MSP430F2131IPW Overview
The MSP430F2131IPW is a low-power, 16-bit microcontroller designed for compact industrial and consumer control tasks. It combines a 16-bit CPU with on-chip flash and static RAM to deliver more code density and lower power than many 8-bit alternatives. The device comes in a 20-pin TSSOP package and supports a wide supply range for flexible system designs. See the product family at IC Manufacturer for ordering and compliance details.
MSP430F2131IPW Technical Specifications
| Parameter | Specification |
|---|---|
| CPU Architecture | 16-bit RISC |
| Maximum CPU Clock | Up to 16 MHz |
| Flash Memory | 2 KB |
| Static RAM | 128 B |
| Digital I/O | Up to 16 general-purpose I/O pins |
| Timers | Timer_A with 3 capture/compare registers |
| ADC | 10-bit ADC |
| Serial Interface | USI (Universal Serial Interface) |
| Package | 20-pin TSSOP (PW) |
| Supply Voltage | 1.8 V to 3.6 V |
| Operating Temperature | -40 ??C to +85 ??C |
MSP430F2131IPW Key Features
- Single 16-bit core for higher computational efficiency than 8-bit MCUs, enabling more compact code and faster arithmetic.
- Integrated flash memory for non-volatile code storage and in-system reprogramming, which simplifies firmware updates and reduces BOM cost.
- Low-voltage operation from 1.8 V to 3.6 V, allowing direct interface with a range of battery chemistries and 3.3 V systems for easier system integration.
- On-chip 10-bit ADC and timer resources that support precise analog sensing and deterministic timing for control loops and motor or power-management tasks.
- Compact 20-pin TSSOP package that is smaller than many DIP or SOIC alternatives, saving board space in tight industrial or wearable designs.
Typical Applications
- Battery-powered sensor nodes and portable instrumentation where low idle current and sub-3.6 V operation extend runtime and reduce power management complexity.
- Precision analog front-ends for small industrial controllers that need a 10-bit ADC and timer capture/compare for reliable measurement and control.
- Consumer appliances and handheld devices that require compact 20-pin packaging and up to 16 MHz processing for responsive user interfaces.
- Embedded control for small motors, pumps, or actuators where deterministic Timer_A channels and dedicated I/O simplify PWM generation and feedback capture.
MSP430F2131IPW Advantages vs Typical Alternatives
The device offers lower power consumption and higher code density compared with many 8-bit MCUs, while keeping a smaller footprint than many 32-bit controllers in similar roles. With a 16-bit core, integrated flash, and a 10-bit ADC, it provides a balanced mix of performance and analog capability for cost-sensitive designs. The 20-pin TSSOP package further reduces board area versus larger packages, which benefits compact and cost-driven systems.
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MSP430F2131IPW Brand Info
The MSP430F2131IPW is part of the MSP430 family from Texas Instruments. The MSP430 line focuses on ultralow-power microcontrollers optimized for mixed-signal applications. Designs from this brand emphasize energy efficiency, integrated analog peripherals, and strong ecosystem support, including development tools and in-circuit programming.
FAQ
What core does it use?
It uses a 16-bit RISC core. This provides more arithmetic range and denser code than 8-bit cores, helping to reduce ROM use and improve response time in control tasks.
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What is the supply voltage range?
The specified supply range is 1.8 V to 3.6 V, which allows direct operation from common battery sources and standard 3.3 V system rails without extra power conversion.
How much non-volatile memory is available?
The device includes 2 KB of on-chip flash memory, enabling compact firmware storage and in-field reprogramming for iterative product development and updates.
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Does it include an ADC?
Yes, a built-in 10-bit ADC supports moderate-resolution analog measurements suitable for sensors, voltage monitoring, and small control loops without external converters.
Which package is offered?
It is supplied in a 20-pin TSSOP package (suffix PW), which is smaller than many through-hole or SOIC offerings and is compatible with standard surface-mount assembly processes.



