MSPM0L1306TRGER Integrated Circuit (IC) Tape and Reel

MSPM0L1306TRGER Overview

The MSPM0L1306TRGER is a compact surface-mount semiconductor part optimized for board-level power and signal management in industrial systems. Designed for high-volume assembly, it ships in tape-and-reel format and targets engineers needing a reliable, repeatable device for automated placement. The part balances small footprint and robust thermal performance, enabling denser designs and easier sourcing from distributors and IC Manufacturer.

MSPM0L1306TRGER Technical Specifications

MSPM0L1306TRGER Key Features

• Compact surface-mount form factor ?? enables higher board density and smaller overall system footprints compared to through-hole alternatives.
• Tape-and-reel packaging ?? supports automated pick-and-place processes, reducing assembly time and per-unit manufacturing costs for medium to high volumes.
• Industry-standard thermal range ?? suitable for commercial and many industrial environments, improving reliability versus parts rated only for narrow temperature windows.
• RoHS-compliant construction ?? simplifies regulatory compliance and reduces environmental and supplier qualification overhead relative to non-compliant variants.

Typical Applications

• Industrial control boards where compact, reel-friendly components speed up automated assembly and reduce PCB area for denser control electronics.
• Power management modules in embedded systems that require surface-mount parts with consistent thermal handling for reliable long-term operation.
• High-volume manufacturing of consumer-industrial hybrid products where tape-and-reel packages cut pick-and-place cycle time and improve yield.
• Replacement or upgrade programs for legacy through-hole parts where a surface-mount alternative provides better thermal coupling and easier sourcing.

MSPM0L1306TRGER Advantages vs Typical Alternatives

The MSPM0L1306TRGER offers clear assembly and logistics advantages versus discrete, non-reel-packaged alternatives. With tape-and-reel supply, it reduces per-board placement time and supports higher throughput. The surface-mount package yields smaller board area and improved thermal conduction compared to many older through-hole parts. RoHS conformity helps streamline regulatory qualification and procurement compared with non-compliant legacy options.

MSPM0L1306TRGER Brand Info

MSPM0L1306TRGER is associated with Monolithic Power Systems (MPS), a supplier known for power management ICs and compact modules. The brand emphasizes efficient power conversion, compact packaging, and manufacturing scalability for industrial and consumer markets.

FAQ

What package does it use?

The device is supplied in a surface-mount package on tape-and-reel. This format is optimized for automated placement and high-volume SMT assembly lines, improving pick-and-place throughput.

Is the part RoHS compliant?

Yes. The device is described as RoHS compliant and uses lead-free finishes, which simplifies environmental compliance and reduces restrictions during product qualification.

What temperature range is supported?

The part supports a typical industrial temperature span from -40 ??C to +85 ??C, making it suitable for many commercial and industrial control environments where stable operation is required.

How is it packaged for shipping?

It is packaged on reels in tape-and-reel format. This reduces handling time during pick-and-place and ensures consistent orientation for automated assembly lines.

Who supplies this device?

This part is listed under a semiconductor manufacturer specializing in power and board-level devices. Distributors and authorized channels typically stock tape-and-reel formats for production volumes.