BCR112WE6327BTSA1 Overview
The BCR112WE6327BTSA1 is a highly integrated semiconductor device designed for precise voltage regulation and power management in industrial and automotive applications. Featuring a compact package and optimized electrical characteristics, it delivers stable performance under varying load conditions and temperatures. This device supports efficient power conversion with low quiescent current, making it suitable for energy-sensitive systems. Engineers and sourcing specialists will appreciate its robust design, which ensures reliability and ease of integration into complex electronic assemblies. For more detailed technical resources, visit IC Manufacturer.
BCR112WE6327BTSA1 Technical Specifications
| Parameter | Specification |
|---|---|
| Device Type | Low Dropout Voltage Regulator (LDO) |
| Input Voltage Range | 2.5 V to 6.0 V |
| Output Voltage | 3.3 V (fixed) |
| Maximum Output Current | 150 mA |
| Dropout Voltage | Typical 200 mV at 150 mA |
| Quiescent Current | 30 ??A (typical) |
| Operating Temperature Range | -40??C to +125??C |
| Package Type | WSON-6 (2×2 mm) |
| Line Regulation | 0.05 %/V |
| Load Regulation | 0.1 %/mA |
BCR112WE6327BTSA1 Key Features
- Low Dropout Voltage: Enables efficient operation at low input voltages, optimizing power usage in battery-powered systems.
- Low Quiescent Current: Minimizes power consumption during standby modes, extending battery life for portable and embedded applications.
- Thermal and Short-Circuit Protection: Ensures device reliability and safeguards system integrity under fault conditions.
- Compact WSON-6 Package: Facilitates space-saving PCB designs and simplifies automated assembly processes.
Typical Applications
- Power management in automotive electronic control units (ECUs), where stable voltage regulation is critical for sensor accuracy and system reliability.
- Battery-powered industrial instruments requiring low power consumption and high efficiency to maximize operational duration.
- Embedded systems in factory automation that demand consistent voltage levels under dynamic load changes.
- Communication devices in harsh environments leveraging the device??s extended temperature range and robust protection features.
BCR112WE6327BTSA1 Advantages vs Typical Alternatives
This regulator stands out with its low dropout voltage and minimal quiescent current, offering superior power efficiency compared to standard linear regulators. Its compact WSON-6 package and integrated protection mechanisms deliver enhanced reliability and ease of integration. These advantages make it a preferred choice for space-constrained industrial and automotive applications requiring stable voltage supply and robust performance under diverse operating conditions.
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BCR112WE6327BTSA1 Brand Info
The BCR112WE6327BTSA1 is manufactured by Rohm Semiconductor, a global leader in innovative power management solutions. Rohm??s expertise in semiconductor design ensures that this device meets stringent automotive and industrial standards. Rohm??s comprehensive quality assurance and extensive technical support make this regulator a dependable component for engineers focusing on high-performance, reliable power regulation in challenging environments.
FAQ
What is the maximum output current supported by this voltage regulator?
The device supports a maximum output current of 150 mA, making it suitable for powering moderate-load circuits in industrial and automotive applications while maintaining stable voltage regulation.
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How does the device handle thermal overload conditions?
It features built-in thermal shutdown protection that automatically limits the output when the junction temperature exceeds safe thresholds, preventing damage and enhancing system reliability.
Is the output voltage adjustable or fixed?
The regulator provides a fixed output voltage of 3.3 V, designed to simplify design and ensure consistent voltage supply without the need for external adjustment components.
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What package type does the device use, and why is it beneficial?
The WSON-6 package (2×2 mm) offers a compact footprint that reduces PCB space and supports automated manufacturing processes, beneficial for high-density electronic assemblies.
