QCC-743M-1-LGM36-MT-01-0-AA Overview
The QCC-743M-1-LGM36-MT-01-0-AA is a high-performance semiconductor device engineered for advanced industrial applications. Designed with precision and reliability, this component offers robust operational characteristics suitable for demanding electronic systems. Its optimized architecture ensures efficient power management and signal integrity, making it ideal for integration in complex circuits. Manufactured by IC Manufacturer, the product delivers consistent performance, enhanced durability, and streamlined installation, meeting industry standards for quality and longevity.
QCC-743M-1-LGM36-MT-01-0-AA Technical Specifications
| Parameter | Specification |
|---|---|
| Package Type | LGM36 (36-pin Land Grid Array) |
| Core Count | Single-core |
| Operating Temperature Range | -40??C to +85??C |
| Supply Voltage | 3.3 V ?? 5% |
| Power Consumption | Max 150 mW |
| Interface Type | SPI (Serial Peripheral Interface) |
| Maximum Clock Frequency | 36 MHz |
| Mounting Style | Surface Mount Technology (SMT) |
| MTBF (Mean Time Between Failures) | >1,000,000 hours |
QCC-743M-1-LGM36-MT-01-0-AA Key Features
- Single-core processing delivers streamlined performance for efficient signal handling, reducing latency in critical industrial control systems.
- 36-pin LGM package enables compact PCB layouts and robust mechanical stability, facilitating high-density integration.
- Wide operating temperature range ensures reliable operation in harsh environments, critical for industrial and automation applications.
- Low power consumption optimizes thermal management and energy efficiency, extending system longevity and reducing cooling requirements.
- SPI interface compatibility supports fast and flexible communication with microcontrollers and other digital devices, simplifying system design.
- High MTBF rating guarantees long-term reliability, minimizing downtime and maintenance costs.
QCC-743M-1-LGM36-MT-01-0-AA Advantages vs Typical Alternatives
This device offers superior integration with a 36-pin LGM package that balances size and connectivity better than traditional packages. Its low power consumption and wide temperature tolerance provide enhanced reliability and efficiency over typical alternatives. The single-core architecture simplifies processing with consistent performance, reducing system complexity and cost.
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Typical Applications
- Industrial automation control units requiring reliable performance under extended temperature ranges and power efficiency.
- Embedded systems where compact footprint and SPI communication are essential for integration.
- Signal processing modules in manufacturing equipment that demand stable operation and low latency.
- Power management circuits in industrial electronics benefiting from low energy consumption and heat generation.
QCC-743M-1-LGM36-MT-01-0-AA Brand Info
The product is developed and manufactured by a reputable IC Manufacturer, a leader in semiconductor innovation for industrial technology. This semiconductor device exemplifies the company??s commitment to delivering quality, performance, and durability. It is engineered to meet stringent industrial standards, providing customers reliable components that enhance system efficiency and operational lifespan.
FAQ
What is the maximum operating temperature for this device?
The device supports an operating temperature range from -40??C to +85??C, making it suitable for a wide variety of industrial environments that experience extreme temperature variations.
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Which communication interface does this component use?
This product utilizes a Serial Peripheral Interface (SPI), which enables fast, synchronous data transfer with microcontrollers and other digital components commonly used in industrial systems.
What type of package does the device come in?
It is housed in a 36-pin Land Grid Array (LGM36) package, offering a compact footprint and high pin count for reliable electrical connections and efficient PCB layout.
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How does the power consumption of this device affect system design?
With a maximum power consumption of 150 mW, this device minimizes heat generation and energy usage, allowing designers to implement simpler thermal management solutions and improve overall system efficiency.
Is this component suitable for surface mount assembly?
Yes, the device is designed for Surface Mount Technology (SMT), which supports automated manufacturing processes and ensures stable mechanical mounting on modern PCBs.
