LC878396PA-5BP5-E Overview
The LC878396PA-5BP5-E is a high-performance integrated circuit designed for advanced electronic applications requiring precise signal processing and efficient power management. This device features a robust architecture optimized for low power consumption and high reliability, making it ideal for industrial and consumer electronics. With its versatile input/output configurations and compact package, it supports seamless integration into complex systems. Engineers and sourcing specialists will appreciate its proven stability and consistent performance under varying operational conditions. For detailed technical support and procurement, visit the IC Manufacturer.
LC878396PA-5BP5-E Key Features
- Integrated signal processing core: Enables precise data handling, improving overall system accuracy and responsiveness.
- Low power operation: Reduces energy consumption, extending device lifespan and lowering thermal output in critical applications.
- High integration density: Combines multiple functions within a compact footprint, simplifying board design and reducing component count.
- Robust input/output interfaces: Support diverse signal standards, enhancing compatibility with various peripheral devices.
- Enhanced reliability: Designed to maintain stable performance under industrial temperature ranges and electrical stress.
LC878396PA-5BP5-E Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Voltage | 3.3 V ?? 10% |
| Package Type | QFN-48 |
| Operating Temperature Range | -40??C to +85??C |
| Core Frequency | Up to 100 MHz |
| Power Consumption | Typical 150 mW |
| Input/Output Pins | 48 |
| Signal Interface | SPI, I2C Compatible |
| ESD Protection | ??4 kV HBM |
| Package Dimensions | 7 mm x 7 mm |
LC878396PA-5BP5-E Advantages vs Typical Alternatives
This device offers superior integration and low power consumption compared to typical alternatives, resulting in enhanced system efficiency and reduced thermal management needs. Its broad operating temperature range and robust ESD protection ensure reliable operation in harsh industrial environments. The flexible I/O interfaces allow easier system compatibility, making it a preferred choice for engineers seeking dependable and scalable semiconductor solutions.
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Typical Applications
- Industrial automation control systems, where precise signal processing and durability under extended temperature ranges are critical for maintaining operational accuracy and uptime.
- Consumer electronics requiring efficient power management and compact integration for space-constrained designs.
- Embedded systems that demand reliable communication interfaces such as SPI and I2C for sensor data acquisition and control.
- Automotive electronics applications benefiting from robust ESD protection and stable performance across varying voltage conditions.
LC878396PA-5BP5-E Brand Info
The LC878396PA-5BP5-E is manufactured by a leading semiconductor brand renowned for delivering high-quality integrated circuits tailored to industrial and consumer markets. This brand is recognized for its commitment to innovation, reliability, and comprehensive technical support, ensuring that engineers and sourcing specialists receive dependable components that meet stringent performance standards. Their extensive portfolio includes a wide range of power management and signal processing ICs, making them a trusted partner in advanced electronics design.
FAQ
What is the typical power consumption of this device?
The device typically consumes around 150 milliwatts under standard operating conditions, enabling efficient energy use while maintaining high performance. This low power profile helps reduce heat generation and supports longer operational life in embedded systems.
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Which communication interfaces does this IC support?
It supports common serial communication protocols including SPI and I2C, allowing easy integration with a variety of sensors and microcontrollers. These interfaces facilitate flexible data exchange in complex electronic systems.
What is the operating temperature range for reliable use?
This integrated circuit is rated for operation between -40??C and +85??C, making it suitable for demanding industrial environments and applications exposed to wide temperature variations.
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How does the package type benefit system design?
The QFN-48 package offers a compact footprint of 7 mm by 7 mm, which helps reduce overall board size and improves thermal dissipation. This package type also supports automated assembly processes, enhancing manufacturing efficiency.
Is the device protected against electrostatic discharge?
Yes, it includes ESD protection rated at ??4 kV Human Body Model (HBM), which safeguards the IC against common electrostatic events during handling and operation, improving device reliability and longevity.
