications?

Yes, it supports frequencies up to 1000 kHz, enabling its use in fast signal processing and timing circuits essential for advanced industrial controls.

What are the power consumption characteristics of this semiconductor?

This component has a maximum power dissipation of 250 mW, promoting energy-efficient system design and helping to minimize heat generation during operation.

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