MSPM0L1306TDGS20R Power Management IC in TDGS20R Package

MSPM0L1306TDGS20R Overview

The entry below cannot draw technical facts without the product datasheet attached to this session. I can produce a precise, comparative, and sourcing?ready description once the official sheet is available. Output will include exact electrical ratings, package dimensions, pinout, thermal data, and ordering codes with cross references to distributors. For sourcing and verification, I will reference the original manufacturer and include one authoritative link to IC Manufacturer. Attach the official product sheet and I will deliver a full, engineer?grade product brief within the requested scope.

MSPM0L1306TDGS20R Technical Specifications

MSPM0L1306TDGS20R Key Features

• Precise specification delivery: Finalized electrical ratings and pinout will be provided directly from the official datasheet to ensure accurate design-in decisions.
• Clear mechanical data: Exact package dimensions and footprint guidance will enable tighter PCB layouts and faster first-pass assembly validation.
• Thermal and reliability focus: Device thermal limits and derating curves will be extracted to support robust thermal management and reliability planning.
• Sourcing and compliance: Full ordering codes, package variants, and compliance declarations will be included to support procurement and regulatory checks.

Typical Applications

• Power conversion modules and DC?DC converters where precise voltage and current ratings are needed for safe component selection and board layout planning over product life.
• Industrial control systems that demand defined thermal performance and long-term reliability data to comply with 24/7 operational profiles and safety margins.
• Automotive or transportation electronics that require exact package outlines, qualification levels, and compliance information for supplier qualification and testing.
• High?density consumer or communications equipment where mechanical footprint, pin assignment, and thermal resistance directly affect integration and cooling solutions.

MSPM0L1306TDGS20R Advantages vs Typical Alternatives

Without the official datasheet I cannot list measured advantages in numbers. Once the datasheet is reviewed, I will compare the device vs typical alternatives using measurable criteria: voltage rating, current capacity, thermal resistance, package size, and switching performance. That comparison will highlight where the part offers higher efficiency, smaller footprint, lower thermal rise, or better sourcing terms versus competing parts.

MSPM0L1306TDGS20R Brand Info

I cannot reliably identify the manufacturer from the part number alone in this conversation. When the official sheet or a manufacturer reference is supplied I will confirm the brand, vendor history, and typical product family context. The brand section will include verified contact links, ordering region notes, and recommended authorized distributors for procurement and support.

FAQ

What are the core electrical ratings?

I cannot list voltage, current, or power ratings without the official datasheet. Those core electrical ratings are essential for safe design and will be pulled directly from the manufacturer??s specifications when the datasheet is provided in this session.

Which package does it use?

Package type, pin count, and mechanical dimensions must come from the part??s mechanical drawing. I will extract exact package name, land pattern, and 2D/3D models once I can access the datasheet file or a verified manufacturer reference.

Is the part compliant with RoHS?

Compliance statements (RoHS, REACH, and other environmental declarations) are documented by the manufacturer. I will quote the compliance language and any applicable exemptions as shown on the official datasheet or compliance certificate.

How do I source production quantities?

For procurement guidance I will list typical MOQ, tape?and?reel options, and alternate ordering codes after I review the manufacturer ordering table. I will also recommend authorized distributors based on the brand once identified from the datasheet.

Can you provide a BOM?ready footprint?

Yes. After reviewing the mechanical and land pattern drawings in the datasheet, I will generate PCB footprint recommendations, 3D model links, and pad?stencil dimensions suitable for common assembly processes.