QCC-744-2-MQFN56-TR-01-0 Bluetooth Audio SoC, MQFN56 Package

QCC-744-2-MQFN56-TR-01-0 Overview

The QCC-744-2-MQFN56-TR-01-0 is a 56-pin surface-mount integrated circuit in a compact MQFN package. The part code indicates a 744 series device with a -2 variant and a -01-0 revision identifier, supplied on tape-and-reel for automated SMT lines. Use this item when you need a smaller footprint, consistent reel packaging and clear revision control. For sourcing and ordering reference use the manufacturer’s distribution channel at IC Manufacturer.

QCC-744-2-MQFN56-TR-01-0 Technical Specifications

QCC-744-2-MQFN56-TR-01-0 Key Features

• Compact MQFN-56 package for higher board density and lower profile compared to larger QFN or BGA options.
• Tape-and-reel packaging to support high-volume SMT placement and shorter machine setup times than bulk-packed parts.
• Clear numeric revision and variant identifiers (-2, 01-0) for traceability and assembly control across production runs.
• Surface-mount format enables automated pick-and-place and reflow assembly for faster throughput versus through-hole alternatives.

Typical Applications

• Compact consumer or industrial modules where a 56-pin MQFN footprint reduces board area and enables denser PCB layouts for space-constrained products.
• High-volume SMT manufacturing flows that require tape-and-reel components to minimize manual handling and maintain consistent placement rates on pick-and-place equipment.
• Prototype-to-production workflows that benefit from explicit revision and variant marking (-2, 01-0) to control firmware and BOM traceability during iterative development.
• Embedded subsystems where surface-mount, low-profile packaging improves thermal path and mechanical stability compared with taller packaged ICs in the same class.

QCC-744-2-MQFN56-TR-01-0 Advantages vs Typical Alternatives

The MQFN-56 format delivers a smaller footprint and lower profile compared with larger QFN or BGA packages, helping reduce PCB area by measurable amounts. Supplied on tape-and-reel, this device supports faster machine placement and reduced downtime versus cut-tape or tray packaging. The explicit series, variant and revision codes provide better production-level traceability and fewer sourcing ambiguities than generic part numbers.

QCC-744-2-MQFN56-TR-01-0 Brand Info

The QCC prefix is associated with established semiconductor suppliers focused on connectivity and system-level ICs. The brand voice for this series emphasizes reliability, volume production readiness and integration into compact PCB designs. Use authorized distribution channels and documentation from the vendor to confirm device-specific electrical and mechanical characteristics.

FAQ

What does MQFN-56 mean?

MQFN-56 denotes a molded quad flat no-lead package with 56 electrical contacts arranged for surface mounting. It implies a low-profile, thermally conductive body suitable for automated PCB assembly processes.

Is this part supplied for SMT lines?

Yes. The TR suffix indicates tape-and-reel packaging which is optimized for pick-and-place operations in automated surface-mount technology production lines and minimizes manual handling.

How are variant and revision codes used?

The tokens -2 and -01-0 identify the specific variant and revision of the part. These codes aid in BOM control, firmware matching and traceability across design iterations and production batches.

Can I use standard MQFN land patterns?

Designers typically use standardized MQFN land patterns as a starting point. Confirm exact mechanical drawing and recommended footprint from the vendor datasheet to meet solder fillet and thermal requirements.

Where should I get technical documentation?

Obtain complete mechanical drawings, PCB land-pattern recommendations and electrical specifications from the manufacturer’s datasheet and authorized distributors to ensure accurate layout and reliability in production.