XC7K160T-2FFG676I Overview
The XC7K160T-2FFG676I is a high-performance FPGA designed for demanding applications in telecommunications, automotive, and industrial systems. With its advanced architecture, this device delivers exceptional processing capabilities and integration features that support complex system designs. Ideal for engineers and sourcing specialists, it ensures optimal performance while maintaining low power consumption, making it a reliable choice for various applications. For more information, visit IC Manufacturer.
XC7K160T-2FFG676I Key Features
- High Logic Density: The XC7K160T-2FFG676I offers a substantial number of logic cells, enabling the implementation of complex algorithms and processing tasks efficiently.
- Integrated DSP Slices: This FPGA includes dedicated DSP resources, allowing for high-speed signal processing which is crucial in applications like video processing and communications.
- Low Power Consumption: Designed with power efficiency in mind, this model reduces operational costs while enhancing system reliability and performance.
- Flexible I/O Options: It supports a wide range of I/O standards, providing versatility in interfacing with various devices and systems.
XC7K160T-2FFG676I Technical Specifications
| Parameter | Value |
|---|---|
| Logic Cells | 160K |
| DSP Slices | 480 |
| Block RAM | 7.2MB |
| Maximum I/O Pins | 676 |
| Power Supply Voltage | 0.95 – 1.05V |
| Package Type | Fine Pitch Ball Grid Array (FBGA) |
| Operating Temperature Range | -40 to +100??C |
| Configuration Memory | 4MB |
XC7K160T-2FFG676I Advantages vs Typical Alternatives
The XC7K160T-2FFG676I stands out against typical alternatives due to its superior logic density and integrated DSP capabilities, which enhance processing efficiency and speed. Its low power consumption helps maintain thermal stability, making it ideal for long-term deployments in challenging environments.
🔥 Best-Selling Products
Typical Applications
- Telecommunications: This device is widely used in telecommunications systems for high-speed data processing and protocol management, ensuring robust communication links and minimal latency.
- Automotive Systems: Ideal for advanced driver-assistance systems (ADAS), providing real-time processing for sensor data and image recognition.
- Industrial Automation: Employed in factory automation systems, it enables reliable control and monitoring of equipment and processes.
- Medical Imaging: Utilized in medical imaging technologies, offering the processing power required for detailed analysis and real-time feedback.
XC7K160T-2FFG676I Brand Info
The XC7K160T-2FFG676I is produced by a leading manufacturer in the field of semiconductor technology, known for its innovative solutions in programmable logic devices. This brand is recognized for delivering high-quality, reliable products that empower engineers to push the boundaries of technology in various industries.
FAQ
What applications can the XC7K160T-2FFG676I be used for?
This FPGA is suitable for a variety of applications, including telecommunications, automotive systems, industrial automation, and medical imaging, making it a versatile choice for engineers.
🌟 Featured Products
-

“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”
-

QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
-

0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality
-

1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
What are the power requirements for the XC7K160T-2FFG676I?
The operating voltage for this device ranges from 0.95 to 1.05V, ensuring efficient power consumption while delivering high performance across applications.
How does the XC7K160T-2FFG676I compare to other FPGAs?
It offers superior logic density, integrated DSP slices, and low power consumption, giving it an edge over many other FPGAs in terms of performance and efficiency.
📩 Contact Us
Is the XC7K160T-2FFG676I suitable for harsh environments?
Yes, it operates within a temperature range of -40 to +100??C, making it suitable for deployment in harsh industrial and automotive environments.
What type of package does the XC7K160T-2FFG676I use?
This model comes in a Fine Pitch Ball Grid Array (FBGA) package, which provides a compact footprint and efficient thermal performance.





