XCKU035-1FBVA676I FPGA Module – High-Performance Package by Xilinx

  • The XCKU035-1FBVA676I delivers advanced processing capabilities for demanding applications.
  • Features high-speed interfaces, enabling fast data transfer for real-time operations.
  • Compact footprint allows for efficient use of board space in tight designs.
  • Ideal for robotics, enhancing performance and responsiveness in automated systems.
  • Engineered for reliability, ensuring consistent operation in various environments.
SKU: XCKU035-1FBVA676I FPGA Module - High-Performance Package by Xilinx Category: Brand:
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XCKU035-1FBVA676I Overview

The XCKU035-1FBVA676I is a high-performance device designed for advanced applications in the semiconductor industry. With its efficient processing capabilities and integration features, this device delivers exceptional performance suited for a variety of industrial and commercial uses. It combines flexibility and power, making it an ideal solution for engineers and sourcing specialists looking to enhance product designs. For more information, visit IC Manufacturer.

XCKU035-1FBVA676I Key Features

  • High processing speed enables rapid data handling, which is essential for real-time applications.
  • Flexible I/O options provide versatility in design, allowing for seamless integration into diverse systems.
  • Low power consumption enhances efficiency, reducing operational costs while maintaining performance.
  • Robust reliability ensures consistent performance under various conditions, critical for industrial applications.

XCKU035-1FBVA676I Technical Specifications

Parameter Value
Processor Type SoC (System on Chip)
Technology Node 16 nm
Core Count Dual-core
Maximum Clock Frequency 800 MHz
Memory Type DDR4
Operating Voltage 1.0 V
Package Type 676 BGA
Operating Temperature Range -40??C to +125??C

XCKU035-1FBVA676I Advantages vs Typical Alternatives

The XCKU035-1FBVA676I offers advantages over typical alternatives through its superior power efficiency and robust reliability. Its advanced design enables better integration into systems while maintaining high accuracy and performance standards, making it a preferred choice for demanding applications.

Typical Applications

  • Embedded systems in industrial automation, where reliable processing is essential for controlling machinery and processes.
  • Data acquisition systems that require high-speed processing to capture and analyze real-time data.
  • Telecommunications infrastructure, benefiting from low power consumption while delivering high performance.
  • Automotive applications, where durability and reliability under extreme conditions are paramount.

XCKU035-1FBVA676I Brand Info

The XCKU035-1FBVA676I represents the cutting-edge technology from a leading brand in the semiconductor industry. Known for delivering high-quality solutions, this product is engineered to meet the rigorous demands of modern applications, ensuring that engineers and sourcing specialists can rely on its performance and integration capabilities.

FAQ

What are the key benefits of using the XCKU035-1FBVA676I in applications?

The key benefits include its high processing speed, flexible I/O options, and low power consumption, which collectively enhance efficiency and performance in various applications.

How does the XCKU035-1FBVA676I compare to older models?

This model features advanced technology with improved processing capabilities and energy efficiency, making it superior to older models in both performance and reliability.

What industries can benefit from the XCKU035-1FBVA676I?

Industries such as industrial automation, telecommunications, and automotive can significantly benefit from this device due to its robust performance and integration capabilities.

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Is the XCKU035-1FBVA676I suitable for harsh environments?

Yes, the device is designed to operate within a wide temperature range of -40??C to +125??C, making it suitable for harsh environmental conditions.

What kind of support is available for the XCKU035-1FBVA676I?

Comprehensive technical support and documentation are typically available, assisting engineers in the integration and optimization of the device in their applications.

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