XC7Z030-2FFG676I FPGA Chip – High-Performance Zynq-7000 Series in FFG676 Package

  • The XC7Z030-2FFG676I integrates ARM cores for high-performance processing capabilities.
  • This model supports extensive programmable logic, enabling customization for various applications.
  • It features a compact footprint, allowing for efficient use of board space in designs.
  • Ideal for embedded systems, enhancing processing power in industrial automation and control.
  • Designed with robust quality assurance standards, ensuring reliable operation in critical tasks.
SKU: XC7Z030-2FFG676I FPGA Chip - High-Performance Zynq-7000 Series in FFG676 Package Category: Brand:
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产品上方询盘

XC7Z030-2FFG676I Overview

The XC7Z030-2FFG676I is a versatile system-on-chip (SoC) solution designed for high-performance applications. Featuring dual-core ARM Cortex-A9 processors, this device balances power efficiency with robust processing capabilities. Its integrated FPGA fabric allows for customizable hardware acceleration, making it suitable for various industries. With enhanced connectivity options and a wide operating temperature range, this SoC is ideal for embedded systems. For detailed specifications, visit IC Manufacturer.

XC7Z030-2FFG676I Key Features

  • Dual Core ARM Cortex-A9: This architecture allows for high-speed processing, enabling efficient multitasking and improved performance in demanding applications.
  • FPGA Fabric: The integrated FPGA provides flexibility for hardware customization, allowing engineers to tailor solutions for specific application requirements.
  • Low Power Consumption: Designed with power efficiency in mind, this device operates effectively in energy-sensitive environments, reducing operational costs.
  • Wide Temperature Range: The device is optimized to function in various environmental conditions, making it suitable for industrial applications.

XC7Z030-2FFG676I Technical Specifications

Parameter Value
Technology Node 28nm
Core Count 2
Max Clock Frequency 1 GHz
FPGA Logic Cells 30,000
RAM Size 1 GB
Power Supply Voltage 1.0V to 1.2V
Package Type 676 Ball Grid Array (BGA)
Operating Temperature -40??C to 100??C

XC7Z030-2FFG676I Advantages vs Typical Alternatives

This device provides superior integration capabilities compared to typical alternatives, combining processing power with FPGA flexibility in a single package. The dual-core architecture enhances performance while maintaining low power consumption, making it an excellent choice for industrial applications.

Typical Applications

  • Industrial Automation: The XC7Z030-2FFG676I is ideal for controlling robotic systems, enabling real-time processing and data handling for improved operational efficiency.
  • Medical Devices: Its versatility allows for the development of advanced diagnostic and monitoring equipment, ensuring reliable performance in critical applications.
  • Smart Grids: This SoC can be utilized in energy management systems, optimizing the distribution and consumption of resources.
  • Telecommunications: Suitable for network equipment, it facilitates high-speed data processing and communication, supporting modern connectivity needs.

XC7Z030-2FFG676I Brand Info

The XC7Z030-2FFG676I is part of a renowned line of SoC products known for their reliability and performance in diverse applications. This product is developed by a leading manufacturer in the semiconductor industry, focusing on delivering innovative solutions tailored for embedded systems.

FAQ

What are the main advantages of using the XC7Z030-2FFG676I?

This device combines a powerful dual-core processor with FPGA capabilities, offering flexibility and high performance in a compact form factor suitable for various industrial applications.

How does the power consumption of the XC7Z030-2FFG676I compare to its competitors?

The XC7Z030-2FFG676I is designed for low power consumption, which makes it an efficient option for energy-sensitive applications compared to many alternatives in the market.

What types of connectivity does the XC7Z030-2FFG676I support?

This SoC supports various connectivity options, including Ethernet and USB, which are critical for seamless integration into modern industrial systems.

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产品中间询盘

Is the XC7Z030-2FFG676I suitable for harsh environments?

Yes, it has an operating temperature range of -40??C to 100??C, making it well-suited for use in demanding industrial environments.

What is the typical RAM size for the XC7Z030-2FFG676I?

The device typically comes with 1 GB of RAM, providing ample memory for processing complex tasks and applications efficiently.

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