XCAU25P-1FFVB676E Overview
The XCAU25P-1FFVB676E is a high-performance semiconductor designed for advanced applications requiring reliable processing power and efficiency. It integrates cutting-edge technology to enhance performance while maintaining low power consumption. This device is ideal for engineers and sourcing specialists looking for a robust solution in their electronic designs. For more details, visit IC Manufacturer.
XCAU25P-1FFVB676E Key Features
- High Processing Power: Delivers exceptional performance for demanding applications, ensuring quick data processing and smooth operational efficiency.
- Low Power Consumption: Optimized for energy efficiency, reducing operational costs and extending the lifespan of the device in embedded systems.
- Robust Reliability: Built to withstand harsh environments, offering enhanced durability and consistent performance over time.
- Seamless Integration: Designed for easy integration into existing systems, facilitating quicker deployment and reduced time to market.
XCAU25P-1FFVB676E Technical Specifications
| Parameter | Value |
|---|---|
| Core Count | Dual-core |
| Operating Frequency | Up to 1.5 GHz |
| Power Supply Voltage | 1.2 V |
| Package Type | 676-ball FCBGA |
| Process Technology | 28 nm |
| Memory Support | DDR4 |
| Temperature Range | -40??C to +125??C |
| Pin Count | 676 |
XCAU25P-1FFVB676E Advantages vs Typical Alternatives
Compared to typical alternatives, this device offers superior processing capabilities combined with energy efficiency, making it an optimal choice for applications requiring high sensitivity and accuracy. The reliable performance ensures minimal downtime, enhancing overall system productivity.
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Typical Applications
- Embedded systems in industrial automation, where reliable processing is critical for operational efficiency and safety.
- Automotive applications that require robust performance under challenging environmental conditions.
- Telecommunication devices needing high-speed data processing for seamless connectivity.
- Consumer electronics that demand compact design while maintaining high operational reliability.
XCAU25P-1FFVB676E Brand Info
The XCAU25P-1FFVB676E is a product developed by a leading semiconductor manufacturer known for its innovation and commitment to quality. This device reflects the brand’s dedication to providing high-performance solutions tailored to meet the evolving demands of the electronics industry.
FAQ
What are the main applications for the XCAU25P-1FFVB676E?
This device is primarily used in embedded systems, automotive applications, telecommunications, and consumer electronics, ensuring versatility across various sectors.
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How does the XCAU25P-1FFVB676E ensure energy efficiency?
The design incorporates advanced power management features that optimize energy consumption, helping to reduce overall operational costs while maintaining high performance.
What is the operating temperature range of this device?
The XCAU25P-1FFVB676E operates effectively within a temperature range of -40??C to +125??C, making it suitable for harsh environments.
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How does the dual-core architecture benefit performance?
The dual-core architecture allows for parallel processing of tasks, enhancing computational efficiency and enabling faster data handling in complex applications.
What memory types are supported by this product?
This device supports DDR4 memory, which provides significant improvements in speed and bandwidth, critical for modern applications requiring high data throughput.
