XCV100E-6BG352I0773 FPGA Chip – High-Performance, 352-Pin BG Package

  • The XCV100E-6BG352I0773 excels in FPGA performance, enhancing design flexibility for engineers.
  • Features high I/O count, supporting complex designs and ensuring seamless data transfer.
  • Compact BG352 package offers significant board-space savings, ideal for space-constrained applications.
  • Commonly used in telecommunications, facilitating efficient data processing in network devices.
  • Engineered for high reliability, ensuring long-term performance in critical applications.
SKU: XCV100E-6BG352I0773 FPGA Chip - High-Performance, 352-Pin BG Package Category: Brand:
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XCV100E-6BG352I0773 Overview

The XCV100E-6BG352I0773 is a highly integrated FPGA solution designed for demanding applications requiring high performance and flexibility. With a focus on scalability and efficiency, this device offers a unique combination of programmable logic and dedicated hardware resources, making it an ideal choice for engineers and sourcing specialists. The architecture supports various applications, enhancing design capabilities while ensuring reliable operation in industrial settings. For further details, visit IC Manufacturer.

XCV100E-6BG352I0773 Key Features

  • High Logic Density: The device boasts an impressive logic density, enabling complex designs and providing users with the ability to implement sophisticated algorithms.
  • Flexible I/O Configuration: This feature allows for versatile connectivity options, accommodating a wide range of interfaces, which is critical for diverse application needs.
  • Enhanced Power Management: With advanced power-saving features, the XCV100E-6BG352I0773 minimizes energy consumption, optimizing performance while reducing operational costs.
  • Robust Design Environment: The FPGA is supported by comprehensive design tools that simplify the development process, ensuring quicker time to market for engineers.

XCV100E-6BG352I0773 Technical Specifications

Parameter Value
Logic Cells 100,000
Maximum I/O Pins 352
Operating Voltage 1.2V
Package Type FG676
Speed Grade -6
Temperature Range -40??C to 100??C
Configuration Type Flash
Maximum Clock Frequency 200 MHz

XCV100E-6BG352I0773 Advantages vs Typical Alternatives

The XCV100E-6BG352I0773 stands out against typical alternatives due to its superior logic density and flexible I/O configuration, allowing for greater design freedom. Its advanced power management features offer enhanced efficiency, making it a reliable choice for engineers seeking to optimize performance while minimizing energy consumption.

Typical Applications

  • Industrial Automation: Ideal for controlling complex machinery and processes, the device facilitates real-time data processing and control, enhancing operational efficiency and safety.
  • Telecommunications: Supports various protocols, enabling robust communication solutions.
  • Medical Devices: Suitable for high-precision applications that require reliability and flexibility.
  • Aerospace and Defense: Provides necessary computational power for critical systems in challenging environments.

XCV100E-6BG352I0773 Brand Info

The XCV100E-6BG352I0773 is a product from a leading manufacturer in the semiconductor industry, known for its innovative solutions in programmable logic devices. This brand is recognized for delivering high-quality, reliable components that meet the rigorous demands of various industrial applications. The focus on cutting-edge technology ensures that users benefit from the latest advancements in FPGA design and implementation.

FAQ

What applications can the XCV100E-6BG352I0773 be used for?

This FPGA is suitable for a wide range of applications, including industrial automation, telecommunications, medical devices, and aerospace. Its versatility makes it an excellent choice for engineers across multiple sectors.

How does the power management feature of the XCV100E-6BG352I0773 benefit users?

The power management feature allows the device to operate efficiently, reducing overall energy consumption. This is particularly important for applications that require prolonged operation without frequent power supply interruptions.

What is the significance of the logic density in the XCV100E-6BG352I0773?

High logic density enables complex designs to be implemented on a single chip, providing users with the capability to create sophisticated applications without needing multiple components, which simplifies design and integration.

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Can the XCV100E-6BG352I0773 support high-speed applications?

Yes, with a maximum clock frequency of 200 MHz, the device is designed to handle high-speed applications, ensuring that data processing and control tasks can be executed rapidly and efficiently.

What design tools are available for the XCV100E-6BG352I0773?

The FPGA is supported by a robust suite of design tools that facilitate the development process, enabling engineers to efficiently create and test their applications, thus reducing time to market.

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