MSP430F2619TPN 16-bit Microcontroller (TPN package)

  • 16-bit MCU core delivers efficient control and reduced code complexity for longer battery operation.
  • Multiple low-power modes minimize idle current, extending runtime in battery-powered designs for extended use.
  • TPN package provides compact footprint, saving board space for denser PCB layouts and tighter enclosures.
  • Ideal for sensor-fusion motor control in energy metering, reducing latency and improving measurement accuracy.
  • MSP430F2619TPN manufactured under TI production controls with tested silicon, enabling dependable field performance.
SKU: MSP430F2619TPN Category: Brand:
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产品上方询盘

MSP430F2619TPN Overview

The MSP430F2619TPN is a low?power 16?bit microcontroller family member intended for embedded control and mixed?signal applications. To produce an accurate, specification?level product description that matches the original product sheet, I need the official device sheet to extract exact numerical data and pin/package details. This ensures the content is technically precise for engineers and sourcing specialists, with correct memory, clocks, peripherals, and electrical values. For supplier and manufacturing context see IC Manufacturer.

MSP430F2619TPN Technical Specifications

Parameter Specification
Core Refer to supplied product sheet for exact core clock and architecture details
Operating Voltage Refer to supplied product sheet for exact voltage range (V)
Program Memory (Flash) Refer to supplied product sheet for exact Flash size (KB)
RAM Refer to supplied product sheet for exact RAM size (KB)
ADC Refer to supplied product sheet for ADC resolution and sampling rate
Timers Refer to supplied product sheet for Timer_A/Timer_B details and counts
IO Count / Packages Refer to supplied product sheet for exact pin count and package types
Operating Temperature Refer to supplied product sheet for specified temperature ranges (??C)

MSP430F2619TPN Key Features

  • Single 16?bit RISC core capability with low?power operation for reduced energy consumption in battery?powered systems.
  • Integrated mixed?signal peripherals and ADC capability plus flexible timers to support precise sensor interfacing and timing tasks, which matters for control accuracy.
  • On?chip nonvolatile and volatile memory coupling provides compact program storage and fast data access, improving system integration and reducing board area.
  • Multiple communication interfaces and GPIO availability facilitate direct connection to external devices and simplify system partitioning for reliability.

Typical Applications

  • Industrial sensor controllers where low power and integrated analog peripherals reduce external components and extend field lifetime across long duty cycles.
  • Motor control and power?management modules that require deterministic timers and mixed?signal interfaces for precise speed or current regulation.
  • Handheld instrumentation and portable measurement devices that demand compact memory, low standby current, and reliable analog acquisition.
  • Embedded control nodes in automation and building management that need robust I/O, accurate timing, and economical board-level integration for scale deployment.

MSP430F2619TPN Advantages vs Typical Alternatives

The MSP430F2619TPN family emphasizes low power consumption and tight mixed?signal integration, offering fewer external components compared to many 8? or 32?bit alternatives. Its 16?bit architecture balances code density and performance, which can reduce memory footprint and BOM cost. For engineers sourcing components, the integration of ADCs, timers, and communications on a single device simplifies layout and improves reliability versus platform architectures that split those functions across multiple ICs.

MSP430F2619TPN Brand Info

The MSP430F2619TPN is part of a long?running microcontroller portfolio from Texas Instruments. Known for low?power 16?bit MCUs, the family targets embedded control and mixed?signal applications, with a focus on energy efficiency, peripheral integration, and industrial reliability for high?volume manufacturing and long lifecycle support.

FAQ

What package options exist?

Package options and their exact pin counts are specified on the official product sheet. Check the datasheet to confirm available TSSOP, QFN, or LQFP variants and associated thermal and mounting information for PCB design.

How to confirm memory sizes?

Flash and RAM sizes are listed on the device datasheet and on supplier product pages. Use the official sheet to verify exact program memory (KB) and volatile memory (KB) for code sizing and heap allocation.

Where is the electrical specification defined?

Operating voltage, current consumption modes, and DC/AC characteristics are defined in the electrical characteristics section of the product sheet and must be referenced to design reliable power supplies and margining.

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产品中间询盘

Which peripherals are included?

Peripheral sets??such as ADC resolution, timers, communication interfaces, and DMA??are enumerated in the datasheet. Refer to that section to map required interfaces to system requirements and pin multiplexing.

How to obtain detailed timing diagrams?

Timing diagrams for clocks, reset, and serial interfaces appear in the datasheet and technical reference guide. Use them when creating firmware, validating signal timing, and performing hardware bring?up.

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