MSP430G2312IN20 16-bit MCU, 20-pin package

  • MSP430G2312IN20 microcontroller delivers low-power control, extending device battery life reliably.
  • 16-bit CPU enables efficient arithmetic and faster control loop response.
  • 20-pin footprint minimizes PCB area, enabling compact designs and layout.
  • Ideal for sensor nodes, managing I/O and low-power tasks efficiently.
  • Manufacturing tests and burn-in screening provide long-term reliability and consistency.
SKU: MSP430G2312IN20 Category: Brand:
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MSP430G2312IN20 Overview

The MSP430G2312IN20 is a low-power 16-bit microcontroller family member widely used for cost-sensitive embedded control. To produce a complete, datasheet-accurate description and a parameter-verified specification list, I need the official product sheet content. Once supplied, I will extract precise values for core speed, memory sizes, I/O count, voltage range, package dimensions and thermal limits, and present optimized copy for engineers and sourcing specialists. For supply-chain and manufacturer context, visit IC Manufacturer.

MSP430G2312IN20 Technical Specifications

Parameter Value (from datasheet)
Core architecture Refer to the datasheet for the exact MSP430 core revision and instruction set details.
Maximum clock rate See official sheet for the validated maximum system clock frequency (MHz).
Flash memory See datasheet for exact flash capacity (bytes or kilobytes).
SRAM / RAM Datasheet lists on-chip RAM size in bytes; use that value for firmware budgeting.
Operating voltage range Consult the datasheet for the specified VCC / VDD range and recommended operating points.
Package IN20 denotes the 20-pin package option; datasheet contains full mechanical drawing and pinout.
Number of GPIOs Refer to the device pinout table for the exact count of general-purpose I/O pins.
Timers and peripherals Datasheet enumerates Timer_A, USI or UART, ADC (if present), and any comparator modules.
Temperature range See the datasheet for ambient and junction operating temperature specifications (??C).
Package dimensions & thermal info Refer to mechanical drawings and thermal characteristics in the datasheet for design integration.

MSP430G2312IN20 Key Features

  • One low-power 16-bit MCU core delivering deterministic, efficient code execution for tight embedded loops.
  • Integrated peripherals such as timers and serial interfaces, enabling simple sensor and actuator control without external chips.
  • Designed for energy efficiency and long battery life, reducing total system power compared with many 8-bit alternatives.
  • Compact 20-pin package option for easy through-hole or PCB mounting, simplifying prototyping and low-cost production.

Typical Applications

  • Battery-powered sensor modules that require multi-year life and predictable current draw while running periodic measurements and sleep cycles.
  • Low-cost industrial control nodes that need deterministic timing, simple serial communication, and compact PCB footprint for distributed I/O.
  • Appliance user interfaces where low standby power and a small pin count support buttons, LEDs, and basic display control with minimal BOM cost.
  • Educational and rapid-prototyping platforms that benefit from a simple 20-pin package and easy access to GPIO, timers, and serial interfaces for learning embedded design.

MSP430G2312IN20 Advantages vs Typical Alternatives

The device emphasizes lower active and standby power compared with many 8-bit MCUs, making it attractive where battery life matters. Its 16-bit architecture provides wider data paths and more compact code for arithmetic-heavy tasks than 8-bit controllers. The 20-pin package reduces system complexity and cost versus larger MCUs, while integrated timers and serial peripherals cut the need for external components. For sourcing and BOM optimization, the compact pin count and straightforward feature set often yield lower board area and simpler assembly.

MSP430G2312IN20 Brand Info

The MSP430G2312IN20 is part of the MSP430 family from Texas Instruments, a long-established semiconductor supplier. TI positions this family for low-power, cost-sensitive embedded control, with broad toolchain support and extensive documentation for firmware development and hardware integration.

FAQ

What package options exist?

The datasheet identifies available mechanical packages and their pinouts, including the IN20 option. For board layout and hole patterns, consult the package mechanical drawing and recommended land pattern in the datasheet.

How to confirm the operating voltage?

Use the official electrical characteristics table in the datasheet to confirm the rated operating voltage range, recommended decoupling, and any voltage sequencing notes before finalizing the power supply design.

Where to find exact memory sizes?

The device memory map and the exact Flash and RAM sizes are listed in the memory section of the datasheet. Use those values to estimate code footprint and stack/heap requirements for firmware.

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Which development tools support the device?

Toolchain, debugger, and IDE compatibility are described by the manufacturer. Check the datasheet and the vendor website for supported compilers, programmers, and reference hardware that speed development.

How are temperature limits specified?

Temperature ratings, derating curves, and any thermal resistance numbers are in the datasheet??s thermal and absolute maximum ratings sections. Use those figures for reliability and environmental qualification planning.

Upload the official MSP430G2312IN20 datasheet or paste its content and I will generate a complete, datasheet-accurate product description with a populated technical table, verified numerical parameters, mechanical drawings, and sourcing recommendations.

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