MSP430FR4133IPM Overview
The MSP430FR4133IPM is a low-power, 16?bit microcontroller that combines nonvolatile FRAM memory with a compact package and integrated analog and digital peripherals. It targets battery-powered and industrial control systems that require faster write cycles and higher endurance than traditional flash. The device delivers a mix of ultra?low standby consumption, flexible serial interfaces and deterministic real?time timers for responsive control. For sourcing and detailed product support, consult IC Manufacturer.
MSP430FR4133IPM Technical Specifications
| Parameter | Value |
|---|---|
| CPU architecture | 16?bit RISC |
| Maximum clock frequency | 16 MHz |
| Nonvolatile memory (FRAM) | 4 KB |
| SRAM | 256 bytes |
| Operating voltage | 1.8 V to 3.6 V |
| Digital I/O pins | 16 (max) |
| ADC resolution | 12?bit |
| Packages | QFN / VQFN variants (compact) |
| Temperature range (TA) | -40 ??C to +85 ??C |
| Serial interfaces | eUSCI modules for UART/SPI/I2C |
MSP430FR4133IPM Key Features
- FRAM nonvolatile memory ?? enables fast, high?endurance writes and reduces system latency compared with flash.
- Ultra?low power modes ?? extends battery life with low standby current and efficient active mode performance.
- Integrated analog peripherals ?? includes a 12?bit ADC and reference, reducing external component count for compact analog designs.
- Flexible serial connectivity ?? eUSCI supports UART, SPI, and I2C, simplifying integration with sensors and networked modules.
Typical Applications
- Battery?powered sensor nodes and data loggers where high write endurance and low standby current extend service intervals and reduce maintenance costs.
- Industrial human?machine interfaces and small control panels requiring deterministic timers and reliable nonvolatile storage for configuration data.
- Wearables and portable medical devices that need compact packages, robust low?power operation, and accurate 12?bit ADC measurements for analog signals.
- Embedded communications and protocol bridges where multiple serial interfaces (UART/SPI/I2C) enable flexible connectivity to sensors, actuators, and host controllers.
MSP430FR4133IPM Advantages vs Typical Alternatives
The device offers faster, more durable nonvolatile memory through FRAM, giving more write cycles and quicker write times compared with flash?based alternatives. Lower active and standby currents yield better energy efficiency for battery?driven systems. Integrated 12?bit analog and flexible eUSCI serial modules reduce BOM and board area versus MCU solutions that require external ADCs or interface bridges. Compact packaging and a proven 16?bit core make it a cost?effective choice for space?constrained industrial designs.
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MSP430FR4133IPM Brand Info
The MSP430FR4133IPM is part of the MSP430 family from Texas Instruments, a semiconductor leader known for low?power microcontrollers and analog integration. The family emphasizes energy efficiency, FRAM reliability and broad peripheral support for industrial and portable applications.
FAQ
What memory type does it use?
The device uses FRAM (ferroelectric RAM) as its nonvolatile memory technology. FRAM provides faster write cycles and higher endurance compared with traditional flash memory, making it suitable for frequent configuration updates and data logging.
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What voltage range is supported?
It operates from 1.8 V to 3.6 V, allowing direct interfacing with common battery chemistries and 3.3 V systems while maintaining reliable peripheral and logic operation across that range.
Which serial interfaces are available?
The MCU includes enhanced USCI (eUSCI) modules that support UART, SPI and I2C modes. This flexible serial support reduces the need for external interface ICs when connecting sensors, memory or wireless transceivers.
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Is it suitable for low?power designs?
Yes, the product is designed for ultra?low power operation with multiple low?power modes and efficient active mode performance, improving battery life in portable and remote applications.
What package options exist?
It is offered in compact QFN/VQFN style packages that deliver a small PCB footprint while exposing sufficient I/O for typical embedded control and sensor interface tasks.



