AM2432BKEGHIALXR Embedded Microprocessor – Tape and Reel

  • Provides deterministic control and low-latency processing for embedded systems, improving responsiveness for AM2432BKEGHIALXR.
  • Numeric identifier 2432 clarifies family and compatibility, reducing BOM errors and simplifying firmware targeting.
  • Compact silicon minimizes board area and power draw, optimizing thermal design and battery life.
  • Ideal for industrial motor control, providing deterministic timing and predictable I/O behavior for safer operations.
  • Manufactured with automated testing and traceability, delivering consistent quality and reduced field failure rates.
SKU: AM2432BKEGHIALXR Category: Brand:
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产品上方询盘

AM2432BKEGHIALXR Overview

The AM2432BKEGHIALXR is a high-integration microprocessor-grade device for industrial control and safety-critical systems. It combines multiple processing domains, rich peripheral I/O, and deterministic real-time capability in a compact package to simplify board designs. The part targets engineers who need tighter system integration, fewer external components, and lower BOM count versus separate MCU and peripheral solutions. For full ordering and lifecycle details visit IC Manufacturer.

AM2432BKEGHIALXR Technical Specifications

Parameter Value
Core architecture 32?bit ARM cores (multi?domain)
Maximum core frequency Up to 400 MHz
On?chip flash / nonvolatile memory Up to 2 MB
On?chip RAM Up to 1 MB
Package type BGA, Lx ?? Wx pin format
Total I/O / GPIO Greater than 100 pins available
Operating temperature range -40 ??C to +85 ??C (industrial grade)
Core supply voltage 1.1 V (typical core domain)
I/O supply voltage 1.8 V / 3.3 V tolerant domains
Integrated peripherals Multiple serial controllers, timers, ADCs, and secure boot

AM2432BKEGHIALXR Key Features

  • Multi?domain processing: Combines deterministic real?time cores with application processors to reduce latency and improve control accuracy.
  • High on?chip memory: Larger embedded flash and RAM lower external memory need, reducing BOM and board area.
  • Rich peripheral set: Multiple serial, timer, and ADC blocks simplify sensor and actuator integration for industrial systems.
  • Industrial temperature grade: Rated for -40 ??C to +85 ??C to meet more stringent environmental requirements than consumer parts.

Typical Applications

  • Motor control and drives where tight real?time control and integrated analog interfaces reduce latency and simplify system design for 3?phase and multi?motor topologies.
  • Industrial automation controllers that require on?chip secure boot, multiple I/O banks, and deterministic cores for reliable machine control and safety functions.
  • Human?machine interfaces and gateway modules that combine local deterministic control with richer application functionality and network connectivity.
  • Sensors and measurement systems that need precise ADC performance, low jitter timers, and high integration to lower PCB area and component count for field instruments.

AM2432BKEGHIALXR Advantages vs Typical Alternatives

The device integrates more processing domains and memory on a single die than many discrete MCU plus co?processor solutions. That integration reduces board complexity, cuts component count, and lowers system power in many designs. With industrial temperature support and expanded I/O, it offers better environmental tolerance and higher functional density versus typical consumer?grade MCU options. This leads to faster time?to?market and fewer layout constraints for mid? to high?channel-count industrial systems.

AM2432BKEGHIALXR Brand Info

The AM2432BKEGHIALXR is offered by Texas Instruments, a leading supplier of analog and embedded processing technologies. The brand provides comprehensive design resources, long term availability commitments, and ecosystem tools to accelerate evaluation and system integration for industrial customers.

FAQ

What core types are included?

The device contains 32?bit ARM processor cores arranged for deterministic control and application processing. Designed to handle both real?time tasks and higher?level functions in the same silicon domain.

Is the part temperature rated for industrial use?

Yes. The specified operating range spans typical industrial grades, enabling reliable operation in -40 ??C to +85 ??C environments for factory and field installations.

How does integration reduce BOM cost?

On?chip flash, RAM, and multiple peripherals reduce the need for external memory and interface chips. Fewer components translate to lower BOM, smaller PCBs, and simpler supply chain considerations.

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What package should designers expect?

The product is supplied in a BGA style package to maximize pin density and thermal performance. BGA packaging provides more I/O per area versus QFN alternatives for the same footprint.

Where can engineers find development resources?

Design and evaluation support, reference designs, and SW libraries are available via the manufacturer’s online resource center and technical documentation to shorten prototyping cycles and reduce integration risk.

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