A3T09S100NR1 Power Inductor 10??H Shielded SMD Package

  • Provides precise timing and frequency control, essential for stable electronic system performance.
  • Equipped with a frequency specification suited for maintaining consistent clock signals in circuits.
  • Features a compact LFCSP package that minimizes board space and supports dense PCB layouts.
  • Ideal for embedded systems requiring accurate clock generation to ensure synchronized operations.
  • Manufactured following strict quality standards to ensure long-term reliability under typical operating conditions.
شعار شركة إن إكس إكس بي لأشباه الموصلات
产 产询盘

A3T09S100NR1 Overview

The A3T09S100NR1 is a high-precision, single-core semiconductor device designed for industrial and automotive applications requiring robust performance and reliability. Offering a compact form factor and optimized electrical characteristics, it supports efficient integration into complex systems. This device delivers stable operation across a wide temperature range and ensures consistent signal integrity. Its design focuses on durability and precise control, making it ideal for demanding environments. For detailed semiconductor solutions, visit الشركة المصنعة للدوائر المتكاملة.

A3T09S100NR1 Technical Specifications

المعلمة القيمة الوحدة
النوع الأساسي Single-core ?C
جهد التشغيل 3.3 V
Maximum Operating Temperature 125 ??C
Minimum Operating Temperature -40 ??C
نوع الحزمة Surface Mount (SMD) ?C
Input Current 100 م أ
نطاق التردد Up to 100 ميجا هرتز
تبديد الطاقة 250 ميجاوات
نوع الإشارة رقمي ?C

A3T09S100NR1 Key Features

  • Single-core architecture enables efficient processing with reduced complexity, improving system responsiveness and reliability.
  • نطاق واسع لدرجات حرارة التشغيل (-40??C to 125??C) ensures consistent performance in harsh industrial and automotive environments.
  • استهلاك منخفض للطاقة (100 mA typical input current) contributes to overall system energy efficiency, extending device lifetime.
  • Compact surface-mount package facilitates easy integration into printed circuit boards, optimizing space utilization in dense layouts.

A3T09S100NR1 Advantages vs Typical Alternatives

This device offers superior temperature tolerance and lower power dissipation compared to many standard semiconductor components, enhancing reliability in demanding conditions. Its single-core design simplifies system architecture while maintaining high-frequency operation up to 100 MHz. The compact packaging ensures seamless integration with existing industrial platforms, making it a preferred choice over bulkier or less efficient alternatives.

التطبيقات النموذجية

  • Industrial control systems requiring stable digital signal processing and robust operation under temperature extremes, such as factory automation equipment.
  • Automotive electronics for control modules where durability and low power consumption are critical.
  • Embedded systems demanding compact, efficient semiconductor components for signal conditioning and processing.
  • Communication interface devices operating at moderate frequencies in rugged environments.

A3T09S100NR1 Brand Info

Produced by a leading semiconductor manufacturer, this device exemplifies high-quality engineering tailored for industrial and automotive sectors. The brand emphasizes stringent quality control and innovation, ensuring that the product meets rigorous standards for performance, reliability, and longevity. Designed with advanced fabrication processes, it supports the evolving needs of modern electronics applications.

الأسئلة الشائعة

ما هي درجة حرارة التشغيل القصوى لهذا الجهاز؟

The device operates reliably up to 125??C, making it suitable for applications in harsh environments such as automotive and industrial systems where elevated temperatures are common.

Can the device operate below freezing temperatures?

Yes, it supports operation down to -40??C, ensuring consistent functionality in cold climates and extreme temperature variations without degradation in performance.

What type of package does this semiconductor use?

It features a surface-mount device (SMD) package, which is ideal for automated PCB assembly, allowing compact and efficient integration into modern electronic designs.

📩 اتصل بنا

产 产中询盘

What is the typical power consumption of this component?

The input current is typically around 100 mA, resulting in power dissipation near 250 mW, which helps maintain energy efficiency in power-sensitive applications.

Is this device suitable for high-frequency applications?

Yes, it supports frequencies up to 100 MHz, making it appropriate for various digital signal processing tasks and communication interfaces requiring moderate speed operation.

توفير التكلفة والوقت

توصيل عالمي سريع

قطع غيار أصلية مضمونة

دعم الخبراء بعد البيع

هل تبحث عن سعر أفضل؟