MSP430F157IPM 16-bit Low-Power Microcontroller (IPM Package)

MSP430F157IPM Overview

The MSP430F157IPM is a member of the MSP430 microcontroller family designed for low-power, mixed-signal embedded applications. It targets engineers and sourcing specialists who need a compact, energy-efficient 16-bit MCU platform with integrated peripherals. For complete, authoritative specifications and ordering information consult the official IC Manufacturer resources or the device product sheet supplied with your project.

MSP430F157IPM Technical Specifications

MSP430F157IPM Key Features

• 16-bit core delivers efficient instruction execution for control and sensing tasks while keeping code density high.
• Low-power modes minimize energy consumption in idle states, which matters for battery-operated and energy-sensitive systems.
• Integrated mixed-signal peripherals reduce BOM count and simplify board layout by combining timers, analog conversion, and serial I/O.
• Compact package supports space-constrained designs and eases integration into existing form factors when the IPM package is specified.

Typical Applications

• Industrial sensor nodes requiring long battery life and reliable analog-to-digital conversion for intermittent measurement and reporting tasks.
• Portable instrumentation where compact footprints, multiple low-power modes, and integrated peripherals reduce component count and power draw.
• Building automation controllers that need precise timing, serial communication interfaces, and low standby current in large-scale deployments.
• Embedded metering and data-logging devices that demand energy-efficient measurement, local processing, and interface flexibility for external buses.

MSP430F157IPM Advantages vs Typical Alternatives

The MSP430F157IPM stands out for its focus on ultralow power and integration. Compared to typical 8-bit MCUs, the 16-bit core offers higher computational efficiency and improved code density. Versus larger 32-bit parts, it often yields lower active and standby consumption while integrating common analog and timing peripherals. For applications prioritizing power and peripheral integration, this device reduces system-level complexity and supports longer field operation.

MSP430F157IPM Brand Info

The MSP430 series is produced by Texas Instruments (TI). TI positions this family as a low-power, mixed-signal MCU line for industrial and portable applications. The brand emphasizes robust supply chain support, long product lifecycles, and comprehensive technical documentation to support design, qualification, and sourcing activities.

FAQ

What is the recommended datasheet?

Consult the official MSP430F157 product datasheet from the device manufacturer for definitive electrical characteristics, pinout, memory sizes, and package drawings. The datasheet is the primary source for design and sourcing decisions.

Which package does IPM indicate?

IPM is the manufacturer’s package code. Refer to the device mechanical drawing in the official documentation to confirm pin count, footprint dimensions, and thermal recommendations for PCB layout.

How to verify operating voltage and temperature?

Verify the rated supply voltage range and operating temperature limits directly in the datasheet. Use those limits to set system power rails and thermal margins in design reviews and component qualification tests.

Where to find peripheral details?

Peripheral block diagrams, timing characteristics, and register descriptions are available in the product user guide and datasheet. Review those sections to confirm ADC resolution, timer capabilities, and serial interface details for firmware planning.

How to get lifecycle and sourcing information?

Check the manufacturer’s product status pages and distributor listings for lifecycle status, lead times, and recommended part alternatives. For long-term projects, use TI-authorized distribution channels and official ordering codes.