CY7C1021BNV33L-15ZXI 1M x 8 SRAM Memory IC ?C 32-Pin PLCC Package

  • This device provides high-speed SRAM memory, enabling quick data access and efficient system performance.
  • Operating at a 15 ns access time, it ensures fast read/write cycles crucial for time-sensitive applications.
  • The compact LFCSP package offers board-space savings, ideal for designs with limited PCB area.
  • Suitable for embedded systems needing rapid temporary data storage, improving overall processing speed.
  • Manufactured following strict quality controls, it ensures reliable operation under various environmental conditions.
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CY7C1021BNV33L-15ZXI Overview

The CY7C1021BNV33L-15ZXI is a high-performance static random-access memory (SRAM) device designed for industrial and commercial applications requiring fast, reliable, and low-power memory solutions. Operating at a 3.3V power supply and featuring a 15 ns access time, this 1M-bit (128K x 8) SRAM supports robust data retention and quick data access, making it suitable for systems demanding high-speed memory performance. With its standard 44-pin SOJ package, the device ensures easy integration into various printed circuit board (PCB) designs. This product, available through IC Manufacturer, offers engineers and sourcing specialists a reliable choice for embedded memory needs.

CY7C1021BNV33L-15ZXI Technical Specifications

ParameterSpecification
Memory Density1M-bit (128K x 8)
Access Time15 ns
Operating Voltage3.3 V ?? 0.3 V
Package Type44-pin SOJ (Small Outline J-Lead)
Data Retention Voltage2.0 V Minimum
Operating Temperature Range0??C to +70??C
Standby Current10 ??A (typical)
Operating Current30 mA (typical)
Input/Output TypeTTL Compatible

CY7C1021BNV33L-15ZXI Key Features

  • High-Speed Access: 15 ns access time enables rapid data retrieval, critical for high-performance computing and real-time applications.
  • Low Power Consumption: Operates efficiently with a typical standby current of only 10 ??A, reducing overall system power draw and improving energy efficiency.
  • 3.3V Single Power Supply: Simplifies power management and supports compatibility with modern 3.3V digital systems.
  • Robust Data Retention: Maintains data integrity down to 2.0V, ensuring reliable memory retention during power fluctuations or standby modes.
  • Standard SOJ Packaging: Facilitates straightforward PCB layout and integration in industrial and embedded memory applications.
  • TTL Input/Output Compatibility: Supports seamless interfacing with standard logic-level signals for ease of system design.
  • Wide Operating Temperature Range: Suitable for commercial temperature environments, ensuring stable performance in diverse conditions.

CY7C1021BNV33L-15ZXI Advantages vs Typical Alternatives

This SRAM device offers a significant advantage over typical alternatives by providing fast 15 ns access times combined with low power consumption at 3.3V operation. Its data retention capability at reduced voltages ensures higher reliability under fluctuating power conditions. The industry-standard SOJ package simplifies integration, while TTL compatibility enhances system design flexibility. These features collectively deliver improved speed, efficiency, and dependability compared to older or lower-performance SRAM options.

Typical Applications

  • Embedded memory in networking equipment where rapid access and low power are critical for packet buffering and processing tasks.
  • High-speed cache memory for microprocessor-based systems requiring fast read/write cycles and data integrity.
  • Industrial control systems demanding reliable SRAM for real-time data logging and temporary data storage.
  • Test and measurement instruments where fast, stable memory supports accurate data acquisition and analysis.

CY7C1021BNV33L-15ZXI Brand Info

This product is part of a well-established family of SRAM devices known for reliable performance and quality manufacturing standards. Designed to meet stringent industrial and commercial requirements, this memory solution supports engineers and system designers in achieving efficient, high-speed data storage. Its consistent quality and packaging options reflect the manufacturer’s commitment to delivering dependable semiconductor components for demanding applications.

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